KR970006530B1 - 다이오우드용 리이드핀 및 그 제조방법 - Google Patents

다이오우드용 리이드핀 및 그 제조방법 Download PDF

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Publication number
KR970006530B1
KR970006530B1 KR1019930001247A KR930001247A KR970006530B1 KR 970006530 B1 KR970006530 B1 KR 970006530B1 KR 1019930001247 A KR1019930001247 A KR 1019930001247A KR 930001247 A KR930001247 A KR 930001247A KR 970006530 B1 KR970006530 B1 KR 970006530B1
Authority
KR
South Korea
Prior art keywords
lead pin
diode
header
solder piece
header surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930001247A
Other languages
English (en)
Korean (ko)
Other versions
KR930020750A (ko
Inventor
히데오 마쯔다
Original Assignee
토오요오산교오 카부시키가이샤
히데오 마쯔다
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토오요오산교오 카부시키가이샤, 히데오 마쯔다 filed Critical 토오요오산교오 카부시키가이샤
Publication of KR930020750A publication Critical patent/KR930020750A/ko
Application granted granted Critical
Publication of KR970006530B1 publication Critical patent/KR970006530B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019930001247A 1992-03-17 1993-01-30 다이오우드용 리이드핀 및 그 제조방법 Expired - Fee Related KR970006530B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-91766 1992-03-17
JP4091766A JPH0812891B2 (ja) 1992-03-17 1992-03-17 半田片付きダイオード用リードピンおよびその製造方法

Publications (2)

Publication Number Publication Date
KR930020750A KR930020750A (ko) 1993-10-20
KR970006530B1 true KR970006530B1 (ko) 1997-04-29

Family

ID=14035686

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930001247A Expired - Fee Related KR970006530B1 (ko) 1992-03-17 1993-01-30 다이오우드용 리이드핀 및 그 제조방법

Country Status (3)

Country Link
JP (1) JPH0812891B2 (https=)
KR (1) KR970006530B1 (https=)
TW (1) TW234779B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198479A (ja) * 2000-12-27 2002-07-12 Nippon Inter Electronics Corp アキシャルリード型半導体装置
JP7341345B2 (ja) 2020-06-30 2023-09-08 三菱電機株式会社 端子部材、集合体、半導体装置およびこれらの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555721A (en) * 1978-06-27 1980-01-16 Kawasaki Steel Corp Detecting method for clogging of nozzle

Also Published As

Publication number Publication date
JPH05267516A (ja) 1993-10-15
JPH0812891B2 (ja) 1996-02-07
KR930020750A (ko) 1993-10-20
TW234779B (https=) 1994-11-21

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