KR960704978A - 폴리아미드 수지를 함유하는 경화성 접착제 조성물(Curable Adhesive Compositions Containing Polyamide Resins) - Google Patents
폴리아미드 수지를 함유하는 경화성 접착제 조성물(Curable Adhesive Compositions Containing Polyamide Resins)Info
- Publication number
- KR960704978A KR960704978A KR1019960701609A KR19960701609A KR960704978A KR 960704978 A KR960704978 A KR 960704978A KR 1019960701609 A KR1019960701609 A KR 1019960701609A KR 19960701609 A KR19960701609 A KR 19960701609A KR 960704978 A KR960704978 A KR 960704978A
- Authority
- KR
- South Korea
- Prior art keywords
- polyamide resin
- piperazine
- equivalents
- acid
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract 19
- 239000000203 mixture Substances 0.000 title claims abstract 5
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims abstract 30
- 239000002253 acid Substances 0.000 claims abstract 15
- 150000001412 amines Chemical class 0.000 claims abstract 14
- 150000004985 diamines Chemical class 0.000 claims abstract 13
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims abstract 6
- 239000003822 epoxy resin Substances 0.000 claims abstract 3
- 229920000647 polyepoxide Polymers 0.000 claims abstract 3
- 229920000642 polymer Polymers 0.000 claims 10
- 239000006185 dispersion Substances 0.000 claims 5
- 229920000768 polyamine Polymers 0.000 claims 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 4
- 150000002763 monocarboxylic acids Chemical class 0.000 claims 4
- -1 1-piperazinyl Chemical group 0.000 claims 3
- 239000007859 condensation product Substances 0.000 claims 3
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 3
- 235000014113 dietary fatty acids Nutrition 0.000 claims 3
- 229930195729 fatty acid Natural products 0.000 claims 3
- 239000000194 fatty acid Substances 0.000 claims 3
- 150000004665 fatty acids Chemical class 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 239000004094 surface-active agent Substances 0.000 claims 3
- UWUIILCRSFTQJN-UHFFFAOYSA-N 1-(1-piperazin-1-ylpropan-2-yl)piperazine Chemical compound C1CNCCN1C(C)CN1CCNCC1 UWUIILCRSFTQJN-UHFFFAOYSA-N 0.000 claims 2
- DOJHEVQGYQYOSP-UHFFFAOYSA-N 1-(3-piperazin-1-ylpropyl)piperazine Chemical compound C1CNCCN1CCCN1CCNCC1 DOJHEVQGYQYOSP-UHFFFAOYSA-N 0.000 claims 2
- WFCSWCVEJLETKA-UHFFFAOYSA-N 2-piperazin-1-ylethanol Chemical compound OCCN1CCNCC1 WFCSWCVEJLETKA-UHFFFAOYSA-N 0.000 claims 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 125000004193 piperazinyl group Chemical group 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 239000007762 w/o emulsion Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- XDHVNMPVLPEHND-UHFFFAOYSA-N 1-(2-piperazin-1-ylethyl)piperazine Chemical compound C1CNCCN1CCN1CCNCC1 XDHVNMPVLPEHND-UHFFFAOYSA-N 0.000 claims 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 claims 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 239000002280 amphoteric surfactant Substances 0.000 claims 1
- 125000000129 anionic group Chemical group 0.000 claims 1
- 239000003945 anionic surfactant Substances 0.000 claims 1
- 125000002091 cationic group Chemical group 0.000 claims 1
- 239000003093 cationic surfactant Substances 0.000 claims 1
- 239000002736 nonionic surfactant Substances 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 239000001294 propane Substances 0.000 claims 1
- 229920006345 thermoplastic polyamide Polymers 0.000 claims 1
- 150000007513 acids Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
- C08F8/32—Introducing nitrogen atoms or nitrogen-containing groups by reaction with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/32—Polymerisation in water-in-oil emulsions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/34—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids using polymerised unsaturated fatty acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
- C08L77/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
- C09J177/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Polyamides (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paper (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12839293A | 1993-09-28 | 1993-09-28 | |
| US128,392 | 1993-09-28 | ||
| PCT/US1994/009971 WO1995009189A1 (en) | 1993-09-28 | 1994-09-06 | Curable adhesive compositions containing polyamide resins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR960704978A true KR960704978A (ko) | 1996-10-09 |
Family
ID=22435147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960701609A Abandoned KR960704978A (ko) | 1993-09-28 | 1994-09-06 | 폴리아미드 수지를 함유하는 경화성 접착제 조성물(Curable Adhesive Compositions Containing Polyamide Resins) |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5612448A (enExample) |
| EP (1) | EP0721473A4 (enExample) |
| JP (1) | JP3491836B2 (enExample) |
| KR (1) | KR960704978A (enExample) |
| BR (1) | BR9407670A (enExample) |
| TW (1) | TW321662B (enExample) |
| WO (1) | WO1995009189A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2224323A1 (en) * | 1995-06-12 | 1996-12-27 | Union Camp Corporation | Method of improving block resistance of adhesive compositions |
| US5962629A (en) * | 1995-11-16 | 1999-10-05 | Shell Oil Company | Amine-terminated polyamide in oil-in-water emulsion |
| US5948709A (en) * | 1998-04-10 | 1999-09-07 | National Starch And Chemical Investment Holding Corporation | Oil resistant polyamide based adhesive |
| US6136944A (en) * | 1998-09-21 | 2000-10-24 | Shell Oil Company | Adhesive of epoxy resin, amine-terminated polyamide and polyamine |
| JP2000192013A (ja) * | 1998-12-28 | 2000-07-11 | Minnesota Mining & Mfg Co <3M> | シ―ラント組成物及びそれを用いたシ―ラント物品 |
| US6489023B1 (en) | 1998-12-28 | 2002-12-03 | 3M Innovative Properties Company | Sealant compositions and sealant articles using the same |
| WO2000058025A1 (en) * | 1999-03-30 | 2000-10-05 | Cognis Corporation | Scuff and bloom resistant polyamide resin compositions |
| US6500912B1 (en) | 2000-09-12 | 2002-12-31 | Resolution Performance Products Llc | Epoxy resin system |
| US6956099B2 (en) * | 2003-03-20 | 2005-10-18 | Arizona Chemical Company | Polyamide-polyether block copolymer |
| JP2005126562A (ja) * | 2003-10-23 | 2005-05-19 | Sumitomo Seika Chem Co Ltd | 熱融着用接着剤および接着布 |
| WO2006044970A1 (en) * | 2004-10-18 | 2006-04-27 | Arizona Chemical Company | Teak deck caulking |
| JP2006169456A (ja) * | 2004-12-20 | 2006-06-29 | Daicel Degussa Ltd | ゴム接着用ホットメルト接着剤およびこの接着剤を用いた接着方法 |
| TR201901806T4 (tr) * | 2006-03-24 | 2019-03-21 | Henkel IP & Holding GmbH | Poli̇ami̇dler. |
| EP2053093B1 (en) * | 2006-08-18 | 2017-06-28 | Sumitomo Seika Chemicals CO. LTD. | Aqueous dispersion of polyamide rubber elastic body and method for producing the same |
| JP2010511082A (ja) * | 2006-11-29 | 2010-04-08 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | ホットメルト接着剤からの成形品 |
| US20080223519A1 (en) * | 2006-12-06 | 2008-09-18 | Locko George A | Polyamide polyols and polyurethanes, methods for making and using, and products made therefrom |
| JP5428306B2 (ja) * | 2008-06-26 | 2014-02-26 | 東亞合成株式会社 | 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板 |
| DE102008046873A1 (de) * | 2008-09-11 | 2010-03-18 | Tesa Se | Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
| US8820907B2 (en) * | 2008-12-12 | 2014-09-02 | E I Du Pont De Nemours And Company | Amphoteric dispersants and their use in inkjet inks |
| EP2298830B1 (de) * | 2009-09-18 | 2011-11-09 | Henkel AG & Co. KGaA | Hydrolysestabile Polyamide |
| EP2415838B1 (en) * | 2010-08-06 | 2017-03-01 | Henkel AG & Co. KGaA | Composite material containing natural fibers |
| WO2012140740A1 (ja) * | 2011-04-12 | 2012-10-18 | 日立化成工業株式会社 | 粘着剤組成物及びそれを用いた粘着材、並びにそれらの使用方法 |
| JP6416756B2 (ja) | 2012-06-13 | 2018-10-31 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | アミノ酸熱安定剤を含む熱可塑性溶融混合組成物 |
| US8871874B2 (en) | 2012-06-13 | 2014-10-28 | E I Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation |
| WO2013188323A1 (en) | 2012-06-13 | 2013-12-19 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with polyetherol heat stabilizer |
| FR2996559B1 (fr) * | 2012-10-04 | 2016-05-20 | Arkema France | Composition et procede d'adhesion sans solvant sur elastomere a base d'acrylonitrile |
| JP6226649B2 (ja) * | 2013-09-05 | 2017-11-08 | 住友精化株式会社 | 熱融着接着剤 |
| KR20180029224A (ko) * | 2015-07-09 | 2018-03-20 | 헨켈 아이피 앤드 홀딩 게엠베하 | 저점도 투명 폴리아미드 |
| WO2018237377A1 (en) * | 2017-06-24 | 2018-12-27 | Designer Molecules, Inc | CURABLE POLYIMIDES |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL83856C (enExample) * | 1952-03-11 | 1900-01-01 | ||
| US2881194A (en) * | 1955-10-11 | 1959-04-07 | Gen Mills Inc | Polyamide resin process and product |
| US2930773A (en) * | 1956-01-30 | 1960-03-29 | Gen Mills Inc | Novel composition and method of curing epoxy resins |
| US2999826A (en) * | 1958-12-24 | 1961-09-12 | Gen Mills Inc | Reaction product of epoxy resins and polyamides from blends of aliphatic polyamines and aromatic polyamines |
| US3408317A (en) * | 1964-10-19 | 1968-10-29 | Gen Mills Inc | Low melting polyamide resin of fractionated polymeric fat acids and a mixture of ethylene diamine and diaminopropane |
| US3377303A (en) * | 1966-05-03 | 1968-04-09 | Gen Mills Inc | Polyamide composition |
| US4082708A (en) * | 1976-09-20 | 1978-04-04 | H. B. Fuller Company | Adhesive systems comprising a bisamino piperazine-containing polyamide |
| FR2471394A1 (fr) * | 1979-12-10 | 1981-06-19 | Rhone Poulenc Ind | Copolyesteramides souples a basse temperature |
| DE3248776A1 (de) * | 1982-12-31 | 1984-07-12 | Chemische Werke Hüls AG, 4370 Marl | Verwendung von copolyamiden zum heisssiegeln von textilien |
| US4485233A (en) * | 1984-02-27 | 1984-11-27 | Union Camp Corporation | Poly(ester-amide) hot-melt adhesives |
| US5025043A (en) * | 1988-02-03 | 1991-06-18 | Union Camp Corporation | Polymerized fatty acid polyamide resin dispersions and method for the manufacture thereof |
| US4886844A (en) * | 1988-02-03 | 1989-12-12 | Union Camp Corporation | Polyamide resin dispersions and method for the manufacture thereof |
| US4853460A (en) * | 1988-03-24 | 1989-08-01 | Union Camp Corporation | Long open assembly time vinyl-bonding polyamide from dimer acid |
| DE69115947T2 (de) * | 1990-02-14 | 1996-05-23 | Union Camp Corp | Härtbare, in der Wärme schmelzende Zweikomponentenharzmassen |
| TW200515B (enExample) * | 1991-05-02 | 1993-02-21 | Union Camp Corp | |
| US5236996A (en) | 1991-07-24 | 1993-08-17 | Union Camp Corporation | Stable polyamide resin dispersions containing piperasine and methods for the manufacture thereof |
-
1994
- 1994-09-06 BR BR9407670A patent/BR9407670A/pt not_active Application Discontinuation
- 1994-09-06 KR KR1019960701609A patent/KR960704978A/ko not_active Abandoned
- 1994-09-06 JP JP51031895A patent/JP3491836B2/ja not_active Expired - Fee Related
- 1994-09-06 EP EP94926680A patent/EP0721473A4/en not_active Withdrawn
- 1994-09-06 WO PCT/US1994/009971 patent/WO1995009189A1/en not_active Ceased
- 1994-09-22 TW TW083108721A patent/TW321662B/zh active
-
1995
- 1995-04-21 US US08/426,448 patent/US5612448A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| BR9407670A (pt) | 1997-01-28 |
| JPH09503018A (ja) | 1997-03-25 |
| JP3491836B2 (ja) | 2004-01-26 |
| EP0721473A4 (en) | 1996-09-25 |
| EP0721473A1 (en) | 1996-07-17 |
| TW321662B (enExample) | 1997-12-01 |
| WO1995009189A1 (en) | 1995-04-06 |
| US5612448A (en) | 1997-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 19960328 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19990906 Comment text: Request for Examination of Application |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20010928 |
|
| NORF | Unpaid initial registration fee | ||
| PC1904 | Unpaid initial registration fee |