BR9407670A - Resina de poliamida composiçao curável de dois componentes dispersao aquosa estável de particulas de resina de poliamida em água - Google Patents

Resina de poliamida composiçao curável de dois componentes dispersao aquosa estável de particulas de resina de poliamida em água

Info

Publication number
BR9407670A
BR9407670A BR9407670A BR9407670A BR9407670A BR 9407670 A BR9407670 A BR 9407670A BR 9407670 A BR9407670 A BR 9407670A BR 9407670 A BR9407670 A BR 9407670A BR 9407670 A BR9407670 A BR 9407670A
Authority
BR
Brazil
Prior art keywords
polyamide resin
water
aqueous dispersion
component composition
stable aqueous
Prior art date
Application number
BR9407670A
Other languages
English (en)
Inventor
Charles R Frihart
Original Assignee
Union Camp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Camp Corp filed Critical Union Camp Corp
Publication of BR9407670A publication Critical patent/BR9407670A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
    • C08F8/32—Introducing nitrogen atoms or nitrogen-containing groups by reaction with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/32—Polymerisation in water-in-oil emulsions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/34—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids using polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C08L77/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C09J177/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paper (AREA)
BR9407670A 1993-09-28 1994-09-06 Resina de poliamida composiçao curável de dois componentes dispersao aquosa estável de particulas de resina de poliamida em água BR9407670A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12839293A 1993-09-28 1993-09-28
PCT/US1994/009971 WO1995009189A1 (en) 1993-09-28 1994-09-06 Curable adhesive compositions containing polyamide resins

Publications (1)

Publication Number Publication Date
BR9407670A true BR9407670A (pt) 1997-01-28

Family

ID=22435147

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9407670A BR9407670A (pt) 1993-09-28 1994-09-06 Resina de poliamida composiçao curável de dois componentes dispersao aquosa estável de particulas de resina de poliamida em água

Country Status (7)

Country Link
US (1) US5612448A (pt)
EP (1) EP0721473A4 (pt)
JP (1) JP3491836B2 (pt)
KR (1) KR960704978A (pt)
BR (1) BR9407670A (pt)
TW (1) TW321662B (pt)
WO (1) WO1995009189A1 (pt)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0847423A4 (en) * 1995-06-12 1998-09-09 METHOD FOR IMPROVING ADHESION RESISTANCE BY CONTACT OF ADHESIVE COMPOSITIONS
US5962629A (en) * 1995-11-16 1999-10-05 Shell Oil Company Amine-terminated polyamide in oil-in-water emulsion
US5948709A (en) * 1998-04-10 1999-09-07 National Starch And Chemical Investment Holding Corporation Oil resistant polyamide based adhesive
US6136944A (en) * 1998-09-21 2000-10-24 Shell Oil Company Adhesive of epoxy resin, amine-terminated polyamide and polyamine
US6489023B1 (en) 1998-12-28 2002-12-03 3M Innovative Properties Company Sealant compositions and sealant articles using the same
JP2000192013A (ja) * 1998-12-28 2000-07-11 Minnesota Mining & Mfg Co <3M> シ―ラント組成物及びそれを用いたシ―ラント物品
WO2000058025A1 (en) * 1999-03-30 2000-10-05 Cognis Corporation Scuff and bloom resistant polyamide resin compositions
US6500912B1 (en) 2000-09-12 2002-12-31 Resolution Performance Products Llc Epoxy resin system
US6956099B2 (en) * 2003-03-20 2005-10-18 Arizona Chemical Company Polyamide-polyether block copolymer
JP2005126562A (ja) * 2003-10-23 2005-05-19 Sumitomo Seika Chem Co Ltd 熱融着用接着剤および接着布
WO2006044970A1 (en) * 2004-10-18 2006-04-27 Arizona Chemical Company Teak deck caulking
JP2006169456A (ja) * 2004-12-20 2006-06-29 Daicel Degussa Ltd ゴム接着用ホットメルト接着剤およびこの接着剤を用いた接着方法
DK1999184T3 (en) 2006-03-24 2019-03-04 Henkel IP & Holding GmbH polyamides
WO2008020520A1 (en) * 2006-08-18 2008-02-21 Sumitomo Seika Chemicals Co., Ltd. Aqueous dispersion of polyamide rubber elastic body and method for producing the same
CA2671011A1 (en) * 2006-11-29 2008-06-05 Henkel Ag & Co. Kgaa Molded parts from hot melt adhesives
US20080223519A1 (en) * 2006-12-06 2008-09-18 Locko George A Polyamide polyols and polyurethanes, methods for making and using, and products made therefrom
JP5428306B2 (ja) * 2008-06-26 2014-02-26 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
DE102008046873A1 (de) * 2008-09-11 2010-03-18 Tesa Se Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
JP5576393B2 (ja) * 2008-12-12 2014-08-20 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 両性分散剤およびインクジェットインクにおけるその使用
EP2298830B1 (de) * 2009-09-18 2011-11-09 Henkel AG & Co. KGaA Hydrolysestabile Polyamide
SI2415838T1 (sl) * 2010-08-06 2017-07-31 Henkel Ag & Co. Kgaa Kompozitni material, ki vsebuje naravna vlakna
WO2012140740A1 (ja) * 2011-04-12 2012-10-18 日立化成工業株式会社 粘着剤組成物及びそれを用いた粘着材、並びにそれらの使用方法
EP2861660B1 (en) 2012-06-13 2018-09-05 E. I. du Pont de Nemours and Company Thermoplastic melt-mixed composition with amino acid heat stabilizer
US8871874B2 (en) 2012-06-13 2014-10-28 E I Du Pont De Nemours And Company Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation
WO2013188323A1 (en) 2012-06-13 2013-12-19 E. I. Du Pont De Nemours And Company Thermoplastic melt-mixed composition with polyetherol heat stabilizer
FR2996559B1 (fr) * 2012-10-04 2016-05-20 Arkema France Composition et procede d'adhesion sans solvant sur elastomere a base d'acrylonitrile
JP6226649B2 (ja) * 2013-09-05 2017-11-08 住友精化株式会社 熱融着接着剤
CN111108144A (zh) * 2017-06-24 2020-05-05 设计分子有限公司 可固化的聚酰亚胺

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE518342A (pt) * 1952-03-11 1900-01-01
US2881194A (en) * 1955-10-11 1959-04-07 Gen Mills Inc Polyamide resin process and product
US2930773A (en) * 1956-01-30 1960-03-29 Gen Mills Inc Novel composition and method of curing epoxy resins
US2999826A (en) * 1958-12-24 1961-09-12 Gen Mills Inc Reaction product of epoxy resins and polyamides from blends of aliphatic polyamines and aromatic polyamines
US3408317A (en) * 1964-10-19 1968-10-29 Gen Mills Inc Low melting polyamide resin of fractionated polymeric fat acids and a mixture of ethylene diamine and diaminopropane
US3377303A (en) * 1966-05-03 1968-04-09 Gen Mills Inc Polyamide composition
US4082708A (en) * 1976-09-20 1978-04-04 H. B. Fuller Company Adhesive systems comprising a bisamino piperazine-containing polyamide
FR2471394A1 (fr) * 1979-12-10 1981-06-19 Rhone Poulenc Ind Copolyesteramides souples a basse temperature
DE3248776A1 (de) * 1982-12-31 1984-07-12 Chemische Werke Hüls AG, 4370 Marl Verwendung von copolyamiden zum heisssiegeln von textilien
US4485233A (en) * 1984-02-27 1984-11-27 Union Camp Corporation Poly(ester-amide) hot-melt adhesives
US4886844A (en) * 1988-02-03 1989-12-12 Union Camp Corporation Polyamide resin dispersions and method for the manufacture thereof
US5025043A (en) * 1988-02-03 1991-06-18 Union Camp Corporation Polymerized fatty acid polyamide resin dispersions and method for the manufacture thereof
US4853460A (en) * 1988-03-24 1989-08-01 Union Camp Corporation Long open assembly time vinyl-bonding polyamide from dimer acid
EP0442700B1 (en) * 1990-02-14 1996-01-03 Union Camp Corporation Two-component curable hot-melt resin compositions
TW200515B (pt) * 1991-05-02 1993-02-21 Union Camp Corp
US5236996A (en) * 1991-07-24 1993-08-17 Union Camp Corporation Stable polyamide resin dispersions containing piperasine and methods for the manufacture thereof

Also Published As

Publication number Publication date
EP0721473A4 (en) 1996-09-25
KR960704978A (ko) 1996-10-09
JPH09503018A (ja) 1997-03-25
EP0721473A1 (en) 1996-07-17
JP3491836B2 (ja) 2004-01-26
US5612448A (en) 1997-03-18
TW321662B (pt) 1997-12-01
WO1995009189A1 (en) 1995-04-06

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Legal Events

Date Code Title Description
FB36 Technical and formal requirements: requirement - article 36 of industrial property law
FA8 Dismissal: dismissal - article 36, par. 1 of industrial property law