KR960043037A - 접촉식 서머척 및 그 제조방법 - Google Patents

접촉식 서머척 및 그 제조방법 Download PDF

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Publication number
KR960043037A
KR960043037A KR1019950013696A KR19950013696A KR960043037A KR 960043037 A KR960043037 A KR 960043037A KR 1019950013696 A KR1019950013696 A KR 1019950013696A KR 19950013696 A KR19950013696 A KR 19950013696A KR 960043037 A KR960043037 A KR 960043037A
Authority
KR
South Korea
Prior art keywords
wafer
chuck
anodization film
flaking
anodization
Prior art date
Application number
KR1019950013696A
Other languages
English (en)
Korean (ko)
Inventor
임가순
심경보
강병진
김상원
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950013696A priority Critical patent/KR960043037A/ko
Priority to DE19531699A priority patent/DE19531699A1/de
Priority to GB9517702A priority patent/GB2301480A/en
Priority to CN95116697A priority patent/CN1139766A/zh
Priority to TW084109048A priority patent/TW344087B/zh
Priority to JP26885495A priority patent/JPH08330399A/ja
Publication of KR960043037A publication Critical patent/KR960043037A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Resistance Heating (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1019950013696A 1995-05-29 1995-05-29 접촉식 서머척 및 그 제조방법 KR960043037A (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1019950013696A KR960043037A (ko) 1995-05-29 1995-05-29 접촉식 서머척 및 그 제조방법
DE19531699A DE19531699A1 (de) 1995-05-29 1995-08-29 Thermo-Waferhaltevorrichtung vom Kontakttyp und Verfahren zu ihrer Herstellung
GB9517702A GB2301480A (en) 1995-05-29 1995-08-30 Thermo chuck for mounting wafers
CN95116697A CN1139766A (zh) 1995-05-29 1995-08-30 接触型热卡盘及其制造方法
TW084109048A TW344087B (en) 1995-05-29 1995-08-30 Contact-type thermo chuck and fabricating method therefor
JP26885495A JPH08330399A (ja) 1995-05-29 1995-10-17 接触式サーモチャック及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950013696A KR960043037A (ko) 1995-05-29 1995-05-29 접촉식 서머척 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR960043037A true KR960043037A (ko) 1996-12-21

Family

ID=19415762

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950013696A KR960043037A (ko) 1995-05-29 1995-05-29 접촉식 서머척 및 그 제조방법

Country Status (6)

Country Link
JP (1) JPH08330399A (zh)
KR (1) KR960043037A (zh)
CN (1) CN1139766A (zh)
DE (1) DE19531699A1 (zh)
GB (1) GB2301480A (zh)
TW (1) TW344087B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100695203B1 (ko) * 2006-07-31 2007-03-16 안병돈 내부에 지지심을 갖는 기판 이송롤러용 샤프트

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW303505B (en) * 1996-05-08 1997-04-21 Applied Materials Inc Substrate support chuck having a contaminant containment layer and method of fabricating same
JP4614416B2 (ja) * 2003-05-29 2011-01-19 日東電工株式会社 半導体チップの製造方法およびダイシング用シート貼付け装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
JPS6059104B2 (ja) * 1982-02-03 1985-12-23 株式会社東芝 静電チヤツク板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100695203B1 (ko) * 2006-07-31 2007-03-16 안병돈 내부에 지지심을 갖는 기판 이송롤러용 샤프트

Also Published As

Publication number Publication date
TW344087B (en) 1998-11-01
CN1139766A (zh) 1997-01-08
DE19531699A1 (de) 1996-12-05
JPH08330399A (ja) 1996-12-13
GB2301480A (en) 1996-12-04
GB9517702D0 (en) 1995-11-01

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Legal Events

Date Code Title Description
A201 Request for examination
WITB Written withdrawal of application