TW344087B - Contact-type thermo chuck and fabricating method therefor - Google Patents

Contact-type thermo chuck and fabricating method therefor

Info

Publication number
TW344087B
TW344087B TW084109048A TW84109048A TW344087B TW 344087 B TW344087 B TW 344087B TW 084109048 A TW084109048 A TW 084109048A TW 84109048 A TW84109048 A TW 84109048A TW 344087 B TW344087 B TW 344087B
Authority
TW
Taiwan
Prior art keywords
contact
method therefor
type thermo
fabricating method
thermo chuck
Prior art date
Application number
TW084109048A
Other languages
English (en)
Inventor
Yim Ka-Soon
Sim Kyung-Bo
Kang Byung-Jin
Kim Sang-Won
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW344087B publication Critical patent/TW344087B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Resistance Heating (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW084109048A 1995-05-29 1995-08-30 Contact-type thermo chuck and fabricating method therefor TW344087B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950013696A KR960043037A (ko) 1995-05-29 1995-05-29 접촉식 서머척 및 그 제조방법

Publications (1)

Publication Number Publication Date
TW344087B true TW344087B (en) 1998-11-01

Family

ID=19415762

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084109048A TW344087B (en) 1995-05-29 1995-08-30 Contact-type thermo chuck and fabricating method therefor

Country Status (6)

Country Link
JP (1) JPH08330399A (zh)
KR (1) KR960043037A (zh)
CN (1) CN1139766A (zh)
DE (1) DE19531699A1 (zh)
GB (1) GB2301480A (zh)
TW (1) TW344087B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW303505B (en) * 1996-05-08 1997-04-21 Applied Materials Inc Substrate support chuck having a contaminant containment layer and method of fabricating same
JP4614416B2 (ja) * 2003-05-29 2011-01-19 日東電工株式会社 半導体チップの製造方法およびダイシング用シート貼付け装置
KR100695203B1 (ko) * 2006-07-31 2007-03-16 안병돈 내부에 지지심을 갖는 기판 이송롤러용 샤프트

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
JPS6059104B2 (ja) * 1982-02-03 1985-12-23 株式会社東芝 静電チヤツク板

Also Published As

Publication number Publication date
JPH08330399A (ja) 1996-12-13
GB2301480A (en) 1996-12-04
CN1139766A (zh) 1997-01-08
DE19531699A1 (de) 1996-12-05
KR960043037A (ko) 1996-12-21
GB9517702D0 (en) 1995-11-01

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