GB9517702D0 - Contact-type thermo chuck and fabricating method therefor - Google Patents
Contact-type thermo chuck and fabricating method thereforInfo
- Publication number
- GB9517702D0 GB9517702D0 GBGB9517702.8A GB9517702A GB9517702D0 GB 9517702 D0 GB9517702 D0 GB 9517702D0 GB 9517702 A GB9517702 A GB 9517702A GB 9517702 D0 GB9517702 D0 GB 9517702D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- contact
- method therefor
- fabricating method
- type thermo
- thermo chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950013696A KR960043037A (en) | 1995-05-29 | 1995-05-29 | Contact type thermostatic chuck and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9517702D0 true GB9517702D0 (en) | 1995-11-01 |
| GB2301480A GB2301480A (en) | 1996-12-04 |
Family
ID=19415762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9517702A Withdrawn GB2301480A (en) | 1995-05-29 | 1995-08-30 | Thermo chuck for mounting wafers |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPH08330399A (en) |
| KR (1) | KR960043037A (en) |
| CN (1) | CN1139766A (en) |
| DE (1) | DE19531699A1 (en) |
| GB (1) | GB2301480A (en) |
| TW (1) | TW344087B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW303505B (en) * | 1996-05-08 | 1997-04-21 | Applied Materials Inc | Substrate support chuck having a contaminant containment layer and method of fabricating same |
| JP4614416B2 (en) * | 2003-05-29 | 2011-01-19 | 日東電工株式会社 | Semiconductor chip manufacturing method and dicing sheet pasting apparatus |
| KR100695203B1 (en) * | 2006-07-31 | 2007-03-16 | 안병돈 | Shaft for transport roller glass having core |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4384918A (en) * | 1980-09-30 | 1983-05-24 | Fujitsu Limited | Method and apparatus for dry etching and electrostatic chucking device used therein |
| JPS6059104B2 (en) * | 1982-02-03 | 1985-12-23 | 株式会社東芝 | electrostatic chuck board |
-
1995
- 1995-05-29 KR KR1019950013696A patent/KR960043037A/en not_active Application Discontinuation
- 1995-08-29 DE DE19531699A patent/DE19531699A1/en not_active Withdrawn
- 1995-08-30 GB GB9517702A patent/GB2301480A/en not_active Withdrawn
- 1995-08-30 TW TW084109048A patent/TW344087B/en active
- 1995-08-30 CN CN95116697A patent/CN1139766A/en active Pending
- 1995-10-17 JP JP26885495A patent/JPH08330399A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW344087B (en) | 1998-11-01 |
| CN1139766A (en) | 1997-01-08 |
| KR960043037A (en) | 1996-12-21 |
| JPH08330399A (en) | 1996-12-13 |
| DE19531699A1 (en) | 1996-12-05 |
| GB2301480A (en) | 1996-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |