KR960036113A - 기판 상에 헤테로에피택셜 iii-v 질화물 반도체 재료를 포함하는 아티클 - Google Patents
기판 상에 헤테로에피택셜 iii-v 질화물 반도체 재료를 포함하는 아티클 Download PDFInfo
- Publication number
- KR960036113A KR960036113A KR1019960006587A KR19960006587A KR960036113A KR 960036113 A KR960036113 A KR 960036113A KR 1019960006587 A KR1019960006587 A KR 1019960006587A KR 19960006587 A KR19960006587 A KR 19960006587A KR 960036113 A KR960036113 A KR 960036113A
- Authority
- KR
- South Korea
- Prior art keywords
- iii
- article
- layer
- nitride semiconductor
- semiconductor material
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract 18
- 239000000758 substrate Substances 0.000 title claims abstract 12
- 239000004065 semiconductor Substances 0.000 title claims abstract 11
- 150000004767 nitrides Chemical class 0.000 title claims abstract 10
- 239000013078 crystal Substances 0.000 claims abstract 6
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052793 cadmium Inorganic materials 0.000 claims abstract 2
- 150000001875 compounds Chemical class 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 229910052738 indium Inorganic materials 0.000 claims abstract 2
- 229910052742 iron Inorganic materials 0.000 claims abstract 2
- 229910052749 magnesium Inorganic materials 0.000 claims abstract 2
- 229910052748 manganese Inorganic materials 0.000 claims abstract 2
- 229910052727 yttrium Inorganic materials 0.000 claims abstract 2
- 229910052725 zinc Inorganic materials 0.000 claims abstract 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 229910052785 arsenic Inorganic materials 0.000 claims 1
- 229910052747 lanthanoid Inorganic materials 0.000 claims 1
- 150000002602 lanthanoids Chemical class 0.000 claims 1
- -1 nitride compound Chemical class 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000005693 optoelectronics Effects 0.000 abstract 1
- 229910052706 scandium Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/184—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
- H01L31/1852—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising a growth substrate not being an AIIIBV compound
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Recrystallisation Techniques (AREA)
Abstract
우리는 GaN과 같은 III-V질화물 반도체용으로 적합한 기판을 발견하였다. 기판 재료는 YbFe2O4또는 InFeO3(ZnO)n 구조형이고, R은 Sc, In, Y 및 란타족(원소번호 67-71)중 하나 이상이고, A 는 Fe(III), Ga 및 Al 중 하나 이상이고, M은 Mg, Mn, Fe(II), Co, Cu, Zn 및 Cd 중 하나 이상이고, n은 1이상의 정수인, 일반 화합물 RAO3(MO)n을 갖는다. 또한, 기판 재료는 기판 재료상에 증착되는 III-V 질하물 반도체 재료와 ±5%미만인 격자 부정합을 제공하는 격자 상수를 갖도록 선택된다, 기판 재료중 적어도 일부(예를들어, ScMgAlO4)는 전형적으로 단일 결정 형태로 쉽고 비교적 값 싸게 생산될 수 있고, 기저 판상에서 균열될 수 있으며, 전형적인 증착 조건하에서 III-V 질화물과 실질적으로 화학적 반응을 하지 않는다. 광 전자 소자 제작용 새로운 기판 재료의 이용이 고려된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 예증적 소자, 즉 LED를 개략적으로 도시한 도면.
Claims (9)
- a)기판은 일반적 화합물 RAO3(MO)n의 실질적 단일 결정 재료이고, 여기서 R은 Sn,In,Y 및 원자번호 67 내지 71의 란탄족중 하나 이상이고, A 는 Fe(III), Ga 및 Al 중 하나 이상이고;M은 Mg,Mn,Fe(II),Co,Cu,Zn 및 Cd 중 하나 이상이고, n은 1이상의 정수이며, b)실질적 단일 결정 기판 재료는 (YbFe2O4구조형의 결정 구조 또는 InFeO3(ZnO)n 구조형의 결정 구조를 갖고, c)실질적 단일 결정 기판 재료는 III-V 질화물 반도체 재료의 격자 상수(a)와 ±5%미만의 격자 부정합을 제공하는 격자 상수를 갖는 것을 특징으로 하느 기판(12)상에 배치되고 실질상 에피택셜된 일정량의 III-V질화물 반도체재료(11)를 포함하는 아티클.
- 제1항에 있어서, 상기 일정량의 III-V 질화물 반도체 재료는 GaN,AlNM,InN,GaAlN,GaInN,AlInN,GaAlInN 및 질소 대신 As 또는 P가 대치된 상기 질화물에서 선태된 재료를 포함하는 것을 특징으로하는 아티클.
- 제1항에 있어서, n<9인 것을 특징으로 하는 아티클
- 제3항에 있어서, n≤3인 것을 특징으로 하는 아티클
- 제4항에 있어서 n=1인 것을 특징으로 하는 아티클
- 제5항에 있어서, 상기 실질적 단일 결정 기판 재료가 ScGaMgO4, InGaMgO4,ScAlMnO4,ScAlCoO4, ScAlMgO4및 InAlMgO4로 부터 선택된 것을 특징으로 하는 아티클
- 제1항에 있어서, 상기 일정량의 III-V 질화물 반도체 재료는 제1층이 제2층과 구성이 다르고, 상기 층중 적어도 한 층이 도핑된 반도체 재료층을 포함하는, 적어도 III-V질화물 반도체 재료의 제1 및 제2층을 갖는 층 구조인 것을 특징으로 하는 아티클.
- 제7항에 있어서, 상기 층 구조를 통해 전류를 흐르게 하기 위해 응용된 접점(19,19')을 더 포함하는 것을 특징으로하는 아티클
- 제8항에 있어서, 상기 아티클이 반도체 레이저 또는 발광 다이오드인 것을 특징으로 하는 아티클.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/403,329 US5530267A (en) | 1995-03-14 | 1995-03-14 | Article comprising heteroepitaxial III-V nitride semiconductor material on a substrate |
US403,329 | 1995-03-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960036113A true KR960036113A (ko) | 1996-10-28 |
Family
ID=23595384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960006587A KR960036113A (ko) | 1995-03-14 | 1996-03-13 | 기판 상에 헤테로에피택셜 iii-v 질화물 반도체 재료를 포함하는 아티클 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5530267A (ko) |
EP (1) | EP0732755A3 (ko) |
JP (1) | JP3115814B2 (ko) |
KR (1) | KR960036113A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100832415B1 (ko) * | 2000-10-10 | 2008-05-26 | 에이에스엠 인터내셔널 엔.브이. | 유전 접합막의 나노적층판 구조, 유전 접합막을 이용한 집적회로 및 콘덴서 구조, 및 그 형성 방법 |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6953703B2 (en) * | 1991-03-18 | 2005-10-11 | The Trustees Of Boston University | Method of making a semiconductor device with exposure of sapphire substrate to activated nitrogen |
EP0647730B1 (en) * | 1993-10-08 | 2002-09-11 | Mitsubishi Cable Industries, Ltd. | GaN single crystal |
US5787104A (en) * | 1995-01-19 | 1998-07-28 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting element and method for fabricating the same |
US5677538A (en) * | 1995-07-07 | 1997-10-14 | Trustees Of Boston University | Photodetectors using III-V nitrides |
WO1997011494A1 (en) * | 1995-09-19 | 1997-03-27 | Astralux, Incorporated | X-ray detector |
US5652551A (en) * | 1996-06-25 | 1997-07-29 | The United States Of America As Represented By The Secretary Of The Army | Method for high frequency device operation with high temperature and radiation hard characteristics |
JPH1056236A (ja) * | 1996-08-08 | 1998-02-24 | Toyoda Gosei Co Ltd | 3族窒化物半導体レーザ素子 |
US5838707A (en) * | 1996-12-27 | 1998-11-17 | Motorola, Inc. | Ultraviolet/visible light emitting vertical cavity surface emitting laser and method of fabrication |
US5741724A (en) * | 1996-12-27 | 1998-04-21 | Motorola | Method of growing gallium nitride on a spinel substrate |
JPH10242579A (ja) * | 1997-02-27 | 1998-09-11 | Sharp Corp | 窒化物系iii−v族化合物半導体装置 |
US6284395B1 (en) | 1997-03-05 | 2001-09-04 | Corning Applied Technologies Corp. | Nitride based semiconductors and devices |
JP3423896B2 (ja) | 1999-03-25 | 2003-07-07 | 科学技術振興事業団 | 半導体デバイス |
US6853663B2 (en) * | 2000-06-02 | 2005-02-08 | Agilent Technologies, Inc. | Efficiency GaN-based light emitting devices |
US6576932B2 (en) | 2001-03-01 | 2003-06-10 | Lumileds Lighting, U.S., Llc | Increasing the brightness of III-nitride light emitting devices |
US6839362B2 (en) * | 2001-05-22 | 2005-01-04 | Saint-Gobain Ceramics & Plastics, Inc. | Cobalt-doped saturable absorber Q-switches and laser systems |
JP4083486B2 (ja) * | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
US6844084B2 (en) * | 2002-04-03 | 2005-01-18 | Saint-Gobain Ceramics & Plastics, Inc. | Spinel substrate and heteroepitaxial growth of III-V materials thereon |
EP1712662A4 (en) * | 2003-06-30 | 2009-12-02 | Kenichiro Miyahara | SUBSTRATE FOR THE MANUFACTURE OF THIN FILMS, SUBSTRATE FOR THIN FILMS AND LIGHT EMITTING ELEMENT |
US7326477B2 (en) * | 2003-09-23 | 2008-02-05 | Saint-Gobain Ceramics & Plastics, Inc. | Spinel boules, wafers, and methods for fabricating same |
US7045223B2 (en) * | 2003-09-23 | 2006-05-16 | Saint-Gobain Ceramics & Plastics, Inc. | Spinel articles and methods for forming same |
US20050061230A1 (en) * | 2003-09-23 | 2005-03-24 | Saint-Gobain Ceramics & Plastics, Inc. | Spinel articles and methods for forming same |
JP2005187317A (ja) * | 2003-12-03 | 2005-07-14 | Ngk Insulators Ltd | 単結晶の製造方法、単結晶および複合体 |
US7919815B1 (en) | 2005-02-24 | 2011-04-05 | Saint-Gobain Ceramics & Plastics, Inc. | Spinel wafers and methods of preparation |
JP5717063B2 (ja) * | 2008-09-30 | 2015-05-13 | 国立大学法人 岡山大学 | 電流制御素子及びその製造方法 |
KR20130112903A (ko) * | 2010-11-02 | 2013-10-14 | 코닌클리케 필립스 엔.브이. | 기판 상에 성장된 iii-질화물층 |
US9209359B2 (en) * | 2010-11-02 | 2015-12-08 | Koninklijke Philips N.V. | Light emitting device with improved extraction efficiency |
EP2635726A1 (en) | 2010-11-02 | 2013-09-11 | Koninklijke Philips Electronics N.V. | Method of forming a composite substrate. |
CN103180973A (zh) * | 2010-11-02 | 2013-06-26 | 皇家飞利浦电子股份有限公司 | Iii族氮化物发光器件 |
WO2015029071A1 (en) * | 2013-08-30 | 2015-03-05 | Council Of Scientific And Industrial Research | Water splitting activity of layered oxides |
JP6514915B2 (ja) * | 2014-02-28 | 2019-05-15 | 国立大学法人東北大学 | 単結晶基板の製造方法およびレーザ素子の製造方法 |
US20160138182A1 (en) * | 2014-11-18 | 2016-05-19 | Wisconsin Alumni Research Foundation | Methods for forming mixed metal oxide epitaxial films |
CN107230611A (zh) * | 2016-03-25 | 2017-10-03 | 松下知识产权经营株式会社 | Iii族氮化物结晶制造方法以及ramo4基板 |
US10304740B2 (en) * | 2016-12-15 | 2019-05-28 | Panasonic Intellectual Property Management Co., Ltd. | RAMO4 monocrystalline substrate |
JP6615945B1 (ja) * | 2018-06-07 | 2019-12-04 | パナソニック株式会社 | ScAlMgO4単結晶およびデバイス |
JP7228793B2 (ja) * | 2019-06-07 | 2023-02-27 | パナソニックIpマネジメント株式会社 | 波長変換デバイス |
WO2024043191A1 (ja) * | 2022-08-24 | 2024-02-29 | 株式会社オキサイド | エピタキシャル成長用基板 |
-
1995
- 1995-03-14 US US08/403,329 patent/US5530267A/en not_active Expired - Lifetime
-
1996
- 1996-02-27 JP JP3955696A patent/JP3115814B2/ja not_active Expired - Fee Related
- 1996-03-05 EP EP96301468A patent/EP0732755A3/en not_active Withdrawn
- 1996-03-13 KR KR1019960006587A patent/KR960036113A/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100832415B1 (ko) * | 2000-10-10 | 2008-05-26 | 에이에스엠 인터내셔널 엔.브이. | 유전 접합막의 나노적층판 구조, 유전 접합막을 이용한 집적회로 및 콘덴서 구조, 및 그 형성 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPH08288220A (ja) | 1996-11-01 |
EP0732755A3 (en) | 1999-11-03 |
EP0732755A2 (en) | 1996-09-18 |
US5530267A (en) | 1996-06-25 |
JP3115814B2 (ja) | 2000-12-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960036113A (ko) | 기판 상에 헤테로에피택셜 iii-v 질화물 반도체 재료를 포함하는 아티클 | |
JP4095066B2 (ja) | 窒化ガリウムベース半導体の半導体構造 | |
CA2200305C (en) | Vertical geometry light emitting diode with group iii nitride active layer and extended lifetime | |
US7312480B2 (en) | Semiconductor device and method of fabricating the same | |
US8803189B2 (en) | III-V compound semiconductor epitaxy using lateral overgrowth | |
US6110277A (en) | Process for the fabrication of epitaxial layers of a compound semiconductor on monocrystal silicon and light-emitting diode fabricated therefrom | |
CN101233622B (zh) | 光电子器件、光电子半导体芯片及其制造方法 | |
US8044409B2 (en) | III-nitride based semiconductor structure with multiple conductive tunneling layer | |
GB2338109A (en) | Light emitting diode | |
JP2010517298A5 (ko) | ||
JP2008021986A (ja) | 窒化物系半導体発光素子およびその製造方法 | |
US7755094B2 (en) | Semiconductor light emitting device and method of manufacturing the same | |
KR960701482A (ko) | 피(p)형 II-VI족 반도체의 경사형 조성의 오믹 접촉(GRADED COMPOSITION OHMIC CONTACT FOR P-TYPE II-IV SEMICONDUCTORS) | |
MY114592A (en) | Gallium nitride compound-based semiconductor light emitting device and process for producing gallium nitride compound-based semiconductor thin film | |
US20060289891A1 (en) | Electronic and/or optoelectronic devices grown on free-standing GaN substrates with GaN spacer structures | |
KR102147587B1 (ko) | 완화 층 상에 성장된 ⅲ-질화물 발광 디바이스 | |
KR900005655A (ko) | 반도체 장치 및 그 제조방법 | |
US6774410B2 (en) | Epitaxial growth of nitride semiconductor device | |
KR970017991A (ko) | 에피택셜 웨이퍼 및 이의 제조방법 | |
WO2005106980A1 (en) | Compound semiconductor light-emitting device | |
KR920021746A (ko) | 도우프된 결정 성장방법 | |
CN101026203A (zh) | 半导体纳米结构及其制作方法 | |
KR100879231B1 (ko) | 3-5족 화합물 반도체 및 발광 다이오드 | |
CN103518266A (zh) | Ⅲ族氮化物半导体发光元件 | |
Cabalu | Development of gallium nitride-based ultraviolet and visible light-emitting diodes using hydride vapor-phase epitaxy and molecular beam epitaxy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
NORF | Unpaid initial registration fee |