KR960035864A - 폴리싱장치 - Google Patents

폴리싱장치 Download PDF

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Publication number
KR960035864A
KR960035864A KR1019960008500A KR19960008500A KR960035864A KR 960035864 A KR960035864 A KR 960035864A KR 1019960008500 A KR1019960008500 A KR 1019960008500A KR 19960008500 A KR19960008500 A KR 19960008500A KR 960035864 A KR960035864 A KR 960035864A
Authority
KR
South Korea
Prior art keywords
upper ring
turntable
pressing
polishing cloth
motor
Prior art date
Application number
KR1019960008500A
Other languages
English (en)
Inventor
데쓰지 도가와
도요미 니시
Original Assignee
후지무라 히로유끼
가부시키 가이샤 에바라 세사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지무라 히로유끼, 가부시키 가이샤 에바라 세사쿠쇼 filed Critical 후지무라 히로유끼
Publication of KR960035864A publication Critical patent/KR960035864A/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

반도체 웨이퍼와 같은 대상물을 연마하는 본 발명의 폴리싱장치는 종래의 폴리싱장치에 비해 높이가 축소된다. 높이의 축소는 턴테이블 하부의 상부 링 회전모터의 배치에 의해 달성되며, 모터에서 상부 링으로 회전력으로 전달하는 회전축을 위치시키기 위해 연마대상물의 로딩/언로딩용의 선회축의 내부를 중공으로 형성시켜 달성된다.

Description

폴리싱장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 상면에 연마용액이 제공된 연마포를 갖는 턴테이블과; 상기 턴테이블 상부에 위치하며 연마 대상물을 지지하고 상기 연마포에 대하여 상기 대상물을 가압하는 상부 링과; 상기 턴테이블 아래에 위치하며 상기 상부 링을 회전시키는 제1모터와; 상기 턴테이블 아래에 위치하며 상기 대상물을 로딩하고 언로딩 하는 상기 상부 링을 선회시키는 제2모터와; 상기 상부 링을 선회시키는 상기 제2모터에 연결되는 중공축; 및 상기 중공축 내부에 위치하며, 상기 상부 링과 상기 상부링을 회전시키는 상기 제1모터에 연결되는 회전축을 포함하는 것을 특징으로 하는 대상물의 표면을 연마하는 폴리싱장치.
  2. 제1항에 있어서, 상기 회전축과 폴리수단 사이에 위치하며 상기 회전축과 상기 폴리수단 사이에서의 편심 동작을 흡수하는 상기 상부 링에 결합된 편심 보정커플링을 더욱 포함하는 것을 특징으로 하는 대상물의 표면을 연마하는 폴리싱장치.
  3. 상부에 연마용액이 공급되는 연마포를 갖는 턴테이블과; 상기 턴테이블 상부에 위치하며 연마 대상물을 지지하고 상기 연마포에 대하여 상기 대상물을 가압하는 상부 링; 및 상기 폴리싱장치의 전체 높이를 감소시키기 위해 수직 방향에 대해 경사진 각으로 위치하며 상기 대상물에 압력을 가하는 상부 링 압축 실린더를 구비한 상기 연마포에 대해 상기 대상물을 가압하는 가압 수단을 포함하는 것을 특징으로 하는 폴리싱장치.
  4. 제3항에 있어서, 상기 가압 수단은 상기 상부 링 압축 실린더와, 상기 상부 링을 상승 하강시키기 위해 지지점에 의해 회전 가능하게 지지되는 수평 링크를 포함하는 것을 특징으로 하는 폴리싱장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960008500A 1995-03-28 1996-03-27 폴리싱장치 KR960035864A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-094535 1995-03-28
JP9453595A JPH08257902A (ja) 1995-03-28 1995-03-28 ポリッシング装置

Publications (1)

Publication Number Publication Date
KR960035864A true KR960035864A (ko) 1996-10-28

Family

ID=14113030

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960008500A KR960035864A (ko) 1995-03-28 1996-03-27 폴리싱장치

Country Status (3)

Country Link
US (1) US5645473A (ko)
JP (1) JPH08257902A (ko)
KR (1) KR960035864A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183388B2 (ja) * 1996-07-12 2001-07-09 株式会社東京精密 半導体ウェーハ研磨装置
US6056630A (en) * 1998-05-19 2000-05-02 Lucent Technologies Inc. Polishing apparatus with carrier head pivoting device
US6042457A (en) * 1998-07-10 2000-03-28 Aplex, Inc. Conditioner assembly for a chemical mechanical polishing apparatus
JP4711554B2 (ja) * 2001-07-17 2011-06-29 スピードファム株式会社 加圧プレート用反転機構を備えた平面研磨装置
CN100546769C (zh) * 2007-12-29 2009-10-07 浙江工业大学 模具自由曲面柔性抛光机的磨头驱动机构
CN103624639A (zh) * 2013-12-19 2014-03-12 包头市丰达石油机械有限责任公司 石油焊接钻杆焊区外圆打磨系统
CN205497204U (zh) * 2016-03-01 2016-08-24 林中尉 可浮动压紧的旋转动力头

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4450652A (en) * 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
CH684321A5 (de) * 1988-04-07 1994-08-31 Arthur Werner Staehli Einrichtung an einer Zweischeibenläppmaschine.
US5234867A (en) * 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
JP2513426B2 (ja) * 1993-09-20 1996-07-03 日本電気株式会社 ウェ―ハ研磨装置
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5536202A (en) * 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
US5486265A (en) * 1995-02-06 1996-01-23 Advanced Micro Devices, Inc. Chemical-mechanical polishing of thin materials using a pulse polishing technique

Also Published As

Publication number Publication date
JPH08257902A (ja) 1996-10-08
US5645473A (en) 1997-07-08

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