KR960025404U - 웨이퍼검사용 프로브카드 - Google Patents

웨이퍼검사용 프로브카드

Info

Publication number
KR960025404U
KR960025404U KR2019940038461U KR19940038461U KR960025404U KR 960025404 U KR960025404 U KR 960025404U KR 2019940038461 U KR2019940038461 U KR 2019940038461U KR 19940038461 U KR19940038461 U KR 19940038461U KR 960025404 U KR960025404 U KR 960025404U
Authority
KR
South Korea
Prior art keywords
probe card
wafer inspection
inspection probe
wafer
card
Prior art date
Application number
KR2019940038461U
Other languages
English (en)
Other versions
KR0129923Y1 (ko
Inventor
석주한
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019940038461U priority Critical patent/KR0129923Y1/ko
Publication of KR960025404U publication Critical patent/KR960025404U/ko
Application granted granted Critical
Publication of KR0129923Y1 publication Critical patent/KR0129923Y1/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR2019940038461U 1994-12-30 1994-12-30 웨이퍼검사용 프로브카드 KR0129923Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940038461U KR0129923Y1 (ko) 1994-12-30 1994-12-30 웨이퍼검사용 프로브카드

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940038461U KR0129923Y1 (ko) 1994-12-30 1994-12-30 웨이퍼검사용 프로브카드

Publications (2)

Publication Number Publication Date
KR960025404U true KR960025404U (ko) 1996-07-22
KR0129923Y1 KR0129923Y1 (ko) 1999-02-01

Family

ID=19404687

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940038461U KR0129923Y1 (ko) 1994-12-30 1994-12-30 웨이퍼검사용 프로브카드

Country Status (1)

Country Link
KR (1) KR0129923Y1 (ko)

Also Published As

Publication number Publication date
KR0129923Y1 (ko) 1999-02-01

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