KR960015925B1 - 캐리어 테이프용 슬라이드 캐리어 - Google Patents

캐리어 테이프용 슬라이드 캐리어 Download PDF

Info

Publication number
KR960015925B1
KR960015925B1 KR1019930013599A KR930013599A KR960015925B1 KR 960015925 B1 KR960015925 B1 KR 960015925B1 KR 1019930013599 A KR1019930013599 A KR 1019930013599A KR 930013599 A KR930013599 A KR 930013599A KR 960015925 B1 KR960015925 B1 KR 960015925B1
Authority
KR
South Korea
Prior art keywords
tape
carrier
slide
slide carrier
carrier tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930013599A
Other languages
English (en)
Korean (ko)
Other versions
KR940006227A (ko
Inventor
후미오 오시노
마사히코 야마키
Original Assignee
미쓰이도오아쓰가가쿠 가부시키가이샤
사또오 아키오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이도오아쓰가가쿠 가부시키가이샤, 사또오 아키오 filed Critical 미쓰이도오아쓰가가쿠 가부시키가이샤
Publication of KR940006227A publication Critical patent/KR940006227A/ko
Application granted granted Critical
Publication of KR960015925B1 publication Critical patent/KR960015925B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5327—Means to fasten by deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1019930013599A 1992-07-21 1993-07-19 캐리어 테이프용 슬라이드 캐리어 Expired - Fee Related KR960015925B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-194170 1992-07-21
JP19417092 1992-07-21

Publications (2)

Publication Number Publication Date
KR940006227A KR940006227A (ko) 1994-03-23
KR960015925B1 true KR960015925B1 (ko) 1996-11-23

Family

ID=16320096

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930013599A Expired - Fee Related KR960015925B1 (ko) 1992-07-21 1993-07-19 캐리어 테이프용 슬라이드 캐리어

Country Status (6)

Country Link
US (1) US5349236A (https=)
EP (1) EP0580410B1 (https=)
KR (1) KR960015925B1 (https=)
DE (1) DE69306683T2 (https=)
MY (1) MY109013A (https=)
SG (1) SG48711A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0883866A (ja) * 1994-07-15 1996-03-26 Shinko Electric Ind Co Ltd 片面樹脂封止型半導体装置の製造方法及びこれに用いるキャリアフレーム
US5578870A (en) * 1995-08-03 1996-11-26 Precision Connector Designs, Inc. Top loading test socket for ball grid arrays
EP0793904B1 (en) * 1995-09-22 2003-01-29 Matsushita Electric Industrial Co., Ltd. Part retainer and its manufacturing method as well as part supply apparatus using the part retainer
US5706082A (en) * 1996-05-14 1998-01-06 Alimenterics Inc. Optogalvanic spectroscopy with phase independent detection
US5758776A (en) * 1996-09-12 1998-06-02 Kinetrix, Inc. Integrated circuit tray with flexural bearings
US6687980B1 (en) * 1997-03-04 2004-02-10 Tessera, Inc. Apparatus for processing flexible tape for microelectronic assemblies
US6048744A (en) * 1997-09-15 2000-04-11 Micron Technology, Inc. Integrated circuit package alignment feature
US5949137A (en) * 1997-09-26 1999-09-07 Lsi Logic Corporation Stiffener ring and heat spreader for use with flip chip packaging assemblies
US7023087B1 (en) * 1998-08-05 2006-04-04 Agere Systems Inc. Integrated circuit carrier and method of manufacturing and integrated circuit
US6991960B2 (en) * 2001-08-30 2006-01-31 Micron Technology, Inc. Method of semiconductor device package alignment and method of testing
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
US20070126445A1 (en) * 2005-11-30 2007-06-07 Micron Technology, Inc. Integrated circuit package testing devices and methods of making and using same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4007479A (en) * 1976-03-29 1977-02-08 Honeywell Information Systems, Inc. Fixture for an integrated circuit chip
US4069496A (en) * 1976-12-30 1978-01-17 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
US4547794A (en) * 1984-10-17 1985-10-15 Amdahl Corporation Reusable fixture for holding a segment of a flexible strip
US4696526A (en) * 1985-07-26 1987-09-29 Intel Corporation Carrier for tape automated bonded semiconductor device
JPH0628273B2 (ja) * 1987-10-05 1994-04-13 富士通株式会社 Ｉｃ支持フィルムとそれを塔載したキャリア
US4949159A (en) * 1988-08-03 1990-08-14 Byers Photo Equipment Company Carrier for film-mounted integrated circuit
US5101975A (en) * 1990-10-31 1992-04-07 Novapak, Inc. Electronic component carrier
EP0472435B1 (en) * 1990-08-22 1995-11-02 Nec Corporation Carrier for film carrier type semiconductor device

Also Published As

Publication number Publication date
EP0580410B1 (en) 1996-12-18
EP0580410A2 (en) 1994-01-26
DE69306683T2 (de) 1997-07-03
SG48711A1 (en) 1998-05-18
DE69306683D1 (de) 1997-01-30
MY109013A (en) 1996-11-30
KR940006227A (ko) 1994-03-23
US5349236A (en) 1994-09-20
EP0580410A3 (https=) 1994-03-23

Similar Documents

Publication Publication Date Title
KR960015925B1 (ko) 캐리어 테이프용 슬라이드 캐리어
US4767984A (en) Protective fixture for chip carrier
US4507861A (en) Insertion device for an electronic circuit package assembly
US4723361A (en) IC insertion/extraction tool
US4193656A (en) Extraction device for extracting a DIP from a DIP header
US5423687A (en) Electronic component upgrade connector and contact
US5371408A (en) Integrated circuit package with removable shield
US4797996A (en) Device for centering preformed components for the flat implantation thereof by means of an automatic setting machine
US4713022A (en) Socket for flat pack electronic device packages
JP4153862B2 (ja) 半導体樹脂封止用金型
US5291994A (en) Slide tab carrier for flatpack electronic component carriers
US5490795A (en) Aligning IC socket
JPS63299257A (ja) Ｉｃ検査用ソケット
KR101394388B1 (ko) 반도체 기판의 픽커 및 이를 갖는 반도체 기판의 이송 장치
US20080009168A1 (en) Socket for electrical parts
JP2559170Y2 (ja) Ｉｃキャリア
JP3920422B2 (ja) Ｉｃキャリア
US5784774A (en) IC socket jig
US4747209A (en) Contact alignment tool
US4720742A (en) Semiconductor device carrier
JP2706644B2 (ja) Ｉｃソケット
JP2000503168A (ja) テープキャリアパッケージ用ソケット
CN221415632U (zh) 一种继电器罩壳组装生产线
JPH0644050Y2 (ja) Ｉｃソケット
KR19980064022A (ko) 집적회로 패키지용 소켓 장치

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19991124

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19991124

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000