KR960015643U - 반도체 칩의 리드교정장치 - Google Patents

반도체 칩의 리드교정장치

Info

Publication number
KR960015643U
KR960015643U KR2019940028030U KR19940028030U KR960015643U KR 960015643 U KR960015643 U KR 960015643U KR 2019940028030 U KR2019940028030 U KR 2019940028030U KR 19940028030 U KR19940028030 U KR 19940028030U KR 960015643 U KR960015643 U KR 960015643U
Authority
KR
South Korea
Prior art keywords
semiconductor chip
calibration device
chip lead
lead calibration
semiconductor
Prior art date
Application number
KR2019940028030U
Other languages
English (en)
Other versions
KR0126935Y1 (ko
Inventor
최현
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019940028030U priority Critical patent/KR0126935Y1/ko
Publication of KR960015643U publication Critical patent/KR960015643U/ko
Application granted granted Critical
Publication of KR0126935Y1 publication Critical patent/KR0126935Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
KR2019940028030U 1994-10-26 1994-10-26 반도체 칩의 리드교정장치 KR0126935Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940028030U KR0126935Y1 (ko) 1994-10-26 1994-10-26 반도체 칩의 리드교정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940028030U KR0126935Y1 (ko) 1994-10-26 1994-10-26 반도체 칩의 리드교정장치

Publications (2)

Publication Number Publication Date
KR960015643U true KR960015643U (ko) 1996-05-17
KR0126935Y1 KR0126935Y1 (ko) 1998-10-01

Family

ID=19396434

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940028030U KR0126935Y1 (ko) 1994-10-26 1994-10-26 반도체 칩의 리드교정장치

Country Status (1)

Country Link
KR (1) KR0126935Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100976549B1 (ko) * 2008-06-03 2010-08-17 주식회사 티엔씨 핀 위치 교정장치

Also Published As

Publication number Publication date
KR0126935Y1 (ko) 1998-10-01

Similar Documents

Publication Publication Date Title
DE69510834D1 (de) Halbleiterspeicheranordnung
DE69521159D1 (de) Halbleiterspeicheranordnung
DE69422901T2 (de) Halbleiterspeicheranordnung
DE69512700T2 (de) Halbleiterspeicheranordnung
KR970004347A (ko) 반도체 집적회로 장치
KR960012451A (ko) 반도체 장치 및 리드프레임
DE69531121D1 (de) Integrierte Halbleiteranordnung
DE69521066D1 (de) Halbleiterspeicheranordnung
KR960015643U (ko) 반도체 칩의 리드교정장치
KR960009128A (ko) 수지-캡슐화 반도체 장치
KR960006348U (ko) 반도체칩 검사장치
KR950028672U (ko) 반도체 칩 이젝터장치
KR970003253U (ko) 반도체 칩 픽-업 장치
KR960025376U (ko) 리드 온 칩 반도체 장치
KR960015608U (ko) 칩 수평도 측정 반도체장치
KR960027798U (ko) 반도체 팩키지의 리이드 성형장치
KR960038722U (ko) 반도체 칩
KR960038724U (ko) 반도체 칩
KR960025381U (ko) 반도체 칩의 특성검사장치
KR970064186U (ko) 반도체 패키지의 리드 검사장치
FI961853A (fi) Puolijohdemuistilaite
KR940025550U (ko) 반도체 칩 검사장치
KR970019761U (ko) 반도체 칩의 운반장치
KR960025513U (ko) 반도체 칩
KR950025923U (ko) 반도체 칩

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050629

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee