KR960015608U - 칩 수평도 측정 반도체장치 - Google Patents

칩 수평도 측정 반도체장치

Info

Publication number
KR960015608U
KR960015608U KR2019940026591U KR19940026591U KR960015608U KR 960015608 U KR960015608 U KR 960015608U KR 2019940026591 U KR2019940026591 U KR 2019940026591U KR 19940026591 U KR19940026591 U KR 19940026591U KR 960015608 U KR960015608 U KR 960015608U
Authority
KR
South Korea
Prior art keywords
semiconductor device
level measurement
chip level
measurement semiconductor
chip
Prior art date
Application number
KR2019940026591U
Other languages
English (en)
Other versions
KR200197856Y1 (ko
Inventor
김형수
안창남
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019940026591U priority Critical patent/KR200197856Y1/ko
Publication of KR960015608U publication Critical patent/KR960015608U/ko
Application granted granted Critical
Publication of KR200197856Y1 publication Critical patent/KR200197856Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
KR2019940026591U 1994-10-12 1994-10-12 칩 수평도 측정 반도체장치 KR200197856Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940026591U KR200197856Y1 (ko) 1994-10-12 1994-10-12 칩 수평도 측정 반도체장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940026591U KR200197856Y1 (ko) 1994-10-12 1994-10-12 칩 수평도 측정 반도체장치

Publications (2)

Publication Number Publication Date
KR960015608U true KR960015608U (ko) 1996-05-17
KR200197856Y1 KR200197856Y1 (ko) 2000-12-01

Family

ID=19395295

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940026591U KR200197856Y1 (ko) 1994-10-12 1994-10-12 칩 수평도 측정 반도체장치

Country Status (1)

Country Link
KR (1) KR200197856Y1 (ko)

Also Published As

Publication number Publication date
KR200197856Y1 (ko) 2000-12-01

Similar Documents

Publication Publication Date Title
DE19680786T1 (de) Halbleiterbauelement-Testgerät
DE69433951D1 (de) Verbundenes Halbleiterbauelement
DE69509931D1 (de) Halbleiterspeicheranordnung
DE69422901T2 (de) Halbleiterspeicheranordnung
DE69512700D1 (de) Halbleiterspeicheranordnung
DE59508581D1 (de) Halbleiterbauelement
KR970004347A (ko) 반도체 집적회로 장치
DE19980453T1 (de) Halbleiterbauelement-Testgerät
DE19880680T1 (de) Halbleiterbauelement-Testgerät
DE69522789D1 (de) Halbleitervorrichtung
DE69501381D1 (de) Halbleitergerät
DE69513207T2 (de) Halbleitervorrichtung
DE69531121D1 (de) Integrierte Halbleiteranordnung
DE69521066D1 (de) Halbleiterspeicheranordnung
KR960009084A (ko) 반도체장치
KR960009128A (ko) 수지-캡슐화 반도체 장치
KR960006348U (ko) 반도체칩 검사장치
KR960015608U (ko) 칩 수평도 측정 반도체장치
KR950028672U (ko) 반도체 칩 이젝터장치
KR960015643U (ko) 반도체 칩의 리드교정장치
KR950034346U (ko) 반도체장치의 테스트패턴칩
KR960009225A (ko) 반도체장치
KR970003253U (ko) 반도체 칩 픽-업 장치
KR960025381U (ko) 반도체 칩의 특성검사장치
KR940025550U (ko) 반도체 칩 검사장치

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090624

Year of fee payment: 10

EXPY Expiration of term