KR960009238A - 광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질 및 이 몰드-윤활 물질을 이용하여 패키지화 광-반도체 장치를 생산하는 방법 - Google Patents
광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질 및 이 몰드-윤활 물질을 이용하여 패키지화 광-반도체 장치를 생산하는 방법 Download PDFInfo
- Publication number
- KR960009238A KR960009238A KR1019950024605A KR19950024605A KR960009238A KR 960009238 A KR960009238 A KR 960009238A KR 1019950024605 A KR1019950024605 A KR 1019950024605A KR 19950024605 A KR19950024605 A KR 19950024605A KR 960009238 A KR960009238 A KR 960009238A
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- lubricating material
- semiconductor device
- molecular weight
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000463 material Substances 0.000 title claims abstract 16
- 239000004065 semiconductor Substances 0.000 title claims abstract 7
- 238000000465 moulding Methods 0.000 title claims abstract 6
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000003795 chemical substances by application Substances 0.000 claims abstract 8
- 239000003822 epoxy resin Substances 0.000 claims abstract 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract 8
- 229920000098 polyolefin Polymers 0.000 claims abstract 6
- 239000000945 filler Substances 0.000 claims abstract 5
- 239000000203 mixture Substances 0.000 claims abstract 5
- 239000011256 inorganic filler Substances 0.000 claims abstract 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract 3
- 239000012766 organic filler Substances 0.000 claims abstract 3
- 239000004743 Polypropylene Substances 0.000 claims abstract 2
- 235000013873 oxidized polyethylene wax Nutrition 0.000 claims abstract 2
- -1 polypropylene Polymers 0.000 claims abstract 2
- 229920001155 polypropylene Polymers 0.000 claims abstract 2
- 239000001993 wax Substances 0.000 claims 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000004593 Epoxy Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 230000001050 lubricating effect Effects 0.000 claims 2
- 229920002472 Starch Polymers 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000008107 starch Substances 0.000 claims 1
- 235000019698 starch Nutrition 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000004209 oxidized polyethylene wax Substances 0.000 abstract 1
- 230000002688 persistence Effects 0.000 abstract 1
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6-189687 | 1994-08-11 | ||
| JP6189687A JPH0852744A (ja) | 1994-08-11 | 1994-08-11 | 光半導体装置成形用金型離型付与材及び該離型付与材により処理された金型を用いて製造された光半導体装置 |
| JP6-208526 | 1994-09-01 | ||
| JP6208526A JPH0873703A (ja) | 1994-09-01 | 1994-09-01 | エポキシ樹脂組成物及び該組成物を用いて製造した光半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR960009238A true KR960009238A (ko) | 1996-03-22 |
Family
ID=51397225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950024605A Ceased KR960009238A (ko) | 1994-08-11 | 1995-08-09 | 광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질 및 이 몰드-윤활 물질을 이용하여 패키지화 광-반도체 장치를 생산하는 방법 |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR960009238A (enrdf_load_stackoverflow) |
| TW (1) | TW274535B (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100944501B1 (ko) * | 2008-07-31 | 2010-03-03 | (주)에이씨티 | 반도체 금형 코팅용 고무시트 |
-
1995
- 1995-08-03 TW TW084108095A patent/TW274535B/zh active
- 1995-08-09 KR KR1019950024605A patent/KR960009238A/ko not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100944501B1 (ko) * | 2008-07-31 | 2010-03-03 | (주)에이씨티 | 반도체 금형 코팅용 고무시트 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW274535B (enrdf_load_stackoverflow) | 1996-04-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19950809 |
|
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19950809 Comment text: Request for Examination of Application |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19980602 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 19980828 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19980602 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |