KR960005908A - 와이어 본딩부의 볼 검출방법 및 검출장치 - Google Patents

와이어 본딩부의 볼 검출방법 및 검출장치 Download PDF

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KR960005908A
KR960005908A KR1019950020285A KR19950020285A KR960005908A KR 960005908 A KR960005908 A KR 960005908A KR 1019950020285 A KR1019950020285 A KR 1019950020285A KR 19950020285 A KR19950020285 A KR 19950020285A KR 960005908 A KR960005908 A KR 960005908A
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ball
wire bonding
directions
detecting
bonding portion
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KR1019950020285A
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KR0169845B1 (ko
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노부토 야마자키
요시유키 오가타
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후지야마 겐지
가부시키가이샤 신가와
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Publication of KR0169845B1 publication Critical patent/KR0169845B1/ko

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract

[목적]
와이어 본딩부의 볼을 단시간에 확실하게 검출하는 것을 가능하게 한다.
[구성]
와이어 본딩시에 와이어 본딩부를 지시하는 미리 교시된 교시점(30)과 패드(P)내에서 볼(5) 밖의 점을 연결하는 적어도 3방향에서 볼에지(32a, 32b, 32c)를 검출하고, 이 적어도 3개의 볼에지(32a, 32b, 32c)의 볼(5)의 위치 및/또는, 크기 및/또는, 형상을 산출한다.

Description

와이어 본딩부의 볼 검출방법 및 검출장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 와이어 본딩부 중심위치 검출방법의 1 실시예를 나타내는 설명도.

Claims (5)

  1. 와이어 본딩후의 와이어 본딩부의 볼을 검출하는 방법에 있어서, 와이어 본딩시에 와이어 본딩부를 지시하는 밀 교시된 교시점과 패드내에서 볼밖의 점을 연결하는 적어도 3방향에서 볼에지를 검출하고, 이 적어도 3개의 볼에지에서 볼의 위치 및/또는, 크기 및/또는, 형상을 산출하는 것을 특징으로 하는 와이어 본딩부의 볼 검출방법.
  2. 제1항에 있어서, 상기 3방향은, 와이어 본딩부를 좔상하는 촬상장치의 검출틀을, 검출하는 볼이 본딩된 패드의 화상내에서 미리 결정된 볼보다 크게 설정하고, 상기 검출틀의 변과 45°의 각도를 가지고 서로 90°를 이루는 4방향내의 3 방향인 것을 특징으로 하는 와이어 본딩부의 볼 검출방법.
  3. 제1항 또는 제2항에 있어서, 상기 3방향은 제1 및 제2의 방향이 일직선이고, 제3의 방향이 상기 제1 및 제2의 방향으로 90°각도를 이루고, 상기 3방향의 제1, 제2 및 제 3의 볼에지를 검출하고, 제1의 에지좌표 또는 제2의 에지좌표의 어느 한쪽으로 부터와, 제 3의 에지좌표로 부터의 제1 및 제2의 에지의 2등분선에 있어서의 동일거리의 점을 구하여 볼을 검출하는 것을 특징으로 하는 와이어 본딩부의 볼 검출방법.
  4. 제1항에 있어서, 상기 와이어 본딩부의 볼을 검출한 후, 그 볼을 중심으로 하여 적어도 3방향에서 볼의 에지를 검출하여 와이어 본딩부의 형상을 판별하는 것을 특징으로 하는 와이어 본딩부의 볼 검출방법.
  5. 와이어 본딩부를 촬상장치로 촬상하여 와이어 본딩후의 와이어 본딩부의 볼을 검출하는 장치에 있어서, 상기 촬상장치의 검출틀을, 검출하는 볼이 본딩된 패드의 화상내에서 상기 볼보다 크게 설정하는 검출틀 성정부와, 와이어 본딩시에 와이어 본딩부를 지시하는 미리 교시된 교시점에서 상기 검출틀내에서 볼의 에지가 분명하게 판별될 수 있는 3 방향을 설정하는 제어메모리와, 상기 3방향의 볼에지를 검출하고, 이 3개의 볼에지에서 볼위치를 산출하는 연산제어부를 구비한 것을 특징으로 하는 와이어 본딩부의 볼 검출장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950020285A 1994-07-16 1995-07-11 와이어 본딩부의 볼 검출방법 및 검출장치 KR0169845B1 (ko)

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JP94-186507 1994-07-16
JP18650794A JP3235008B2 (ja) 1994-07-16 1994-07-16 ワイヤボンデイング部のボール検出方法及び検出装置

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KR960005908A true KR960005908A (ko) 1996-02-23
KR0169845B1 KR0169845B1 (ko) 1999-02-18

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US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US6118893A (en) * 1997-07-16 2000-09-12 Cognex Corporation Analysis of an image of a pattern of discrete objects
US6915006B2 (en) * 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6915007B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
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JP3235008B2 (ja) 2001-12-04
JPH0831863A (ja) 1996-02-02
US5870489A (en) 1999-02-09
KR0169845B1 (ko) 1999-02-18
TW346252U (en) 1998-11-21

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