KR950702029A - 신호의 기울기 측정을 이용한 종점 감지 기법(Endpoint Detection Technique Using Singnal Slope Determinations) - Google Patents
신호의 기울기 측정을 이용한 종점 감지 기법(Endpoint Detection Technique Using Singnal Slope Determinations)Info
- Publication number
- KR950702029A KR950702029A KR1019940704490A KR19940704490A KR950702029A KR 950702029 A KR950702029 A KR 950702029A KR 1019940704490 A KR1019940704490 A KR 1019940704490A KR 19940704490 A KR19940704490 A KR 19940704490A KR 950702029 A KR950702029 A KR 950702029A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- signal
- predetermined
- measuring
- values
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001514 detection method Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 61
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims abstract 35
- 230000005670 electromagnetic radiation Effects 0.000 claims 8
- 230000005855 radiation Effects 0.000 claims 5
- 230000000737 periodic effect Effects 0.000 claims 4
- 230000010355 oscillation Effects 0.000 claims 2
- 235000014653 Carica parviflora Nutrition 0.000 claims 1
- 241000243321 Cnidaria Species 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Drying Of Semiconductors (AREA)
- Image Processing (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89613792A | 1992-06-09 | 1992-06-09 | |
US07/896,137 | 1992-06-09 | ||
PCT/US1993/004936 WO1993025893A1 (en) | 1992-06-09 | 1993-05-24 | Endpoint detection technique using signal slope determinations |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950702029A true KR950702029A (ko) | 1995-05-17 |
Family
ID=25405691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940704490A Withdrawn KR950702029A (ko) | 1992-06-09 | 1993-05-24 | 신호의 기울기 측정을 이용한 종점 감지 기법(Endpoint Detection Technique Using Singnal Slope Determinations) |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0645008A1 (enrdf_load_stackoverflow) |
JP (1) | JP3375338B2 (enrdf_load_stackoverflow) |
KR (1) | KR950702029A (enrdf_load_stackoverflow) |
TW (1) | TW223176B (enrdf_load_stackoverflow) |
WO (1) | WO1993025893A1 (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5738756A (en) * | 1995-06-30 | 1998-04-14 | Lam Research Corporation | Method and apparatus for detecting optimal endpoints in plasma etch processes |
US6010538A (en) * | 1996-01-11 | 2000-01-04 | Luxtron Corporation | In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link |
US6028669A (en) * | 1997-07-23 | 2000-02-22 | Luxtron Corporation | Signal processing for in situ monitoring of the formation or removal of a transparent layer |
US6570662B1 (en) | 1999-05-24 | 2003-05-27 | Luxtron Corporation | Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers |
WO2000071971A1 (en) | 1999-05-24 | 2000-11-30 | Luxtron Corporation | Optical techniques for measuring layer thicknesses |
CN114112944A (zh) * | 2022-01-25 | 2022-03-01 | 武汉精立电子技术有限公司 | 一种显示面板测量方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4679938A (en) * | 1985-06-03 | 1987-07-14 | International Business Machines Corporation | Defect detection in films on ceramic substrates |
US5021362A (en) | 1989-12-29 | 1991-06-04 | At&T Bell Laboratories | Laser link blowing in integrateed circuit fabrication |
US5196285A (en) * | 1990-05-18 | 1993-03-23 | Xinix, Inc. | Method for control of photoresist develop processes |
US5160576A (en) * | 1991-03-05 | 1992-11-03 | Lam Research Corporation | Method of end point detection in a plasma etching process |
-
1993
- 1993-05-24 WO PCT/US1993/004936 patent/WO1993025893A1/en not_active Application Discontinuation
- 1993-05-24 KR KR1019940704490A patent/KR950702029A/ko not_active Withdrawn
- 1993-05-24 EP EP93914123A patent/EP0645008A1/en not_active Withdrawn
- 1993-05-24 JP JP50149994A patent/JP3375338B2/ja not_active Expired - Lifetime
- 1993-07-13 TW TW082105546A patent/TW223176B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP0645008A1 (en) | 1995-03-29 |
TW223176B (enrdf_load_stackoverflow) | 1994-05-01 |
JP3375338B2 (ja) | 2003-02-10 |
JPH07507904A (ja) | 1995-08-31 |
WO1993025893A1 (en) | 1993-12-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 19941209 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
PC1203 | Withdrawal of no request for examination | ||
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |