TW223176B - - Google Patents

Info

Publication number
TW223176B
TW223176B TW082105546A TW82105546A TW223176B TW 223176 B TW223176 B TW 223176B TW 082105546 A TW082105546 A TW 082105546A TW 82105546 A TW82105546 A TW 82105546A TW 223176 B TW223176 B TW 223176B
Authority
TW
Taiwan
Application number
TW082105546A
Other languages
Chinese (zh)
Original Assignee
Luxtron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25405691&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW223176(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Luxtron Corp filed Critical Luxtron Corp
Application granted granted Critical
Publication of TW223176B publication Critical patent/TW223176B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Drying Of Semiconductors (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Image Processing (AREA)
TW082105546A 1992-06-09 1993-07-13 TW223176B (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US89613792A 1992-06-09 1992-06-09

Publications (1)

Publication Number Publication Date
TW223176B true TW223176B (enrdf_load_stackoverflow) 1994-05-01

Family

ID=25405691

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082105546A TW223176B (enrdf_load_stackoverflow) 1992-06-09 1993-07-13

Country Status (5)

Country Link
EP (1) EP0645008A1 (enrdf_load_stackoverflow)
JP (1) JP3375338B2 (enrdf_load_stackoverflow)
KR (1) KR950702029A (enrdf_load_stackoverflow)
TW (1) TW223176B (enrdf_load_stackoverflow)
WO (1) WO1993025893A1 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738756A (en) * 1995-06-30 1998-04-14 Lam Research Corporation Method and apparatus for detecting optimal endpoints in plasma etch processes
US6010538A (en) * 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US6028669A (en) * 1997-07-23 2000-02-22 Luxtron Corporation Signal processing for in situ monitoring of the formation or removal of a transparent layer
WO2000071971A1 (en) 1999-05-24 2000-11-30 Luxtron Corporation Optical techniques for measuring layer thicknesses
US6570662B1 (en) 1999-05-24 2003-05-27 Luxtron Corporation Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers
CN114112944A (zh) * 2022-01-25 2022-03-01 武汉精立电子技术有限公司 一种显示面板测量方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679938A (en) * 1985-06-03 1987-07-14 International Business Machines Corporation Defect detection in films on ceramic substrates
US5021362A (en) 1989-12-29 1991-06-04 At&T Bell Laboratories Laser link blowing in integrateed circuit fabrication
US5196285A (en) * 1990-05-18 1993-03-23 Xinix, Inc. Method for control of photoresist develop processes
US5160576A (en) * 1991-03-05 1992-11-03 Lam Research Corporation Method of end point detection in a plasma etching process

Also Published As

Publication number Publication date
KR950702029A (ko) 1995-05-17
EP0645008A1 (en) 1995-03-29
JPH07507904A (ja) 1995-08-31
WO1993025893A1 (en) 1993-12-23
JP3375338B2 (ja) 2003-02-10

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