JP3375338B2 - 信号の傾斜決定を用いたエンドポイント検出技術 - Google Patents
信号の傾斜決定を用いたエンドポイント検出技術Info
- Publication number
- JP3375338B2 JP3375338B2 JP50149994A JP50149994A JP3375338B2 JP 3375338 B2 JP3375338 B2 JP 3375338B2 JP 50149994 A JP50149994 A JP 50149994A JP 50149994 A JP50149994 A JP 50149994A JP 3375338 B2 JP3375338 B2 JP 3375338B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- signal
- detecting
- change
- breakthrough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 claims description 193
- 239000000463 material Substances 0.000 claims description 60
- 229920002120 photoresistant polymer Polymers 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 17
- 238000012544 monitoring process Methods 0.000 claims description 13
- 230000005670 electromagnetic radiation Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 claims description 4
- 230000000737 periodic effect Effects 0.000 claims 3
- 230000002123 temporal effect Effects 0.000 claims 3
- 230000004048 modification Effects 0.000 claims 2
- 238000012986 modification Methods 0.000 claims 2
- 238000009832 plasma treatment Methods 0.000 claims 1
- 238000005070 sampling Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 35
- 238000011161 development Methods 0.000 description 25
- 230000018109 developmental process Effects 0.000 description 25
- 235000012431 wafers Nutrition 0.000 description 20
- 230000010355 oscillation Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004422 calculation algorithm Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000036039 immunity Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004435 EPR spectroscopy Methods 0.000 description 1
- 238000012369 In process control Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004737 colorimetric analysis Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000010965 in-process control Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Drying Of Semiconductors (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Image Processing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89613792A | 1992-06-09 | 1992-06-09 | |
US896,137 | 1992-06-09 | ||
PCT/US1993/004936 WO1993025893A1 (en) | 1992-06-09 | 1993-05-24 | Endpoint detection technique using signal slope determinations |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07507904A JPH07507904A (ja) | 1995-08-31 |
JP3375338B2 true JP3375338B2 (ja) | 2003-02-10 |
Family
ID=25405691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50149994A Expired - Lifetime JP3375338B2 (ja) | 1992-06-09 | 1993-05-24 | 信号の傾斜決定を用いたエンドポイント検出技術 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0645008A1 (enrdf_load_stackoverflow) |
JP (1) | JP3375338B2 (enrdf_load_stackoverflow) |
KR (1) | KR950702029A (enrdf_load_stackoverflow) |
TW (1) | TW223176B (enrdf_load_stackoverflow) |
WO (1) | WO1993025893A1 (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5738756A (en) * | 1995-06-30 | 1998-04-14 | Lam Research Corporation | Method and apparatus for detecting optimal endpoints in plasma etch processes |
US6010538A (en) * | 1996-01-11 | 2000-01-04 | Luxtron Corporation | In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link |
US6028669A (en) * | 1997-07-23 | 2000-02-22 | Luxtron Corporation | Signal processing for in situ monitoring of the formation or removal of a transparent layer |
WO2000071971A1 (en) | 1999-05-24 | 2000-11-30 | Luxtron Corporation | Optical techniques for measuring layer thicknesses |
US6570662B1 (en) | 1999-05-24 | 2003-05-27 | Luxtron Corporation | Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers |
CN114112944A (zh) * | 2022-01-25 | 2022-03-01 | 武汉精立电子技术有限公司 | 一种显示面板测量方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5021362A (en) | 1989-12-29 | 1991-06-04 | At&T Bell Laboratories | Laser link blowing in integrateed circuit fabrication |
WO1991018322A1 (en) | 1990-05-18 | 1991-11-28 | Xinix, Inc. | Method for control of photoresist develop processes |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4679938A (en) * | 1985-06-03 | 1987-07-14 | International Business Machines Corporation | Defect detection in films on ceramic substrates |
US5160576A (en) * | 1991-03-05 | 1992-11-03 | Lam Research Corporation | Method of end point detection in a plasma etching process |
-
1993
- 1993-05-24 JP JP50149994A patent/JP3375338B2/ja not_active Expired - Lifetime
- 1993-05-24 WO PCT/US1993/004936 patent/WO1993025893A1/en not_active Application Discontinuation
- 1993-05-24 EP EP93914123A patent/EP0645008A1/en not_active Withdrawn
- 1993-05-24 KR KR1019940704490A patent/KR950702029A/ko not_active Withdrawn
- 1993-07-13 TW TW082105546A patent/TW223176B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5021362A (en) | 1989-12-29 | 1991-06-04 | At&T Bell Laboratories | Laser link blowing in integrateed circuit fabrication |
WO1991018322A1 (en) | 1990-05-18 | 1991-11-28 | Xinix, Inc. | Method for control of photoresist develop processes |
Also Published As
Publication number | Publication date |
---|---|
TW223176B (enrdf_load_stackoverflow) | 1994-05-01 |
KR950702029A (ko) | 1995-05-17 |
EP0645008A1 (en) | 1995-03-29 |
JPH07507904A (ja) | 1995-08-31 |
WO1993025893A1 (en) | 1993-12-23 |
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