KR950034078A - 도체 패턴을 구비한 두 스트립의 접속 방법 및 그 방법에 따라 상호 접속된 두 스트립을 갖는 자기 헤드 - Google Patents
도체 패턴을 구비한 두 스트립의 접속 방법 및 그 방법에 따라 상호 접속된 두 스트립을 갖는 자기 헤드 Download PDFInfo
- Publication number
- KR950034078A KR950034078A KR1019950009373A KR19950009373A KR950034078A KR 950034078 A KR950034078 A KR 950034078A KR 1019950009373 A KR1019950009373 A KR 1019950009373A KR 19950009373 A KR19950009373 A KR 19950009373A KR 950034078 A KR950034078 A KR 950034078A
- Authority
- KR
- South Korea
- Prior art keywords
- strips
- free
- conductor
- conductor pattern
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000004020 conductor Substances 0.000 title claims abstract 30
- 238000000576 coating method Methods 0.000 claims abstract 13
- 239000000853 adhesive Substances 0.000 claims abstract 9
- 230000001070 adhesive effect Effects 0.000 claims abstract 9
- 239000011248 coating agent Substances 0.000 claims abstract 8
- 239000007787 solid Substances 0.000 claims 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
- Y10T29/49201—Assembling elongated conductors, e.g., splicing, etc. with overlapping orienting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Magnetic Heads (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Toys (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE9400416 | 1994-04-22 | ||
| BE9400416A BE1008374A3 (nl) | 1994-04-22 | 1994-04-22 | Werkwijze voor het verbinden van twee van sporenpatronen voorziene strippen, alsmede magneetkop voorzien van twee volgens de werkwijze met elkaar verbonden strippen. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR950034078A true KR950034078A (ko) | 1995-12-26 |
Family
ID=3888116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950009373A Abandoned KR950034078A (ko) | 1994-04-22 | 1995-04-21 | 도체 패턴을 구비한 두 스트립의 접속 방법 및 그 방법에 따라 상호 접속된 두 스트립을 갖는 자기 헤드 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5640759A (OSRAM) |
| EP (1) | EP0678933B1 (OSRAM) |
| JP (1) | JPH07302971A (OSRAM) |
| KR (1) | KR950034078A (OSRAM) |
| BE (1) | BE1008374A3 (OSRAM) |
| DE (1) | DE69511928T2 (OSRAM) |
| TW (1) | TW296450B (OSRAM) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3646670A (en) * | 1968-07-19 | 1972-03-07 | Hitachi Chemical Co Ltd | Method for connecting conductors |
| AT303049B (de) * | 1971-02-03 | 1972-11-10 | Sauter Dr Fritz | Verfahren zur Herstellung von neuen 3,4-Dihydro-thieno-[2,3-d][1,2,3]triazin-4-on-Derivaten und ihren Salzen |
| JPS5357481A (en) * | 1976-11-04 | 1978-05-24 | Canon Inc | Connecting process |
| FR2541828B1 (fr) * | 1983-02-28 | 1985-09-13 | Inf Milit Spatiale Aeronaut | Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif |
| JPS618708A (ja) * | 1984-06-22 | 1986-01-16 | Tokyo Electric Co Ltd | 磁気ヘツドにおけるコイル引出し線の固定方法 |
| JPH03106578A (ja) * | 1989-09-20 | 1991-05-07 | Sumitomo Special Metals Co Ltd | スポット状部分クラッド材の製造方法 |
| JP2946737B2 (ja) * | 1990-11-05 | 1999-09-06 | 松下電器産業株式会社 | 磁気ヘッドのリード線固定方法 |
| JP2931477B2 (ja) * | 1991-06-07 | 1999-08-09 | シャープ株式会社 | 薄膜磁気ヘッド構造体およびその製造方法 |
-
1994
- 1994-04-22 BE BE9400416A patent/BE1008374A3/nl not_active IP Right Cessation
-
1995
- 1995-04-07 US US08/420,252 patent/US5640759A/en not_active Expired - Fee Related
- 1995-04-12 TW TW084103537A patent/TW296450B/zh active
- 1995-04-18 EP EP95200971A patent/EP0678933B1/en not_active Expired - Lifetime
- 1995-04-18 DE DE69511928T patent/DE69511928T2/de not_active Expired - Fee Related
- 1995-04-21 KR KR1019950009373A patent/KR950034078A/ko not_active Abandoned
- 1995-04-21 JP JP7096826A patent/JPH07302971A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07302971A (ja) | 1995-11-14 |
| EP0678933A1 (en) | 1995-10-25 |
| BE1008374A3 (nl) | 1996-04-02 |
| DE69511928T2 (de) | 2000-07-20 |
| EP0678933B1 (en) | 1999-09-08 |
| TW296450B (OSRAM) | 1997-01-21 |
| DE69511928D1 (de) | 1999-10-14 |
| US5640759A (en) | 1997-06-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19950421 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20000420 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19950421 Comment text: Patent Application |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20020328 |
|
| NORF | Unpaid initial registration fee | ||
| PC1904 | Unpaid initial registration fee |