KR950009001Y1 - 웨이퍼 부착판 - Google Patents

웨이퍼 부착판 Download PDF

Info

Publication number
KR950009001Y1
KR950009001Y1 KR92001498U KR920001498U KR950009001Y1 KR 950009001 Y1 KR950009001 Y1 KR 950009001Y1 KR 92001498 U KR92001498 U KR 92001498U KR 920001498 U KR920001498 U KR 920001498U KR 950009001 Y1 KR950009001 Y1 KR 950009001Y1
Authority
KR
South Korea
Prior art keywords
wafer
attachment
plate
identifier
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR92001498U
Other languages
English (en)
Korean (ko)
Other versions
KR920017216U (ko
Inventor
노리요시 요코스카
Original Assignee
엔야 료오조오
카부시키가이샤 엔야 시스템
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔야 료오조오, 카부시키가이샤 엔야 시스템 filed Critical 엔야 료오조오
Publication of KR920017216U publication Critical patent/KR920017216U/ko
Application granted granted Critical
Publication of KR950009001Y1 publication Critical patent/KR950009001Y1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR92001498U 1991-02-05 1992-01-31 웨이퍼 부착판 Expired - Fee Related KR950009001Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-10385 1991-02-05
JP1991010385U JPH0710493Y2 (ja) 1991-02-05 1991-02-05 ウエーハ貼付板

Publications (2)

Publication Number Publication Date
KR920017216U KR920017216U (ko) 1992-09-17
KR950009001Y1 true KR950009001Y1 (ko) 1995-10-18

Family

ID=11748656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92001498U Expired - Fee Related KR950009001Y1 (ko) 1991-02-05 1992-01-31 웨이퍼 부착판

Country Status (4)

Country Link
US (1) US5248024A (https=)
EP (1) EP0499084A1 (https=)
JP (1) JPH0710493Y2 (https=)
KR (1) KR950009001Y1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5975986A (en) * 1997-08-08 1999-11-02 Speedfam-Ipec Corporation Index table and drive mechanism for a chemical mechanical planarization machine
US6126382A (en) * 1997-11-26 2000-10-03 Novellus Systems, Inc. Apparatus for aligning substrate to chuck in processing chamber
US6367529B1 (en) 1998-05-01 2002-04-09 Fujikoshi Kikai Kogyo Kabushiki Kaisha Method of adhering wafers and wafer adhering device
US6411215B1 (en) * 1999-02-19 2002-06-25 J. Mitchell Shnier Optical methods for detecting the position or state of an object
JP4700819B2 (ja) 2000-03-10 2011-06-15 キヤノン株式会社 基板保持装置、半導体製造装置および半導体デバイス製造方法
JP4663133B2 (ja) * 2001-01-09 2011-03-30 不二越機械工業株式会社 ウェーハの貼付方法及びその装置
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP2009289882A (ja) * 2008-05-28 2009-12-10 Kyocera Corp キャリアプレートおよびこれを用いた研磨装置
CN108818299B (zh) * 2018-06-06 2023-08-18 太仓鉴崧实业有限公司 一种交叉运转的磨盘结构及其工作方法
JP7620379B2 (ja) * 2020-12-23 2025-01-23 株式会社ディスコ 保持テーブル及び切削装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054202A (en) * 1975-08-06 1977-10-18 Societe Anonyme Dite: Etude Et Realisation De Chaines Automatiques Erca Stepwise drive mechanism
GB1533437A (en) * 1976-02-14 1978-11-22 Kubota Ltd Apparatus for indicating measured valves
JPS6138181Y2 (https=) * 1980-04-15 1986-11-05
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
US4412609A (en) * 1981-06-29 1983-11-01 Honeywell Information Systems Inc. Transport system
JPS6072646A (ja) * 1983-09-29 1985-04-24 O C C:Kk 一方向凝固組織からなる金属成形体の水平連続鋳造法および装置
US4677604A (en) * 1985-02-04 1987-06-30 Selsys Corporation Method for controlling access to recorded data
US4744713A (en) * 1986-05-21 1988-05-17 Texas Instruments Incorporated Misalignment sensor for a wafer feeder assembly
US4787128A (en) * 1986-07-02 1988-11-29 J. L. Wickham Co. Modularly expandable integrated process machine system and rotary indexing mechanism therefor
JPH0644594Y2 (ja) * 1986-10-30 1994-11-16 京セラ株式会社 セラミック盤
US4819923A (en) * 1987-05-27 1989-04-11 Zumbusch Peter C Gearless indexing device
JPH084105B2 (ja) * 1987-06-19 1996-01-17 株式会社エンヤシステム ウェハ接着方法
EP0348757B1 (en) * 1988-06-28 1995-01-04 Mitsubishi Materials Silicon Corporation Method for polishing a silicon wafer
JPH02110707A (ja) * 1988-10-20 1990-04-23 Fanuc Ltd リファレンス点復帰方式
US4936559A (en) * 1988-11-18 1990-06-26 Antonio Diaz Torga Indexing work-piece holder for numerically-controlled machine tools
JPH02295141A (ja) * 1989-05-09 1990-12-06 Nec Corp 配線基板及びそのワイヤボンディング方法

Also Published As

Publication number Publication date
US5248024A (en) 1993-09-28
JPH0499829U (https=) 1992-08-28
EP0499084A1 (en) 1992-08-19
JPH0710493Y2 (ja) 1995-03-08
KR920017216U (ko) 1992-09-17

Similar Documents

Publication Publication Date Title
KR950009001Y1 (ko) 웨이퍼 부착판
EP1099511B1 (en) Rotary tool including a cutting blade and cutting apparatus comprising the same
US11654520B2 (en) Cutting apparatus
EP1263026A2 (en) Wafer planarization apparatus
DE68920365D1 (de) Verfahren zur Polierung eines Halbleiter-Plättchens.
KR102186215B1 (ko) 절삭 장치
JP2003133261A (ja) 半導体装置の製造方法
EP1072359A3 (en) Semiconductor wafer polishing apparatus
DE102021209904A1 (de) Haltetisch
KR20180123018A (ko) 기판 전사 방법 및 기판 전사 장치
US4346124A (en) Method of applying an adhesive to a circuit chip
JP3325650B2 (ja) ウェーハの研磨方法
US11491669B2 (en) Cutting apparatus, cutting blade replacement method, and board replacement method
US20050091863A1 (en) Calibration wafer and kit
JP6232247B2 (ja) 被加工物保持機構
US5967885A (en) Method of manufacturing an integrated circuit using chemical mechanical polishing
EP0940723A3 (en) Sample table for pattern exposure machine
EP1120193A4 (en) UNPOLISHED WORKPIECE HOLDING SURFACE AND THEIR PRODUCTION METHOD, METHOD AND POLISHING DEVICE
JPH07283295A (ja) シート保持治具
JP5558300B2 (ja) 粘着シート貼り替え用補助治具
US4394844A (en) Chip coater
CN109844909A (zh) 晶片的制造方法及晶片
JP2562044Y2 (ja) ウエ−ハ貼付装置
KR20190078941A (ko) 연마 패드 및 이를 사용한 웨이퍼 가공 방법
EP0923122B1 (en) Method of manufacturing an integrated circuit using chemical mechanical polishing and fixture for chemical mechanical polishing

Legal Events

Date Code Title Description
R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

UA0108 Application for utility model registration

St.27 status event code: A-0-1-A10-A12-nap-UA0108

A201 Request for examination
UA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-UA0201

UG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-UG1501

UG1604 Publication of application

St.27 status event code: A-2-2-Q10-Q13-nap-UG1604

E701 Decision to grant or registration of patent right
UE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-UE0701

REGI Registration of establishment
UR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-UR0701

UR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-UR1002

Fee payment year number: 1

UR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-UR1001

Fee payment year number: 4

UR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-UR1001

Fee payment year number: 5

UR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-UR1001

Fee payment year number: 6

UR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-UR1001

Fee payment year number: 7

UR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-UR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20031013

Year of fee payment: 9

UR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-UR1001

Fee payment year number: 9

LAPS Lapse due to unpaid annual fee
UC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-UC1903

Not in force date: 20041019

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

UC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-UC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20041019

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000