KR940702640A - 후막 ntc 써미스터 조성물 - Google Patents

후막 ntc 써미스터 조성물

Info

Publication number
KR940702640A
KR940702640A KR1019940701000A KR19940701000A KR940702640A KR 940702640 A KR940702640 A KR 940702640A KR 1019940701000 A KR1019940701000 A KR 1019940701000A KR 19940701000 A KR19940701000 A KR 19940701000A KR 940702640 A KR940702640 A KR 940702640A
Authority
KR
South Korea
Prior art keywords
composition
metal oxide
weight
inorganic binder
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019940701000A
Other languages
English (en)
Korean (ko)
Inventor
제이콥 호르매들리
Original Assignee
미리암 디. 메코너헤이
이. 아이. 듀폰 디 네모아 앤드 캄파니(E. I Du Pont De Nemours and Company)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미리암 디. 메코너헤이, 이. 아이. 듀폰 디 네모아 앤드 캄파니(E. I Du Pont De Nemours and Company) filed Critical 미리암 디. 메코너헤이
Publication of KR940702640A publication Critical patent/KR940702640A/ko
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
    • H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Glass Compositions (AREA)
  • Non-Adjustable Resistors (AREA)
KR1019940701000A 1991-09-30 1992-09-30 후막 ntc 써미스터 조성물 Granted KR940702640A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/767,845 US5122302A (en) 1991-09-30 1991-09-30 Thick film NTC thermistor compositions
US07/767,845 1991-09-30
PCT/US1992/008143 WO1993007631A1 (en) 1991-09-30 1992-09-30 Thick film ntc thermistor compositions

Publications (1)

Publication Number Publication Date
KR940702640A true KR940702640A (ko) 1994-08-20

Family

ID=25080756

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019940701000A Granted KR940702640A (ko) 1991-09-30 1992-09-30 후막 ntc 써미스터 조성물
KR1019940701000A Expired - Fee Related KR0130830B1 (ko) 1991-09-30 1992-09-30 후막 NTC 써미스터 조성물(Thick Film NTC Thermistor Compositions)

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019940701000A Expired - Fee Related KR0130830B1 (ko) 1991-09-30 1992-09-30 후막 NTC 써미스터 조성물(Thick Film NTC Thermistor Compositions)

Country Status (8)

Country Link
US (1) US5122302A (enExample)
EP (1) EP0606364B1 (enExample)
JP (1) JP3273610B2 (enExample)
KR (2) KR940702640A (enExample)
CN (1) CN1029497C (enExample)
DE (1) DE69204074T2 (enExample)
TW (1) TW234193B (enExample)
WO (1) WO1993007631A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230090901A (ko) 2021-12-15 2023-06-22 주식회사와이테크 저저항 ntc 서미스터 후막 제조용 조성물 및 그 제조방법

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242623A (en) * 1991-08-13 1993-09-07 E. I. Du Pont De Nemours And Company Screen-printable thick film paste composition
US5122302A (en) * 1991-09-30 1992-06-16 E. I. Du Pont De Nemours And Company Thick film NTC thermistor compositions
US5352194A (en) * 1992-06-29 1994-10-04 University Of Pittsburgh Automated device for liposuction
US5491118A (en) * 1994-12-20 1996-02-13 E. I. Du Pont De Nemours And Company Cadmium-free and lead-free thick film paste composition
US6146743A (en) * 1997-02-21 2000-11-14 Medtronic, Inc. Barrier metallization in ceramic substrate for implantable medical devices
US5855995A (en) * 1997-02-21 1999-01-05 Medtronic, Inc. Ceramic substrate for implantable medical devices
US6066271A (en) * 1997-09-05 2000-05-23 Ben Gurion University Of The Negev Cobalt ruthenate thermistors
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
US6269695B1 (en) * 1998-03-05 2001-08-07 Nartron Corporation Analog liquid level sensor
JP2005259823A (ja) * 2004-03-09 2005-09-22 Tdk Corp 有機ｐｔｃサーミスタ及びその製造方法
ATE553632T1 (de) * 2004-09-30 2012-04-15 Watlow Electric Mfg Modulares geschichtetes heizsystem
JP4791872B2 (ja) * 2006-03-30 2011-10-12 株式会社ノリタケカンパニーリミテド 導電性ペースト
CN105304242B (zh) * 2014-07-31 2018-08-14 中国振华集团云科电子有限公司 一种低b值高阻值厚膜ntc浆料的制备方法
CN104193305B (zh) * 2014-08-18 2016-01-06 广东风华高新科技股份有限公司 Ntc热敏电阻材料及其制备方法与ntc热敏电阻器及其制备方法
CN108597706B (zh) * 2018-02-07 2020-05-12 北京大学深圳研究生院 一种电阻tcr调零方法
EP3942578A4 (en) * 2019-06-10 2023-01-18 Ferro Corporation HIGH ADHESION RESISTANCE COMPOSITION
TWI858856B (zh) 2023-08-09 2024-10-11 國巨股份有限公司 熱敏電阻膏體及其製作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4302362A (en) * 1979-01-23 1981-11-24 E. I. Du Pont De Nemours And Company Stable pyrochlore resistor compositions
US4539223A (en) * 1984-12-19 1985-09-03 E. I. Du Pont De Nemours And Company Thick film resistor compositions
US4651126A (en) * 1985-05-02 1987-03-17 Shailendra Kumar Electrical resistor material, resistor made therefrom and method of making the same
US4906406A (en) * 1988-07-21 1990-03-06 E. I. Du Pont De Nemours And Company Thermistor composition
JPH0736361B2 (ja) * 1989-03-22 1995-04-19 株式会社村田製作所 抵抗材料、その製造方法およびそれを用いた抵抗ペースト
US5122302A (en) * 1991-09-30 1992-06-16 E. I. Du Pont De Nemours And Company Thick film NTC thermistor compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230090901A (ko) 2021-12-15 2023-06-22 주식회사와이테크 저저항 ntc 서미스터 후막 제조용 조성물 및 그 제조방법

Also Published As

Publication number Publication date
JP3273610B2 (ja) 2002-04-08
JPH06511112A (ja) 1994-12-08
WO1993007631A1 (en) 1993-04-15
DE69204074D1 (de) 1995-09-14
DE69204074T2 (de) 1996-02-15
EP0606364A1 (en) 1994-07-20
US5122302A (en) 1992-06-16
CN1073033A (zh) 1993-06-09
TW234193B (enExample) 1994-11-11
EP0606364B1 (en) 1995-08-09
CN1029497C (zh) 1995-08-09
KR0130830B1 (ko) 1998-05-15

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