JP3273610B2 - 厚膜ntcサーミスター組成物 - Google Patents

厚膜ntcサーミスター組成物

Info

Publication number
JP3273610B2
JP3273610B2 JP50695793A JP50695793A JP3273610B2 JP 3273610 B2 JP3273610 B2 JP 3273610B2 JP 50695793 A JP50695793 A JP 50695793A JP 50695793 A JP50695793 A JP 50695793A JP 3273610 B2 JP3273610 B2 JP 3273610B2
Authority
JP
Japan
Prior art keywords
resistance
glass
ruo
weight
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP50695793A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06511112A (ja
Inventor
ホーマダリー,ジエイコブ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JPH06511112A publication Critical patent/JPH06511112A/ja
Application granted granted Critical
Publication of JP3273610B2 publication Critical patent/JP3273610B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/022Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
    • H01C7/023Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10Frit compositions, i.e. in a powdered or comminuted form containing lead
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/20Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Glass Compositions (AREA)
  • Non-Adjustable Resistors (AREA)
JP50695793A 1991-09-30 1992-09-30 厚膜ntcサーミスター組成物 Expired - Fee Related JP3273610B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/767,845 US5122302A (en) 1991-09-30 1991-09-30 Thick film NTC thermistor compositions
US767,845 1991-09-30
PCT/US1992/008143 WO1993007631A1 (en) 1991-09-30 1992-09-30 Thick film ntc thermistor compositions

Publications (2)

Publication Number Publication Date
JPH06511112A JPH06511112A (ja) 1994-12-08
JP3273610B2 true JP3273610B2 (ja) 2002-04-08

Family

ID=25080756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50695793A Expired - Fee Related JP3273610B2 (ja) 1991-09-30 1992-09-30 厚膜ntcサーミスター組成物

Country Status (8)

Country Link
US (1) US5122302A (enExample)
EP (1) EP0606364B1 (enExample)
JP (1) JP3273610B2 (enExample)
KR (2) KR0130830B1 (enExample)
CN (1) CN1029497C (enExample)
DE (1) DE69204074T2 (enExample)
TW (1) TW234193B (enExample)
WO (1) WO1993007631A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242623A (en) * 1991-08-13 1993-09-07 E. I. Du Pont De Nemours And Company Screen-printable thick film paste composition
US5122302A (en) * 1991-09-30 1992-06-16 E. I. Du Pont De Nemours And Company Thick film NTC thermistor compositions
US5352194A (en) * 1992-06-29 1994-10-04 University Of Pittsburgh Automated device for liposuction
US5491118A (en) * 1994-12-20 1996-02-13 E. I. Du Pont De Nemours And Company Cadmium-free and lead-free thick film paste composition
US6146743A (en) * 1997-02-21 2000-11-14 Medtronic, Inc. Barrier metallization in ceramic substrate for implantable medical devices
US5855995A (en) * 1997-02-21 1999-01-05 Medtronic, Inc. Ceramic substrate for implantable medical devices
US6066271A (en) * 1997-09-05 2000-05-23 Ben Gurion University Of The Negev Cobalt ruthenate thermistors
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
US6269695B1 (en) * 1998-03-05 2001-08-07 Nartron Corporation Analog liquid level sensor
JP2005259823A (ja) * 2004-03-09 2005-09-22 Tdk Corp 有機ptcサーミスタ及びその製造方法
CN101061752B (zh) * 2004-09-30 2011-03-16 沃特洛电气制造公司 模块化的层状加热系统
JP4791872B2 (ja) * 2006-03-30 2011-10-12 株式会社ノリタケカンパニーリミテド 導電性ペースト
CN105304242B (zh) * 2014-07-31 2018-08-14 中国振华集团云科电子有限公司 一种低b值高阻值厚膜ntc浆料的制备方法
CN104193305B (zh) * 2014-08-18 2016-01-06 广东风华高新科技股份有限公司 Ntc热敏电阻材料及其制备方法与ntc热敏电阻器及其制备方法
CN108597706B (zh) * 2018-02-07 2020-05-12 北京大学深圳研究生院 一种电阻tcr调零方法
WO2020251746A1 (en) * 2019-06-10 2020-12-17 Ferro Corporation High adhesion resistive composition
KR102623406B1 (ko) 2021-12-15 2024-01-11 주식회사와이테크 저저항 ntc 서미스터 후막 제조용 조성물 및 그 제조방법
TWI858856B (zh) 2023-08-09 2024-10-11 國巨股份有限公司 熱敏電阻膏體及其製作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4302362A (en) * 1979-01-23 1981-11-24 E. I. Du Pont De Nemours And Company Stable pyrochlore resistor compositions
US4539223A (en) * 1984-12-19 1985-09-03 E. I. Du Pont De Nemours And Company Thick film resistor compositions
US4651126A (en) * 1985-05-02 1987-03-17 Shailendra Kumar Electrical resistor material, resistor made therefrom and method of making the same
US4906406A (en) * 1988-07-21 1990-03-06 E. I. Du Pont De Nemours And Company Thermistor composition
JPH0736361B2 (ja) * 1989-03-22 1995-04-19 株式会社村田製作所 抵抗材料、その製造方法およびそれを用いた抵抗ペースト
US5122302A (en) * 1991-09-30 1992-06-16 E. I. Du Pont De Nemours And Company Thick film NTC thermistor compositions

Also Published As

Publication number Publication date
US5122302A (en) 1992-06-16
CN1073033A (zh) 1993-06-09
DE69204074T2 (de) 1996-02-15
EP0606364A1 (en) 1994-07-20
KR940702640A (ko) 1994-08-20
JPH06511112A (ja) 1994-12-08
EP0606364B1 (en) 1995-08-09
KR0130830B1 (ko) 1998-05-15
TW234193B (enExample) 1994-11-11
DE69204074D1 (de) 1995-09-14
WO1993007631A1 (en) 1993-04-15
CN1029497C (zh) 1995-08-09

Similar Documents

Publication Publication Date Title
JP3273610B2 (ja) 厚膜ntcサーミスター組成物
JP3907725B2 (ja) カドミウムおよび鉛を含有しない厚膜ペースト組成物
US4961999A (en) Thermistor composition
US4362656A (en) Thick film resistor compositions
EP0115798B1 (en) Stain-resistant ruthenium oxide-based resistors
KR900003174B1 (ko) 후막 저항기 조성물
US4906406A (en) Thermistor composition
US4657699A (en) Resistor compositions
EP0134037B1 (en) Hexaboride resistor composition
KR102341611B1 (ko) 정온도 계수 저항체용 조성물, 정온도 계수 저항체용 페이스트, 정온도 계수 저항체 및 정온도 계수 저항체의 제조 방법
EP0206282A2 (en) Hexaboride resistor composition
CN115443513A (zh) 厚膜电阻糊、厚膜电阻体和电子部件
JPH11157932A (ja) ルテニウム酸コバルトサーミスタ
JPH0581630B2 (enExample)
JPH0422005B2 (enExample)
JPH0378203A (ja) 抵抗体製造用組成物

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees