JPS54119695A - Composite material for thick film thermistor - Google Patents

Composite material for thick film thermistor

Info

Publication number
JPS54119695A
JPS54119695A JP2545878A JP2545878A JPS54119695A JP S54119695 A JPS54119695 A JP S54119695A JP 2545878 A JP2545878 A JP 2545878A JP 2545878 A JP2545878 A JP 2545878A JP S54119695 A JPS54119695 A JP S54119695A
Authority
JP
Japan
Prior art keywords
thick film
thermal expansion
expansion coefficient
linear thermal
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2545878A
Other languages
Japanese (ja)
Inventor
Hideo Arima
Akira Ikegami
Hiromi Tozaki
Teruo Busshu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2545878A priority Critical patent/JPS54119695A/en
Publication of JPS54119695A publication Critical patent/JPS54119695A/en
Pending legal-status Critical Current

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  • Thermistors And Varistors (AREA)

Abstract

PURPOSE: To stabilize the characteristics such as the resistance of a thick film thermistor, by making it from a thermistor material of linear thermal expansion coefficient not higher than a predetermined value, RuO2 and a binder glass of linear thermal expansion coefficient not higher than a predetermined value.
CONSTITUTION: At least two kinds of spinel-structure oxides of Mn, Co, Ni, Fe, Cu and Ru, the thermistor material of linear thermal expansion coefficient not higher than 105×10-7/°C, and the binder glass of linear thermal expansion coefficient not higher than 95×10-7/°C are mixed with one another. An organic vehicle is added to the powder of the mixture. Then, the mixture is kneaded to a paste. A thick film is made on an alumina substrate from the paste by printing. The thick film is baked at a temperature of 800 to 950°C.
COPYRIGHT: (C)1979,JPO&Japio
JP2545878A 1978-03-08 1978-03-08 Composite material for thick film thermistor Pending JPS54119695A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2545878A JPS54119695A (en) 1978-03-08 1978-03-08 Composite material for thick film thermistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2545878A JPS54119695A (en) 1978-03-08 1978-03-08 Composite material for thick film thermistor

Publications (1)

Publication Number Publication Date
JPS54119695A true JPS54119695A (en) 1979-09-17

Family

ID=12166580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2545878A Pending JPS54119695A (en) 1978-03-08 1978-03-08 Composite material for thick film thermistor

Country Status (1)

Country Link
JP (1) JPS54119695A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03184301A (en) * 1989-12-13 1991-08-12 Koa Corp Thick-film thermistor composition
JPH03185701A (en) * 1989-12-14 1991-08-13 Koa Corp Thick film thermistor composition
JPH047803A (en) * 1990-04-25 1992-01-13 Koa Corp Thick film thermistor composite
JPH05198407A (en) * 1991-12-11 1993-08-06 Toyama Pref Gov Thick film thermistor composition
US5510823A (en) * 1991-03-07 1996-04-23 Fuji Xerox Co., Ltd. Paste for resistive element film
US6045856A (en) * 1991-03-07 2000-04-04 Fuji Xerox Co., Ltd. Process for producing a resistive element by diffusing glass
CN105321642A (en) * 2014-07-31 2016-02-10 中国振华集团云科电子有限公司 Preparation method of high-TCR low square resistance linear NTC resistance paste

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03184301A (en) * 1989-12-13 1991-08-12 Koa Corp Thick-film thermistor composition
JPH03185701A (en) * 1989-12-14 1991-08-13 Koa Corp Thick film thermistor composition
JPH047803A (en) * 1990-04-25 1992-01-13 Koa Corp Thick film thermistor composite
US5510823A (en) * 1991-03-07 1996-04-23 Fuji Xerox Co., Ltd. Paste for resistive element film
US6045856A (en) * 1991-03-07 2000-04-04 Fuji Xerox Co., Ltd. Process for producing a resistive element by diffusing glass
JPH05198407A (en) * 1991-12-11 1993-08-06 Toyama Pref Gov Thick film thermistor composition
CN105321642A (en) * 2014-07-31 2016-02-10 中国振华集团云科电子有限公司 Preparation method of high-TCR low square resistance linear NTC resistance paste
CN105321642B (en) * 2014-07-31 2017-12-08 中国振华集团云科电子有限公司 A kind of preparation method of high TCR low square resistances LINEAR N TC resistance slurries

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