KR930020647A - 금속 발포체 방열기 - Google Patents

금속 발포체 방열기 Download PDF

Info

Publication number
KR930020647A
KR930020647A KR1019930003158A KR930003158A KR930020647A KR 930020647 A KR930020647 A KR 930020647A KR 1019930003158 A KR1019930003158 A KR 1019930003158A KR 930003158 A KR930003158 A KR 930003158A KR 930020647 A KR930020647 A KR 930020647A
Authority
KR
South Korea
Prior art keywords
metal foam
heat
heat sink
heat spreader
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019930003158A
Other languages
English (en)
Korean (ko)
Inventor
엔. 맥레란 로버트
Original Assignee
윌리엄 이. 힐러
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윌리엄 이. 힐러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 이. 힐러
Publication of KR930020647A publication Critical patent/KR930020647A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1019930003158A 1992-03-05 1993-03-04 금속 발포체 방열기 Withdrawn KR930020647A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84665092A 1992-03-05 1992-03-05
US846,650 1992-03-05

Publications (1)

Publication Number Publication Date
KR930020647A true KR930020647A (ko) 1993-10-20

Family

ID=25298541

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930003158A Withdrawn KR930020647A (ko) 1992-03-05 1993-03-04 금속 발포체 방열기

Country Status (4)

Country Link
EP (1) EP0559092A1 (enExample)
JP (1) JPH065751A (enExample)
KR (1) KR930020647A (enExample)
TW (1) TW255986B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100381303B1 (ko) * 2001-01-16 2003-04-26 윤재석 다공성 히트싱크
KR101012502B1 (ko) * 2008-08-20 2011-02-08 주식회사 현대엘이디 Ｌｅｄ 램프의 방열구조

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0579010A1 (en) * 1992-07-07 1994-01-19 International Business Machines Corporation Lightweight packaging
FR2775866B1 (fr) * 1998-03-03 2000-04-07 Telecommunications Sa Organe dissipateur de chaleur
DE19934554A1 (de) 1999-07-22 2001-01-25 Michael Stollenwerk Wärmetauscher
DE10055454A1 (de) * 2000-11-09 2002-05-23 Fujitsu Siemens Computers Gmbh Kühlkörper
US6888720B2 (en) * 2002-06-18 2005-05-03 Sun Microsystems, Inc. Distributed graphitic foam heat exchanger system
DE10324190B4 (de) * 2003-05-28 2009-07-23 M.Pore Gmbh Wärmetauscher
GB2404009B (en) * 2003-07-17 2005-06-15 Enfis Ltd Cooling method and apparatus
DE10340681B4 (de) * 2003-09-04 2006-09-28 M.Pore Gmbh Verfahren zur Herstellung einer stoffschlüssigen, wärmeleitenden Verbindung zwischen einer offenporigen Schaumstruktur und einem nichtporösen Grundkörper für Wärmeübertrager, insbesonderer Kühlkörper
DE10343020B4 (de) * 2003-09-16 2018-01-18 Mayser Holding Gmbh & Co. Kg Kühlkörper, insbesondere für elektronische Bauelemente
DE10343151B4 (de) * 2003-09-18 2006-06-14 M.Pore Gmbh Instationärer Wärmetauscher
DE10346423B4 (de) * 2003-10-07 2006-07-13 M.Pore Gmbh Modularer Wärmetauscher
US6992887B2 (en) 2003-10-15 2006-01-31 Visteon Global Technologies, Inc. Liquid cooled semiconductor device
DE10352711B4 (de) * 2003-11-06 2015-05-13 Würth Elektronik Rot am See GmbH & Co. KG Leiterplattenanordnung
KR100584304B1 (ko) * 2004-04-30 2006-05-26 엘지전자 주식회사 흡열/발열 물품의 열전달 능력 향상 장치
DE102004021810A1 (de) * 2004-05-03 2005-12-01 Conti Temic Microelectronic Gmbh Elektronisches Bauelement sowie Verfahren zur Herstellung eines elektronischen Bauelementes
DE102005004695B3 (de) * 2005-02-02 2006-09-28 Fpe Fischer Gmbh Kühlkörper für elektrische Bauelemente
US9412926B2 (en) 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
CN100433391C (zh) * 2006-11-30 2008-11-12 何永祥 一种采用多孔金属材料作为散热装置的大功率发光二极管
DE102007021206A1 (de) 2007-05-05 2008-11-06 Hella Kgaa Hueck & Co. Kühlkörper
EP2071620A1 (en) * 2007-12-12 2009-06-17 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity
FR2961894B1 (fr) 2010-06-24 2013-09-13 Valeo Vision Dispositif a echange de chaleur, notamment pour vehicule automobile
EP2738800B1 (de) * 2012-09-18 2018-01-17 Glatt Systemtechnik GmbH System zur Temperierung von elektronischen oder optoelektronischen Bauelementen oder Baugruppen
WO2014052020A1 (en) * 2012-09-28 2014-04-03 Dow Global Technologies Llc Microsphere-filled-metal components for wireless-communication towers
JP2016503575A (ja) * 2012-09-28 2016-02-04 ダウ グローバル テクノロジーズ エルエルシー 無線通信タワー用の発泡金属コンポーネント
WO2014052018A1 (en) * 2012-09-28 2014-04-03 Dow Global Technologies Llc Low-density, metal-based components for wireless-communication towers
DE102012219673A1 (de) * 2012-10-26 2014-04-30 Robert Bosch Gmbh Anordnung zur induktiven Energieübertragung an ein elektrisch antreibbares Fahrzeug
JP2016184648A (ja) * 2015-03-26 2016-10-20 住友電気工業株式会社 ヒートシンク及び電子機器
US9813082B2 (en) * 2015-10-08 2017-11-07 Futurewei Technologies, Inc. Heat spreader with thermally coductive foam core
CN105871328A (zh) * 2016-06-03 2016-08-17 浙江人和光伏科技有限公司 一种太阳能电池用接线盒
CN106098564A (zh) * 2016-06-17 2016-11-09 重庆大学 用SiC作为基片的大功率半导体封装构造及其方法
US10782078B2 (en) 2016-09-13 2020-09-22 Bgt Materials Limited Heat dissipation coating layer and manufacturing method thereof
US10025359B2 (en) * 2016-09-29 2018-07-17 Intel Corporation Metal foam heat exchangers for dispersing exhaust flow

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0471552B1 (en) * 1990-08-14 1997-07-02 Texas Instruments Incorporated Heat transfer module for ultra high density and silicon on silicon packaging applications

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100381303B1 (ko) * 2001-01-16 2003-04-26 윤재석 다공성 히트싱크
KR101012502B1 (ko) * 2008-08-20 2011-02-08 주식회사 현대엘이디 Ｌｅｄ 램프의 방열구조

Also Published As

Publication number Publication date
TW255986B (enExample) 1995-09-01
EP0559092A1 (en) 1993-09-08
JPH065751A (ja) 1994-01-14

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Legal Events

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000