KR930020626A - 웨이퍼의 반송보관방법과 웨이퍼캐리어 - Google Patents

웨이퍼의 반송보관방법과 웨이퍼캐리어 Download PDF

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Publication number
KR930020626A
KR930020626A KR1019930002949A KR930002949A KR930020626A KR 930020626 A KR930020626 A KR 930020626A KR 1019930002949 A KR1019930002949 A KR 1019930002949A KR 930002949 A KR930002949 A KR 930002949A KR 930020626 A KR930020626 A KR 930020626A
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South Korea
Prior art keywords
wafer
stored
box
wafers
lid
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KR1019930002949A
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English (en)
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KR0130752B1 (en
Inventor
이치로 나카야마
마스오 탄노
카즈히로 모리
Original Assignee
다니이 아끼오
마쯔시다덴기산교 가부시기가이샤
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Publication of KR930020626A publication Critical patent/KR930020626A/ko
Priority to JP5665994A priority Critical patent/JPH06319313A/ja
Application granted granted Critical
Publication of KR0130752B1 publication Critical patent/KR0130752B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Containers And Packaging Bodies Having A Special Means To Remove Contents (AREA)

Abstract

본 발명은 반송이나 보관에 있어서, 웨이퍼의 손상등의 문제가 생기기 어렵고, 또 고속에서의 반송을 가능하게 하는 웨이퍼의 반송보관방법과, 개별의 웨이퍼를 취급하기에 편리한 웨이퍼캐리어를 제공하는 것을 목적으로 하며, 그 구성에 있어서, 평평한 상자체내에 웨이퍼 1매를 수납하고, 이 상자체를 1개씩 혹은 단쌓기해서 반송하거나, 보관하거나 한다. 이에 사용하는 웨이퍼캐리어는, 내부에 웨이퍼 1매를 수용하는 공간을 가지고 한쪽면이 웨이퍼출입구로서 개구하는 평평한 상자체와, 상기 출입구를 막는 개폐자재한 덮개를 구비하고 상기 공간의 상하면은 적어도 출입구로부터 본 양단부쪽의 부분이 중앙부쪽으로부터 단부쪽에 걸쳐서 서로의 간격이 점차 좁아지도록 경사지게 한 경사면으로 되어있고, 상기 상자체와 덮개의 사이에는 덮개를 폐쇄방향으로 부세하는 덮개부세수단을 구비한 동시에 상기 공간의 안쪽에는 웨이퍼를 출입구쪽으로 향해서 부세하는 웨이퍼부세수단도 구비한것을 특징으로 한다.
본 발명에 의하면 웨이퍼를 1매씩 캐리어에 수납해서 반송하거나 보관하거나 하므로 웨이퍼가 손상되지 않고, 고속에서의 웨이퍼의 반송이 가능하게 된다.

Description

웨이퍼의 반송보관방법과 웨이퍼캐리어
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 관한 웨이퍼캐리어의 일실시예를 표시한 사시도.
제2도는 캐리어내에서의 웨이퍼의 수용상태를 표시한 요부확대단면도.
제3도는 캐리어의 덮개장착상태를 표시한 부분측면도.
제4도는 본 발명에 관한 웨이퍼의 반송보관방법의 일실시예를 표시한 사시도.
제5도는(a)는 본 발명에 관한 웨이퍼의 반송보관방법의 다른 실시예를 표시한 사시도, (b)는 동측면도.
제6도(a)는 본 발명에 관한 웨이퍼의 반송보관방법의 또 다른 실시예를 표시한 사시도, (b)는 동측면도.

Claims (5)

  1. 평평한 상자체내에 웨이퍼 1매를 수납해서 반송하거나 보관하거나 하는 것을 특징으로 하는 웨이퍼의 반송보관방법.
  2. 제1항에 있어서, 웨이퍼를 수납한 상자체를 단쌓기해서 반송하거나 보관하거나 하는 것을 특징으로 하는 웨이퍼의 반송보관방법.
  3. 제1항에 있어서, 웨이퍼를 수납한 상자체를 1개씩 벨트위에 배열해서 반송하거나 보관하거나 하는 것을 특징으로 하는 웨이퍼의 반송보관방법.
  4. 제1항에 있어서, 웨이퍼를 수납한 상자체를 1개씩 테이프에 의해서 연결하여 반송하거나 보관하거나 하는 것을 특징으로 하는 웨이퍼의 반송보관방법.
  5. 내부에 웨이퍼 1매를 수용하는 공간을 가지고 한쪽면이 웨이퍼출입구로서 계구하는 평평한 상자체와 상기출입구를 막는 개폐자재한 덮개를 구비하는 동시에 상기 상자체와 덮개의 사이에는 덮개를 폐쇄방향으로 부세하는 덮개부세수단을, 또한 상기 상자체내의 공간의 안쪽에는 웨이퍼를 출입구쪽으로 향해서 부세하는 웨이퍼부세수단을 각각 구비하고, 상기 상자체내의 공간의 상하면은 적어도 출입구로부터 본 양단부쪽의 부분이 중앙부쪽으로부터 단부쪽에 걸쳐서 서로의 간격이 점차 좁아지도록 경사지게한 경사면으로 되어 있고, 또한 상기 웨이퍼부세수단은 상기 덮개가 폐쇄되었을 때에는 상기 공간에 수납된 웨이퍼를 압압 고정할 수 있도록 되어 있는 것을 특징으로 하는 웨이퍼캐리어.
    ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.
KR93002949A 1992-03-03 1993-03-02 Method for transporting / storing wafer and wafer carrier KR0130752B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5665994A JPH06319313A (ja) 1993-03-02 1994-03-02 種子の発芽帯製造装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-45339 1992-03-03
JP4045339A JP2970183B2 (ja) 1992-03-03 1992-03-03 ウエハの搬送保管方法とウエハキャリア

Publications (2)

Publication Number Publication Date
KR930020626A true KR930020626A (ko) 1993-10-20
KR0130752B1 KR0130752B1 (en) 1998-04-06

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ID=12716536

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93002949A KR0130752B1 (en) 1992-03-03 1993-03-02 Method for transporting / storing wafer and wafer carrier

Country Status (3)

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US (2) US5360106A (ko)
JP (1) JP2970183B2 (ko)
KR (1) KR0130752B1 (ko)

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KR100558471B1 (ko) * 1999-12-07 2006-03-07 삼성전자주식회사 반도체 디바이스 반송 시스템

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100558471B1 (ko) * 1999-12-07 2006-03-07 삼성전자주식회사 반도체 디바이스 반송 시스템

Also Published As

Publication number Publication date
US5360106A (en) 1994-11-01
US5502953A (en) 1996-04-02
JPH05246508A (ja) 1993-09-24
KR0130752B1 (en) 1998-04-06
JP2970183B2 (ja) 1999-11-02

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