KR930006866A - 페리클 접착장치 - Google Patents
페리클 접착장치 Download PDFInfo
- Publication number
- KR930006866A KR930006866A KR1019920017387A KR920017387A KR930006866A KR 930006866 A KR930006866 A KR 930006866A KR 1019920017387 A KR1019920017387 A KR 1019920017387A KR 920017387 A KR920017387 A KR 920017387A KR 930006866 A KR930006866 A KR 930006866A
- Authority
- KR
- South Korea
- Prior art keywords
- pellicle
- elastic
- entire circumference
- subscribers
- pellicle frame
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/40—Applying molten plastics, e.g. hot melt
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
본 발명은 페리클 프레임의 전체둘레를 완전접착하고, 먼지의 침입을 방지해서 노광 결함을 방지할 수 있는 페리클 접착장치를 제공하는 것을 목적으로 하는 것으로서, 그 구성에 있어서, 페리클 프레임(4),(5)의 가압력에 비해, 가압시 변형에 대한 반발력이 충분히 작은 탄성 가입자(37),(38)과, 페리클 프레임(4),(5)전체 둘레를 따라서 탄성 가입자(37),(38)을 개재해서 유체 압력을 균일하게 가하는 아압수단을 설정하므로서, 레크릴 유리(1)과 페리클 프레임(4),(5)를 균일하게 접착할 수 있는 것을 특징으로 한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일 실시예에 있어서의 페리클 접착 장치의 단면도,
제2도는 동장치로부터 가공된 레크틸유리에 페리클 프레임을 접착한 것을 표시한 도면,
제3도(a)는 본 발명의 일 실시예에 있어서의 페리클 접착 장치의 지지플레이트 및 튜브를 표시한 구성도,
제3도(b)는 본발명의 제2의 실시예에 있어서의 페리클 접착장치의 구성도.
Claims (1)
- 레크틸 유리의 양면 또는 한쪽면에 페리클 프레임을 가압 접착하는 페리클 접착장치에 있어서, 페리클 프레임에의 가압력에 비해, 가압시 변형에 대한 반발력이 충분히 작은 탄성 가압자와 페리클 프레임 전체둘레를 따라서 탄성 가압자를 개재해서 유체 압력을 균일하게 가하는 가압수단을 가진 것을 특징으로 하는 페리클 접착 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP91-248790 | 1991-09-27 | ||
JP3248790A JP2814785B2 (ja) | 1991-09-27 | 1991-09-27 | ペリクル接着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930006866A true KR930006866A (ko) | 1993-04-22 |
KR970001694B1 KR970001694B1 (ko) | 1997-02-13 |
Family
ID=17183440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920017387A KR970001694B1 (ko) | 1991-09-27 | 1992-09-24 | 페리클 접착장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5311250A (ko) |
JP (1) | JP2814785B2 (ko) |
KR (1) | KR970001694B1 (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5422704A (en) * | 1992-07-13 | 1995-06-06 | Intel Corporation | Pellicle frame |
JPH0772617A (ja) * | 1993-09-02 | 1995-03-17 | Shin Etsu Chem Co Ltd | ペリクル |
US5953107A (en) | 1997-03-07 | 1999-09-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask pellicle remove tool |
US6639650B2 (en) * | 1999-12-21 | 2003-10-28 | Shin-Etsu Chemical Co., Ltd. | Light exposure method, light exposure apparatus, pellicle and method for relieving warpage of pellicle membrane |
US6654077B1 (en) * | 2000-01-18 | 2003-11-25 | Aurora Systems, Inc. | Precision surface mount for a display device |
US6619359B2 (en) | 2001-02-16 | 2003-09-16 | Brooks Automation, Inc. | Pellicle mounting apparatus |
US6734445B2 (en) * | 2001-04-23 | 2004-05-11 | Intel Corporation | Mechanized retractable pellicles and methods of use |
DE10330907A1 (de) * | 2003-07-07 | 2005-02-03 | Dynamic Microsystems Semiconductor Equipment Gmbh | Vorrichtung und Verfahren zum Bearbeiten einer Maskenvorlage für die Halbleiterherstellung |
JP2007510937A (ja) * | 2003-10-06 | 2007-04-26 | トッパン、フォウタマスクス、インク | フォトマスク上にペリクル・アセンブリを自動的に装着するシステムおよび方法。 |
US6862817B1 (en) * | 2003-11-12 | 2005-03-08 | Asml Holding N.V. | Method and apparatus for kinematic registration of a reticle |
US20050157288A1 (en) * | 2003-11-26 | 2005-07-21 | Sematech, Inc. | Zero-force pellicle mount and method for manufacturing the same |
KR100624643B1 (ko) * | 2005-09-09 | 2006-09-15 | 민경준 | 페리클 접착장치 |
KR100596025B1 (ko) | 2005-12-07 | 2006-07-03 | 권선용 | 펠리클 프레임용 지그어셈블리 |
KR100742176B1 (ko) * | 2006-01-27 | 2007-07-24 | 주식회사 피케이엘 | 페리클 부착장치 |
KR100837282B1 (ko) | 2007-06-14 | 2008-06-12 | 삼성전자주식회사 | 비휘발성 메모리 장치, 그것을 포함하는 메모리 시스템,그것의 프로그램 방법 및 읽기 방법 |
KR101357305B1 (ko) | 2007-08-29 | 2014-01-28 | 삼성전자주식회사 | 펠리클 부착 장치 및 이를 이용한 펠리클 부착 방법 |
WO2009044483A1 (ja) * | 2007-10-05 | 2009-04-09 | Asahi Kasei Emd Corporation | ペリクル貼付装置のペリクル加圧機構 |
US8268514B2 (en) * | 2009-01-26 | 2012-09-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Pellicle mounting method and apparatus |
CN102472901B (zh) * | 2009-07-22 | 2014-10-15 | 夏普株式会社 | 液晶显示装置的制造装置和液晶显示装置的制造方法 |
JP5600921B2 (ja) * | 2009-10-19 | 2014-10-08 | 凸版印刷株式会社 | ペリクル貼付装置 |
JP2012112998A (ja) * | 2010-11-19 | 2012-06-14 | Shin Etsu Chem Co Ltd | リソグラフィ用ペリクルの貼り付け方法および装置 |
US9256142B2 (en) * | 2013-03-11 | 2016-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle mounting system and method |
CN113853550A (zh) * | 2019-02-28 | 2021-12-28 | Asml荷兰有限公司 | 用于组装掩模版组件的设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4443098A (en) * | 1982-12-21 | 1984-04-17 | General Signal Corporation | Pellicle mounting fixture |
JPS6238468A (ja) * | 1985-08-13 | 1987-02-19 | Oki Electric Ind Co Ltd | ペリクル装着装置 |
US4637713A (en) * | 1985-09-27 | 1987-01-20 | Scss Instruments, Inc. | Pellicle mounting apparatus |
KR910009320B1 (ko) * | 1986-08-19 | 1991-11-09 | 미쓰비시 마테리알 가부시기가이샤 | 연마장치 |
JPS6371852A (ja) * | 1986-09-16 | 1988-04-01 | Hitachi Ltd | 組立装置 |
-
1991
- 1991-09-27 JP JP3248790A patent/JP2814785B2/ja not_active Expired - Fee Related
-
1992
- 1992-09-24 KR KR1019920017387A patent/KR970001694B1/ko not_active IP Right Cessation
- 1992-09-25 US US07/950,946 patent/US5311250A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0588358A (ja) | 1993-04-09 |
JP2814785B2 (ja) | 1998-10-27 |
US5311250A (en) | 1994-05-10 |
KR970001694B1 (ko) | 1997-02-13 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050711 Year of fee payment: 9 |
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LAPS | Lapse due to unpaid annual fee |