KR930001322A - 레지스트 도포장치 - Google Patents

레지스트 도포장치 Download PDF

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Publication number
KR930001322A
KR930001322A KR1019920010019A KR920010019A KR930001322A KR 930001322 A KR930001322 A KR 930001322A KR 1019920010019 A KR1019920010019 A KR 1019920010019A KR 920010019 A KR920010019 A KR 920010019A KR 930001322 A KR930001322 A KR 930001322A
Authority
KR
South Korea
Prior art keywords
resist
solvent
nozzle
resist coating
space
Prior art date
Application number
KR1019920010019A
Other languages
English (en)
Other versions
KR100240460B1 (ko
Inventor
마사유끼 가미야
Original Assignee
오오가 노리오
소니 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오오가 노리오, 소니 가부시끼가이샤 filed Critical 오오가 노리오
Publication of KR930001322A publication Critical patent/KR930001322A/ko
Application granted granted Critical
Publication of KR100240460B1 publication Critical patent/KR100240460B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

(목적) 레지스트 토출노즐의 대기중에 있어서의 레지스트 경화를 방지한다.
(구성) 노즐대기부(13)를 수납체(22)내에 용제(24)를 저류하는 조와 용제 분위기를 발생시키는 공간(30)을 구성하고, 용제(24)중에, 기체도입파이프(26)에서 N2가스를 도입하여 버블링을 시행함으로써, 공간내의 용제분위기 농도를 높이도록 되어있다. 이 때문에, 노즐대기부(13)의 노즐삽입구멍(29)에 삽입된 레지스트 토출노즐(15)내의 레지스트(16)는, 고농도한 용제 분위기에 쬐여서 레지스트 경화가 방지된다.

Description

레지스트 도포장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 실시예의 레지스트 도포장치의 설명도.
제 2 도는 본 발명의 실시예의 노즐대기부의 단면도.
제 3 도는 본 발명의 실시예의 노즐대기부의 사시도.
제 4 도는 본 발명의 노즐대기부의 변형예를 나타내는 단면도.
제 5 도는 종래예의 단면도.
* 도면의 주요부분에 대한 부호의 설명
10 : 레지스트 도포장치 11 : 레지스트 공급수단
13 : 노즐대기부 15 : 레지스트 토출노즐
16 : 포토레지스트 23 : 기포
24 : 용제 26 : 기체 도입파이프

Claims (1)

  1. 포토레지스트를 레지스트 토출노즐에 공급가능한 레지스트 공급수단과, 상기 레지스트 토출노즐의 선단을 내부공간에 향하게한 상태에서 대기시킴과 동시에 용제가 상기 내부공간에 휘발가능하게 개방된 용제저장조를 내장하는 노즐대기부를 갖춘 레지스트 도포장치에 있어서,상기 노즐대기부의 내부공간으로 상기 용제속을 경유시킨 기체를 공급하는 것을 특징으로 하는 레지스트 도포장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019920010019A 1991-06-27 1992-06-10 레지스트 도포장치 KR100240460B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15639191A JP3168612B2 (ja) 1991-06-27 1991-06-27 レジスト塗布装置
JP91-156391 1991-06-27

Publications (2)

Publication Number Publication Date
KR930001322A true KR930001322A (ko) 1993-01-16
KR100240460B1 KR100240460B1 (ko) 2000-05-01

Family

ID=15626720

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920010019A KR100240460B1 (ko) 1991-06-27 1992-06-10 레지스트 도포장치

Country Status (3)

Country Link
US (1) US5273192A (ko)
JP (1) JP3168612B2 (ko)
KR (1) KR100240460B1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08108125A (ja) * 1994-10-13 1996-04-30 Sony Disc Technol:Kk 液供給装置
JPH08188258A (ja) * 1994-12-29 1996-07-23 Ishiyama Bunyo 粉粒体計量供給装置
KR100689703B1 (ko) * 2001-04-19 2007-03-08 삼성전자주식회사 반도체 제조설비의 웨이퍼 포토레지스트 도포유량 감지장치
KR100926308B1 (ko) * 2003-04-23 2009-11-12 삼성전자주식회사 세정 유닛, 이를 갖는 코팅 장치 및 방법
JP2004321946A (ja) * 2003-04-24 2004-11-18 Oki Electric Ind Co Ltd 処理装置、及びそれを用いた被処理体の処理方法
JP2006113127A (ja) * 2004-10-12 2006-04-27 Sharp Corp 修正装置
US7730849B2 (en) * 2006-01-23 2010-06-08 Hynix Semiconductor Inc. Apparatus for coating photoresist material
JP4731377B2 (ja) * 2006-03-30 2011-07-20 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5173874B2 (ja) * 2009-02-02 2013-04-03 東京エレクトロン株式会社 塗布装置及びノズルの待機方法
CN103223396B (zh) * 2013-05-10 2016-02-03 深圳市华星光电技术有限公司 一种用于光阻涂布设备的接触式浸润槽
JP6420571B2 (ja) * 2014-06-13 2018-11-07 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7236318B2 (ja) * 2019-04-26 2023-03-09 東京エレクトロン株式会社 液処理装置、及び液処理方法
JP7506985B2 (ja) * 2020-02-25 2024-06-27 東京エレクトロン株式会社 液処理装置及び液処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018021A (en) * 1959-03-09 1962-01-23 Sun Oil Co Shipping container
US4285445A (en) * 1979-05-01 1981-08-25 Iowa State University Research Foundation, Inc. Concentrate metering apparatus
US4982876A (en) * 1986-02-10 1991-01-08 Isoworth Limited Carbonation apparatus
GB2186265B (en) * 1986-02-10 1989-11-01 Isoworth Ltd Beverage dispensing apparatus
JPH02160074A (ja) * 1988-12-12 1990-06-20 Tokyo Electron Ltd 塗布装置の制御方法

Also Published As

Publication number Publication date
US5273192A (en) 1993-12-28
KR100240460B1 (ko) 2000-05-01
JPH056854A (ja) 1993-01-14
JP3168612B2 (ja) 2001-05-21

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