KR920702636A - 납땜 용제 적용 장치 - Google Patents

납땜 용제 적용 장치

Info

Publication number
KR920702636A
KR920702636A KR1019910701946A KR910701946A KR920702636A KR 920702636 A KR920702636 A KR 920702636A KR 1019910701946 A KR1019910701946 A KR 1019910701946A KR 910701946 A KR910701946 A KR 910701946A KR 920702636 A KR920702636 A KR 920702636A
Authority
KR
South Korea
Prior art keywords
gun
substrate
brush
tank
spray
Prior art date
Application number
KR1019910701946A
Other languages
English (en)
Other versions
KR0174527B1 (ko
Inventor
비. 홀슨 데이빗
더블유. 칵조렉 죠셉
에스. 트레이블 에드윈
Original Assignee
로버트 비. 레비
아메리칸 텔리폰 앤드 텔레그라프 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 로버트 비. 레비, 아메리칸 텔리폰 앤드 텔레그라프 캄파니 filed Critical 로버트 비. 레비
Publication of KR920702636A publication Critical patent/KR920702636A/ko
Application granted granted Critical
Publication of KR0174527B1 publication Critical patent/KR0174527B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
    • B05B13/041—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads with spray heads reciprocating along a straight line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/52—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter for removal of clogging particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Spray Control Apparatus (AREA)

Abstract

내용 없음

Description

납땜 용제 적용 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명에 따른 저응고성 용제를 기판에 적용하기 위한 장치의 개략도.
제 2도는 제 1도의 용제 적용 장치의 개략적인 블록도.
제 3도는 세척 장치를 세부적으로 도시하는 제 1도의 용제 적용 장치의 부분 정면도.

Claims (6)

  1. 기판이 설정된 이동 통로를 따라 선형으로 이동할 때 액체를 기판상에 균일하게 용착시키기 위한 장치에 있어서, 액체를 수용하는 제 1폐쇄 탱크와, 기판을 향하는 스프레이 건과, 상기 건이 액체를 기판상에 설정된 패턴으로 분무시키도록 액체를 탱크로부터 건까지 펌프 공급하기 위한 수단과, 각각의 통과 동안 건에 의해 형성된 분무 패턴이 대향 방향의 건의 이전 통과 동안 형성되 패턴에 적어도 부분적으로 중첩하여 균일한 용착을 보장하도록 기판의 이동통로에 수직인 통로를 따라 건을 왕복 이동시키기 위한 이송 수단과, 왕복 이동중에 건의 선단부를 적어도 일화 세척하기 위한 세척 수단을 포함하는 것을 특징으로 하는 장치.
  2. 제1항에 있어서, 상기 세척 수단은 건이 왕복 이동하는 동안 건에 접촉하도록 장착된 브러시와, 솔벤트를 수용하는 제 2폐쇄탱크와, 상기 탱크의 솔벤트로 브러시를 주기적으로 적시기 위하여 상기 제 2탱크와 상기 브러시에 연결된 브러시 적심 수단을 포함하는 것을 특징으로 하는 장치.
  3. 제 2항에 있어서, 상기 브러시는 건이 그 이동의 어느 한 끝 부분에 이를 때 스프레인 건의 선단부에 접촉하도록 장착되는 것을 특징으로 하는 장치.
  4. 제 2항에 있어서, 상기 브러시 적심 수단은 불활성 가스를 제 2탱크로 공급하기 위한 수단과, 제 2탱크와 브러시 밸브 수단 사이에 연결된 도관과, 불활성 가스가 제 2탱크로 공급되는 동안 상기 도관을 통과하는 솔벤트의 유동을 제어하기 위하여 상기 도관내에 설치된 밸브 수단과, 브러시를 솔벤트로 적시기 위하여 밸브 수단을 주기적으로 개방하기 위한 수단을 포함하는 것을 특징으로 하는 장치.
  5. 기판이 설정된 이동 통로를 따라 선형으로 이동할 때 액체를 기판상에 균일하게 용착시키기 위한 방법에 있어서, 설정된 분무 패턴을 갖는 스프레이 건을 기판을 향하여 배향시키는 단계와, 기판상에 분무하기 위하여 액체를 건에 공급하는 단계와, 각각의 왕복 이동중에 건에 의해 형성된 분무 패턴이 이전의 왕복 이동중에 형성된 패턴에 중첩하여 기판상에 액체를 균일하게 피복시키는 것을 보장하기 위하여 기판의 이동 통로에 수직인 통로를 따라 건을 전후로 왕복 이동시키는 단계와, 건이 막힐 수 있는 가능성을 제거하기 위하여 왕복이동동안 건의 선단부를 적어도 일회 세척하는 단계를 포함하는 것을 특징으로 하는 방법.
  6. 제 5항에 있어서, 스프레이 건의 선단부를 세척하는 단계는 스프레이 건을 브러시와 접촉시키는 단계와 브러시를 솔벤트로 주기적으로 적시는 단계를 포함하는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하 는 것임.
KR1019910701946A 1990-04-30 1991-04-29 납땜 용제 도포장치 KR0174527B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US07/516,635 US5065692A (en) 1990-04-30 1990-04-30 Solder flux applicator
US516635 1990-04-30
US516,635 1990-04-30
PCT/US1991/002961 WO1991016995A1 (en) 1990-04-30 1991-04-29 Solder flux applicator

Publications (2)

Publication Number Publication Date
KR920702636A true KR920702636A (ko) 1992-10-06
KR0174527B1 KR0174527B1 (ko) 1999-02-18

Family

ID=24056464

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701946A KR0174527B1 (ko) 1990-04-30 1991-04-29 납땜 용제 도포장치

Country Status (6)

Country Link
US (1) US5065692A (ko)
EP (1) EP0480016B1 (ko)
JP (1) JPH07102338B2 (ko)
KR (1) KR0174527B1 (ko)
DE (1) DE69110824T2 (ko)
WO (1) WO1991016995A1 (ko)

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US5658387A (en) * 1991-03-06 1997-08-19 Semitool, Inc. Semiconductor processing spray coating apparatus
JP2504858B2 (ja) * 1990-06-28 1996-06-05 日本電気株式会社 噴霧式フラックス塗布装置
US5240502A (en) * 1990-11-13 1993-08-31 Mactron, Inc. Improvement in apparatus for applying a coating to a moving surface
US5328085A (en) * 1992-08-18 1994-07-12 Precision Dispensing Equipment, Inc. Apparatus for applying flux
WO1994004305A1 (en) * 1992-08-18 1994-03-03 Precision Dispensing Equipment, Inc. Method and apparatus for applying flux
US5368219A (en) * 1993-11-04 1994-11-29 Nordson Corporation Method and apparatus for applying solder flux to a printed circuit
DE4414560A1 (de) * 1994-04-18 1995-10-19 Peter Semmler & Co Ohg Verfahren und Vorrichtung zum Zerstäuben und flächigen oder partiellen Auftragen von Flüssigkeiten
IT1298677B1 (it) * 1997-10-27 2000-01-12 Gd Spa Unita' di gommatura a spruzzo.
US6098867A (en) * 1998-03-17 2000-08-08 Advanced Micro Devices, Inc. Automated brush fluxing system for application of controlled amount of flux to packages
NL1015263C1 (nl) * 1999-10-25 2001-04-26 Peter William Vrolijk Bewegingsgecompenseerde spuitinrichting en daarbij toe te passen spuitkop.
NL1013384C2 (nl) * 1999-10-25 2001-05-07 Peter William Vrolijk Werkwijze en inrichting voor het spuiten van een oppervlak.
JP3397313B2 (ja) * 1999-12-20 2003-04-14 富士通株式会社 半導体装置の製造方法及び電子部品の実装方法
US6722553B2 (en) * 2000-08-24 2004-04-20 Advanced Micro Devices, Inc. Controlled and programmed deposition of flux on a flip-chip die by spraying
DE10101372A1 (de) * 2001-01-13 2002-08-01 Itw Oberflaechentechnik Gmbh Sprühverfahren und Sprühvorrichtung für Beschichtungsflüssigkeit
DE10101367A1 (de) * 2001-01-13 2002-08-01 Itw Oberflaechentechnik Gmbh Sprühverfahren und Sprühvorrichtung für Beschichtungsflüssigkeit
DE10101369A1 (de) * 2001-01-13 2002-07-18 Itw Oberflaechentechnik Gmbh Sprühverfahren und Sprühvorrichtung für Beschichtungsflüssigkeit
EP1884305A1 (en) 2006-08-04 2008-02-06 Harman Becker Automotive Systems GmbH Soldering flux application apparatus with an airbrush device ; Method of applying soldering flux to a surface of an object using an airbrush device
EP2299501A1 (en) * 2009-09-16 2011-03-23 3S Industries AG Method and apparatus for providing a solar cell with a solder ribbon
KR101350952B1 (ko) * 2012-09-17 2014-01-16 한국생산기술연구원 플럭스 코팅장치
JP6461519B2 (ja) * 2014-08-29 2019-01-30 株式会社デンソーテン 塗布装置、及び、塗布システム
US10290761B2 (en) * 2015-10-12 2019-05-14 Lg Electronics Inc. Apparatus and method for attaching interconnector of solar cell panel

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DE3809156A1 (de) * 1988-03-18 1989-09-28 Ernst Hohnerlein Verfahren und vorrichtung zum auftragen eines flussmittels
US4871105A (en) * 1988-04-06 1989-10-03 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for applying flux to a substrate
US4821948A (en) * 1988-04-06 1989-04-18 American Telephone And Telegraph Company Method and apparatus for applying flux to a substrate
ES2010397A6 (es) * 1989-02-07 1989-11-01 Parera Duran Rosa Cabina para la limpieza de pistolas de pintar.

Also Published As

Publication number Publication date
JPH07102338B2 (ja) 1995-11-08
EP0480016B1 (en) 1995-06-28
WO1991016995A1 (en) 1991-11-14
KR0174527B1 (ko) 1999-02-18
DE69110824D1 (de) 1995-08-03
EP0480016A1 (en) 1992-04-15
DE69110824T2 (de) 1996-02-22
JPH04506768A (ja) 1992-11-26
US5065692A (en) 1991-11-19

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