KR920011741A - 라인형 서멀프린트헤드 - Google Patents

라인형 서멀프린트헤드 Download PDF

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Publication number
KR920011741A
KR920011741A KR1019910022909A KR910022909A KR920011741A KR 920011741 A KR920011741 A KR 920011741A KR 1019910022909 A KR1019910022909 A KR 1019910022909A KR 910022909 A KR910022909 A KR 910022909A KR 920011741 A KR920011741 A KR 920011741A
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KR
South Korea
Prior art keywords
head
flexible
thermal print
contact member
board
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KR1019910022909A
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English (en)
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KR970004234B1 (ko
Inventor
시게오 오오타
야수시 에마
Original Assignee
사토오 켄이치로오
로움 카부시키가이샤
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Publication of KR920011741A publication Critical patent/KR920011741A/ko
Application granted granted Critical
Publication of KR970004234B1 publication Critical patent/KR970004234B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3352—Integrated circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33575—Processes for assembling process heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/20—Paper fastener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/20—Paper fastener
    • Y10T24/202—Resiliently biased
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/20—Paper fastener
    • Y10T24/202—Resiliently biased
    • Y10T24/205—One piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Electronic Switches (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)

Abstract

내용 없음

Description

라인형 서멀프린트헤드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는, 본 발명에 있어서의 제1실시예를 표시하는 분해상태의 사시도, 제2도는, 제1도의 Ⅱ-Ⅱ에서 본 확대 단면도, 제3도는 제1도의 Ⅲ-Ⅲ에서 본 확대단면도(조립상태를 표시).

Claims (5)

  1. 발열저항체(6)를 길이방향에 따라서 일직선형상으로 연장하도록 형성함과 아울러, 이 발열저항체(6)에 대하여 복수개의 구동용 IC(7)를 발열저항체(6)에 따라서 일렬형상으로 병행하여 탑재하고, 또, 상기한 발열저항체(6) 및 구동용 IC(7)에 대하여 복수개의 접속용 전극단자(9) (10)를 형성한 헤드기판(2)과, 이 헤드기판(2)에 있어서의 각 접속용 전극단자(9) (10)의 각각에 대하여 전기적으로 접속되는 배선패턴(13)을 보유하는 플렉시블회로판(12) 또는 플렉시블케이블(24)을 구비하는 한편, 상기한 헤드기판(2)의 각 접속용 전극단자(9) (10)를, 헤드기판(2)의 길이방향에 따라서 짧은 길이의 영역부분에 집결 형성하여 이루어지는 라인형 서멀프린트헤드에 있어서, 상기한 헤드기판(2)에 있어서의 각 구동용 IC(7)의 부분에, 경질의 합성수지코트(11)를, 그 합성수지코트로서, 각 구동용 IC(7)의 전부를 덮도록 형성하는 한편, 상기한 플렉시블회로판(12) 또는, 플렉시블케이블의 상면측에 판스프링제의 압접부재(14)를 설치하고, 그 압접부재(14)에 플렉시블회로판(12) 또는 플렉시블케이블(24) 중, 헤드기판에 대한 겹침부를, 헤드기판(2)에 대하여 그 압접부재(14)의 스프링력에 의하여 탄성적으로 압압하도록 한 압압부(18)를 일체적으로 형성한 것을 특징으로 하는 라인형 서멀프린트헤드.
  2. 제1항에 있어서, 상기한 압접부재(14)에 있어서의 압압부(18)를, 복수개의 절선 또는, 슬릿(27)으로 복수개의 압압부편(18′)으로 분할한 것을 특징으로 하는 라인형 서멀프린트헤드.
  3. 제1항 또는 제2항에 있어서, 상기한 압접부재(14)에 있어서의 압압부(18)에, 고무 등의 연질탄성체(28)를, 그 연질탄성체(28)가, 플렉시블회로판(12) 또는, 플렉시블케이브(24)에 대하여 맞닿도록 설치한 것을 특징으로 하는 라인형 서멀프린트헤드.
  4. 제1항 내지 제3항에 있어서, 상기한 압접부재(14)를 그 기단부(15)의 양단에 천설한 나사구멍으로부터 헤드기판의 이면측 지지판(1)에 나합하도록 삽입한 나사(19)로써 체결하도록 구성하고, 이 압접부재(14)의 기단부(15)에 보강리브(21) 또는, 보강용만곡부(25)를, 상기한 양 나사 구멍 사이에 걸쳐 연장하도록 설치한 것을 특징으로 하는 라인형 서멀프린트헤드.
  5. 제1항 내지 제3항에 있어서, 상기한 압접부재를, 판스프링을 홈형상으로 절곡한 형태로 하고, 헤드기판(2)과 지지판(1)과 플렉시블 회로판(12) 또는, 플렉시블케이블(24)의 3자, 혹은 헤드기판과 플렉시블회로판 또는 플렉시블케이블의 2자를 협지하도록 구성한 것을 특징으로 하는 라인형 서멀프린트헤드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910022909A 1990-12-19 1991-12-13 라인형 서멀프린트헤드 KR970004234B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP90-403982 1990-12-19
JP40398290 1990-12-19
JP90-404989 1990-12-26
JP40498990 1990-12-26
JP40560390 1990-12-28
JP90-405603 1990-12-28
JP29541491A JP3228974B2 (ja) 1990-12-19 1991-11-12 ライン型サーマルプリントヘッド
JP91-295414 1991-11-12

Publications (2)

Publication Number Publication Date
KR920011741A true KR920011741A (ko) 1992-07-24
KR970004234B1 KR970004234B1 (ko) 1997-03-26

Family

ID=27479659

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910022909A KR970004234B1 (ko) 1990-12-19 1991-12-13 라인형 서멀프린트헤드

Country Status (6)

Country Link
US (2) US5220353A (ko)
EP (1) EP0491401B1 (ko)
JP (1) JP3228974B2 (ko)
KR (1) KR970004234B1 (ko)
CA (1) CA2056950C (ko)
DE (1) DE69119878T2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100706854B1 (ko) * 2004-08-03 2007-04-13 세이코 엡슨 가부시키가이샤 라인 헤드 및 이것을 구비한 화상 형성 장치

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Publication number Priority date Publication date Assignee Title
CN1046902C (zh) * 1994-04-15 1999-12-01 罗姆股份有限公司 热敏打印头和用于其上的驱动ic以及热敏打印头的控制方法
DE69525868T2 (de) * 1994-10-03 2002-11-21 Rohm Co., Ltd. Elektrische Verbindungsstruktur
KR0142736B1 (ko) * 1995-03-10 1998-08-17 김광호 개폐가 용이한 컴퓨터 케이스 체결 장치
EP0830949B1 (en) * 1995-07-31 2002-11-06 Rohm Co., Ltd. Thermal print head connector
USD384106S (en) * 1996-08-27 1997-09-23 Satoshi Shinya Paper clip
JPH10242595A (ja) * 1997-02-26 1998-09-11 Brother Ind Ltd 回路基板
WO1998044593A1 (de) * 1997-04-02 1998-10-08 Siemens Aktiengesellschaft Elektrische verbindung eines schaltungsträgers mit einem leiterbahnträger
US6121701A (en) * 1997-06-02 2000-09-19 Seagate Technology Llc Snap on flexible printed circuit connector
US6300566B1 (en) 1998-03-13 2001-10-09 Siemens Aktiengesellschaft Electrical connection of a circuit carrier to a conductor-track carrier
FR2776230B1 (fr) 1998-03-19 2000-06-30 Axiohm Dispositif d'impression thermique
TW394469U (en) * 1998-12-24 2000-06-11 Foxconn Prec Components Co Ltd Memory bus module
US6617685B1 (en) * 1999-08-30 2003-09-09 Sun Microsystems, Inc. Clip heat sink assembly
FR2837424B1 (fr) * 2002-03-21 2004-09-10 A P S Engineering Tete d'impression thermique dont l'organe de guidage de la bande a imprimer est agence pour permettre une mise a la masse de la tete d'impression
US20040114989A1 (en) * 2002-12-17 2004-06-17 Stuebing Automatic Machine Company Calendar slide
FR2863936B1 (fr) * 2003-12-23 2006-01-20 Axiohm Imprimante thermique
JP4507789B2 (ja) * 2004-09-21 2010-07-21 日本電気株式会社 スタッキングコネクタの固定構造、電子機器
KR100813964B1 (ko) 2005-09-22 2008-03-14 삼성전자주식회사 어레이 타입 프린트헤드 및 이를 구비한 잉크젯화상형성장치
JP2012206273A (ja) * 2011-03-29 2012-10-25 Toshiba Hokuto Electronics Corp サーマルヘッド
JP6252451B2 (ja) * 2014-12-01 2017-12-27 ブラザー工業株式会社 印刷装置
JP6618932B2 (ja) * 2015-01-16 2019-12-11 ローム株式会社 サーマルプリントヘッド
JP2019177604A (ja) * 2018-03-30 2019-10-17 ブラザー工業株式会社 ヘッド制御回路基板、及び印刷装置

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US4390884A (en) * 1981-12-30 1983-06-28 International Business Machines Corporation Printhead stylus assembly
JPS59215874A (ja) * 1983-05-23 1984-12-05 Matsushita Electric Ind Co Ltd 感熱記録用ヘツド
FR2548593B1 (fr) * 1983-07-08 1985-12-06 Sagem Dispositif d'ecriture a elements chauffants pour impression par effet thermique sur un support d'ecriture
JPS60141256A (ja) * 1983-12-29 1985-07-26 Kazuyuki Maeda スツポン玉子味噌漬とその製造方法
JPS6325057A (ja) * 1986-07-16 1988-02-02 Nec Corp 熱転写プリンタのプリントヘツドの接続機構
JPS6392751A (ja) * 1986-10-01 1988-04-23 小河原　通弘 四軸織物及び四軸織機
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US4963886A (en) * 1989-05-01 1990-10-16 Rohm Co., Ltd. Thermal printing head
US4947524A (en) * 1990-01-19 1990-08-14 Chang Chin Fu Resilient sheet-steel paper clip
JP2500403B2 (ja) * 1991-08-07 1996-05-29 レック株式会社 バネクリップ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100706854B1 (ko) * 2004-08-03 2007-04-13 세이코 엡슨 가부시키가이샤 라인 헤드 및 이것을 구비한 화상 형성 장치

Also Published As

Publication number Publication date
DE69119878D1 (de) 1996-07-04
JPH058420A (ja) 1993-01-19
EP0491401A1 (en) 1992-06-24
KR970004234B1 (ko) 1997-03-26
EP0491401B1 (en) 1996-05-29
US5309181A (en) 1994-05-03
US5220353A (en) 1993-06-15
CA2056950C (en) 1997-09-09
JP3228974B2 (ja) 2001-11-12
CA2056950A1 (en) 1992-06-20
DE69119878T2 (de) 1997-01-30

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