KR900013594A - 세척제와 그를 이용한 세척방법 및 그 세척방법을 사용한 반도체 집적회로 제조방법 - Google Patents

세척제와 그를 이용한 세척방법 및 그 세척방법을 사용한 반도체 집적회로 제조방법 Download PDF

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Publication number
KR900013594A
KR900013594A KR1019900001193A KR900001193A KR900013594A KR 900013594 A KR900013594 A KR 900013594A KR 1019900001193 A KR1019900001193 A KR 1019900001193A KR 900001193 A KR900001193 A KR 900001193A KR 900013594 A KR900013594 A KR 900013594A
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KR
South Korea
Prior art keywords
cleaning
integrated circuit
washing
cleaning agent
drying
Prior art date
Application number
KR1019900001193A
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English (en)
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KR930010054B1 (ko
Inventor
다까마사 쓰모또
히로히꼬 미야께
요오이찌 다께하나
요시오 사이또오
가쓰히꼬 이또오
Original Assignee
다께바야시 쇼오고
미쓰이세끼유 가가꾸고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1022838A external-priority patent/JPH02203529A/ja
Priority claimed from JP1231312A external-priority patent/JPH0393899A/ja
Priority claimed from JP1245835A external-priority patent/JPH03106024A/ja
Application filed by 다께바야시 쇼오고, 미쓰이세끼유 가가꾸고오교오 가부시끼가이샤 filed Critical 다께바야시 쇼오고
Publication of KR900013594A publication Critical patent/KR900013594A/ko
Application granted granted Critical
Publication of KR930010054B1 publication Critical patent/KR930010054B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5018—Halogenated solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/24—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/264—Aldehydes; Ketones; Acetals or ketals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/266—Esters or carbonates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)

Abstract

내용 없음

Description

세척제와 그를 이용한 세척방법 및 그 세척방법을 사용한 반도체 집적회로 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 증기세척 및 건조장치의 일실시예를 나타내는 도면,
제2도는 본 발명의 제3실시예∼제7실시예에 사용되는 세척 및 건조장치의 단면도.

Claims (9)

  1. 펜타플루오르프로판올 또는 핵사플루오르이소프로판올을 함유하는 것이 특징인 세척제.
  2. 펜타플루오르프로판올 또는 헥사플루오르 이소프로판올과 이들과 혼화성인 적어도 하나의 용제의 용제 혼합물을 함유하는 것이 특징인 세척제.
  3. 제2항에서, 상기 용제가, 물, 알콜류, 에테르류, 에스테르류, 캐톤류, 및 탄화수소류로 이루어지는 그룹에서 선택된 적어도 하나인 것이 특징인 세척제.
  4. 피세척물을 펜타플루오르프로판을 또는 헥사플루오르 이소프로판올 또는 이들과 혼화성인 적어도 한 용제와의 용제혼합물의 증기에 노출시켜 세척하는 것이 특징인 세척방법.
  5. 헥사플루오르 이소프로판올을 주성분으로 하는 불연성 플루오르 알킬 알콜을 함유하는 것이 특징인 세척제.
  6. 제1항에서, 상기 불연성 플루오르알킬 알콜이, 펜타플루오르프로판올 , 1, 1, 5-트리하이드로옥타플루오르펜탄올중에서 선택된 적어도 한 화합물인 것이 특징인 세척제.
  7. 피처리물질의 표면에 부착된 물 및 이물을 세척 및 건조하는 방법에서, 헥사플루오르이소프로판올을 주성분으로 하는 불연성 플루오르알킬 알콜을 함유하는 용제의 증기 분위기중에 상기 피처리물질을 노출시켜 행하는 것이 특징인 세척 및 건조방법.
  8. 반도체 웨이퍼의 주표면상에 형성된 래지스트 패턴을 통해 소정의 집적회로 패턴을 형성하는 과정중 에비세척공정에서, 또는 상기 레지스트 패턴 제거후 세척 공정에설 제7항의 세척 및 건조방법으로 반도체 웨이퍼의 세척 및 건조를 행하는 것이 특징인 반도체 집적회로장치의 제조방법.
  9. 소정의 집적회로 패턴을 갖는 포토마스크 제조공정중 표면상에 광차단막을 갖는 유리기판의 주표면상에 형성된 페지스트 패턴을 통해, 상기 광차단막의 식각을 행하여 상기 레지스터 패턴을 제거한후의 포토마스크 세척 공정에서 제7항의 세척 및 건조방법에 의해 상기 포토마스크의 세척 및 건조를 행하는 것이 특징인 반도체 집적회로 장치의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900001193A 1989-02-01 1990-02-01 세척제와 그를 이용한 세척방법 KR930010054B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP1-22838 1989-02-01
JP89-22838 1989-02-01
JP1022838A JPH02203529A (ja) 1989-02-01 1989-02-01 基板の洗浄乾燥方法
JP89-231312 1989-09-06
JP1231312A JPH0393899A (ja) 1989-09-06 1989-09-06 洗浄剤および洗浄方法
JP1-231312 1989-09-06
JP89-245835 1989-09-10
JP1-245835 1989-09-20
JP1245835A JPH03106024A (ja) 1989-09-20 1989-09-20 洗浄乾燥方法およびそれを用いた半導体集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
KR900013594A true KR900013594A (ko) 1990-09-06
KR930010054B1 KR930010054B1 (ko) 1993-10-14

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Application Number Title Priority Date Filing Date
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Country Status (3)

Country Link
EP (1) EP0389087A3 (ko)
KR (1) KR930010054B1 (ko)
CA (1) CA2008882A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101122978B1 (ko) * 2008-11-13 2012-03-16 도쿄엘렉트론가부시키가이샤 이물 검출 방법, 장치 및 기억 매체

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992010454A1 (en) * 1990-12-04 1992-06-25 Allied-Signal Inc. Partially fluorinated alkanols having a tertiary structure
US5254755A (en) * 1990-12-04 1993-10-19 Allied-Signal Inc. Partially fluorinated alkanols having a tertiary structure
DE4218966A1 (de) * 1992-06-10 1993-12-16 Hoechst Ag Isopropanolhaltige Reinigungslösungen mit erhöhtem Flammpunkt
JP2969087B2 (ja) * 1996-11-06 1999-11-02 日本エー・エス・エム株式会社 半導体基板の処理方法
CA2469368A1 (en) 2001-12-06 2003-09-19 The Procter & Gamble Company Compositions and methods for removal of incidental soils from fabric articles via soil modification
ATE471366T1 (de) * 2006-09-14 2010-07-15 Fujifilm Corp Mittel zur entfernung von wasser aus einem substrat, verfahren zur wasserentfernung und trocknungsverfahren damit
US8021490B2 (en) * 2007-01-04 2011-09-20 Eastman Chemical Company Substrate cleaning processes through the use of solvents and systems

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58204100A (ja) * 1982-05-24 1983-11-28 ダイキン工業株式会社 表面清浄化用組成物
JPS59157196A (ja) * 1983-02-28 1984-09-06 ダイキン工業株式会社 固定用ワックスの除去方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101122978B1 (ko) * 2008-11-13 2012-03-16 도쿄엘렉트론가부시키가이샤 이물 검출 방법, 장치 및 기억 매체

Also Published As

Publication number Publication date
KR930010054B1 (ko) 1993-10-14
CA2008882A1 (en) 1990-08-01
EP0389087A2 (en) 1990-09-26
EP0389087A3 (en) 1991-07-24

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