KR900003997A - 도전성 ic 부재용 성형재료 - Google Patents

도전성 ic 부재용 성형재료 Download PDF

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KR900003997A
KR900003997A KR1019890011712A KR890011712A KR900003997A KR 900003997 A KR900003997 A KR 900003997A KR 1019890011712 A KR1019890011712 A KR 1019890011712A KR 890011712 A KR890011712 A KR 890011712A KR 900003997 A KR900003997 A KR 900003997A
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weight
molding material
polyphenylene ether
aba
resin
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KR1019890011712A
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KR920009804B1 (ko
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마사지 요시무라
도루 우에끼
가즈하루 가네자끼
다까시 사또오
이네오 이와따
스스무 기시
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사와무라 하루오
미쓰이도오아쓰가가꾸 가부시끼가이샤
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Priority claimed from JP1184581A external-priority patent/JPH02175754A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Packaging Frangible Articles (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

내용 없음

Description

도전성 IC 부재용 성형재료
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 열변형온도(JIS-K7207)에 준한 굽힘 응력 (18.5Kg/㎠)가 130℃이상이고 또한 멜트플로우인덱스(JIS-K70210에 준하여 하중 10Kg, 300℃)가 3g/10분이상 이며, 그 성형재료로 부터 IC 부재 성형물의 표면고유 저항치가 107Ω이하이고, 또 폴리페닐렌 에테르수지가 적어도 50중량%이상 함유하는 도전성 IC 부재용 성형재료.
  2. 제 1 항에 있어서, 25℃의 클로로포름 용액중에서 측정하여 얻는 고유점도가 0.45~0.5dl/g인 폴리페닐렌 에테르수지 50~90중량%, 산이미드 화합물 1~20중량% 내충격성 폴리스티렌수지 0~40%, A-B-A′형 블록 공중합체 엘라스토머(여기에서 A,A′는 중합된 비닐 방향족 탄화수소 블록이며, B는 중합된 공익디엔블록 또는 중합된 공익디엔블록이 수소 첨가된 것이다.) 0~20중량%, 도전성 카본 5~40중량%로서 이루어지며, 각 조성분의 합계가 100중량%를 형성하는 수지 조성물을 주체로 하는 성형재료.
  3. 제 1 항에 있어서, 25℃의 클로로포름 용액중에서 측정하여 얻는 고유점도가 0.25~0.45dl/g인 폴리페닐렌 에테르수지 50~90중량%, 내충격성 폴리스티렌수지 0~40중량%, A-B-A′형 블록 중공합체 엘라스토머 0~20중량%, 도전성 카본 5~40중량%로서 이루어지며, 각 성분의 합계가 100중량%를 형성하는 수지 조성물인 성형재료.
  4. 제 1 항에 있어서, 25℃의 클로로포름 용액중에서 측정하여 얻는 고유점도가 0.45~0.5dl/g인 폴리페닐렌 에테르수지 50~80중량%, 산이미드 화합물 3~20중량%, 내충격성 폴리스티렌수지 5~35중량%, A-B-A′형 블록 공중합체 엘라스토머 3~15중량% 및 전도성 카본 5~15중량%로서 이루어지며, 각 조성분의 합계가 100중량%를 형성하는 수지 조성물을 주체로 하는 성형재료.
  5. 제 1 항에 있어서, 25℃의 클로로포름 용액중에서 측정하여 얻는 고유점도 0.25~0.45dl/g인 폴리페닐렌 에테르수지 50~80중량%, 내충격성 폴리스티렌수지 5~35중량%, A-B-A′형 블록 공중합체 엘라스토머 3~15중량%로서 되며, 각 성분의 합계가 100중량%를 형성하는 수지 조성물인 성형재료.
  6. 제 1 항에 있어서, 폴리페닐렌 에테르수지가, 하기 일반식으로 표시되는 단위를 1종 이상 함유하는 호모폴리머 또는 코풀리머인 성형재료.
    (식중, R1,R2,R3및 R4는 각각 독립적으로, 수소, 할로겐, 탄화수소, 할로탄화수소, 탄화수소옥시 및 할로탄화수소옥시로서 구성되는 군에서 선택되며 n은 모노미 단위의 총수를 표시하고, 20이상의 정수이다.)
  7. 제 6 항에 있어서, 폴리페닐렌 에테르수지가 폴리 2,6-디메틸-1.4-페닐렌 에르린 성형재료.
  8. 제 1 항에 있어서, 산이미드 화합물이 숙신산 이미드, 글루타르산이미드, 프탈이미드, N-페닐프탈이미드, N-페닐말레이미드, N-시클로헥실말레이디미드, N-(P-히드록시 페닐) 말레이드, N-(P-카르복시페닐)말레이미드, N-(P-클로로페닐) 말레이미드로서 구성되는 군에서 선택된 것인 성형재료.
  9. 제 1 항에 있어서, A-B-A′형 블록 공중합체 엘라스토머가 스티렌, α-메틸스티렌, 비닐 톨루엔, 비닐 크실렌, 에틸 비닐 그실렌, 비닐 나프탈렌으로부터 선택된 비닐 방향족 탄화수소와 1.3부타디엔 및 이소프렌으로부터 선택된 공익디엔 화합물에서 선택된 각각의 안량체 또는 혼합물의 블록 공중합체인 성형재료.
    ※참고사항: 최초출원 내용에 의하여 공개하는 것임.
KR1019890011712A 1988-08-18 1989-08-17 도전성 ic 부재용 성형재료 KR920009804B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP63-203718 1988-08-18
JP?203718/88 1988-08-18
JP20371888 1988-08-18
JP?090831/89 1989-04-12
JP90831/89 1989-04-12
JP1090831A JP2801630B2 (ja) 1988-08-18 1989-04-12 Ｉｃ用耐熱トレー
JP?184581/89 1989-07-19
JP1184581A JPH02175754A (ja) 1988-08-18 1989-07-19 導電性ｉｃ部材用成形材料
JP???? 1992-01-05

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KR900003997A true KR900003997A (ko) 1990-03-27
KR920009804B1 KR920009804B1 (ko) 1992-10-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8950214B2 (en) 2013-02-11 2015-02-10 Pandora A/S Component with gripping element

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2572711B2 (ja) * 1993-08-12 1997-01-16 ライオン株式会社 導電性カーボンブラック含有熱可塑性組成物の製造方法
US5876647A (en) * 1994-04-21 1999-03-02 Lion Corporation Method for preparing conductive thermoplastic resin compositions
KR100855367B1 (ko) * 2007-04-05 2008-09-04 (주)성호폴리텍 Ｉｃ 트레이용 개질 폴리페닐렌에테르와 그의 제조 방법,및 이를 기본재질로서 포함하는 ｉｃ 트레이

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8950214B2 (en) 2013-02-11 2015-02-10 Pandora A/S Component with gripping element

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JP2801630B2 (ja) 1998-09-21
KR920009804B1 (ko) 1992-10-22
JPH02180958A (ja) 1990-07-13

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