KR900001240B1 - 반도체 장치용 기판(基板) 구조체 - Google Patents

반도체 장치용 기판(基板) 구조체 Download PDF

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Publication number
KR900001240B1
KR900001240B1 KR1019860000432A KR860000432A KR900001240B1 KR 900001240 B1 KR900001240 B1 KR 900001240B1 KR 1019860000432 A KR1019860000432 A KR 1019860000432A KR 860000432 A KR860000432 A KR 860000432A KR 900001240 B1 KR900001240 B1 KR 900001240B1
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KR
South Korea
Prior art keywords
ceramic
conductive layer
substrate structure
semiconductor device
copper
Prior art date
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Expired
Application number
KR1019860000432A
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English (en)
Korean (ko)
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KR860006132A (ko
Inventor
노부유끼 미즈노야
야스유끼 스기우라
마사카즈 하토리
Original Assignee
가부시끼가이샤 도시바
사바 쇼오이찌
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Publication of KR860006132A publication Critical patent/KR860006132A/ko
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Publication of KR900001240B1 publication Critical patent/KR900001240B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Ceramic Products (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019860000432A 1985-01-31 1986-01-22 반도체 장치용 기판(基板) 구조체 Expired KR900001240B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-15324 1985-01-31
JP60015324A JPS61176142A (ja) 1985-01-31 1985-01-31 基板構造体

Publications (2)

Publication Number Publication Date
KR860006132A KR860006132A (ko) 1986-08-18
KR900001240B1 true KR900001240B1 (ko) 1990-03-05

Family

ID=11885592

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860000432A Expired KR900001240B1 (ko) 1985-01-31 1986-01-22 반도체 장치용 기판(基板) 구조체

Country Status (5)

Country Link
US (1) US4704320A (enExample)
EP (1) EP0196747B1 (enExample)
JP (1) JPS61176142A (enExample)
KR (1) KR900001240B1 (enExample)
DE (1) DE3675565D1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8706610D0 (en) * 1987-03-19 1987-04-23 Smith Ind Plc Electrical components
EP0297511B1 (en) * 1987-07-03 2003-10-08 Sumitomo Electric Industries, Limited Connection structure between components for semiconductor apparatus
US5243217A (en) * 1990-11-03 1993-09-07 Fuji Electric Co., Ltd. Sealed semiconductor device with protruding portion
US5328751A (en) * 1991-07-12 1994-07-12 Kabushiki Kaisha Toshiba Ceramic circuit board with a curved lead terminal
JP2850606B2 (ja) * 1991-11-25 1999-01-27 富士電機株式会社 トランジスタモジュール
US6422901B1 (en) 1999-12-06 2002-07-23 Fci Americas Technology, Inc. Surface mount device and use thereof
FR2814279B1 (fr) * 2000-09-15 2003-02-28 Alstom Substrat pour circuit electronique et module electronique utilisant un tel substrat
FR2814280B1 (fr) * 2000-09-15 2003-05-02 Alstom Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat
ES2717849T3 (es) 2001-03-08 2019-06-25 Alstom Transp Tech Sustrato para circuito electrónico de potencia y módulo electrónico de potencia que utiliza dicho sustrato
JP4057407B2 (ja) * 2002-12-12 2008-03-05 三菱電機株式会社 半導体パワーモジュール
US7587901B2 (en) 2004-12-20 2009-09-15 Amerigon Incorporated Control system for thermal module in vehicle
JP2008010618A (ja) * 2006-06-29 2008-01-17 Mitsubishi Electric Corp 電力用半導体装置
US8222511B2 (en) 2006-08-03 2012-07-17 Gentherm Thermoelectric device
US20080087316A1 (en) 2006-10-12 2008-04-17 Masa Inaba Thermoelectric device with internal sensor
JP2008205058A (ja) * 2007-02-19 2008-09-04 Fuji Electric Device Technology Co Ltd 半導体装置
US9105809B2 (en) 2007-07-23 2015-08-11 Gentherm Incorporated Segmented thermoelectric device
WO2009036077A1 (en) 2007-09-10 2009-03-19 Amerigon, Inc. Operational control schemes for ventilated seat or bed assemblies
JP2011514180A (ja) 2008-02-01 2011-05-06 アメリゴン インコーポレイティド 熱電デバイスのための凝縮体センサ及び湿度センサ
JP5997899B2 (ja) 2008-07-18 2016-09-28 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 空調されるベッドアセンブリ
US9685599B2 (en) 2011-10-07 2017-06-20 Gentherm Incorporated Method and system for controlling an operation of a thermoelectric device
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
DE112015000816T5 (de) 2014-02-14 2016-11-03 Gentherm Incorporated Leitfähiger, konvektiver klimatisierter Sitz
CN107251247B (zh) 2014-11-14 2021-06-01 查尔斯·J·柯西 加热和冷却技术
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US20200035898A1 (en) 2018-07-30 2020-01-30 Gentherm Incorporated Thermoelectric device having circuitry that facilitates manufacture
US11993132B2 (en) 2018-11-30 2024-05-28 Gentherm Incorporated Thermoelectric conditioning system and methods
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361868A (en) * 1966-08-04 1968-01-02 Coors Porcelain Co Support for electrical circuit component
US3607379A (en) * 1968-01-22 1971-09-21 Us Navy Microelectronic interconnection substrate
US3549782A (en) * 1968-04-11 1970-12-22 Unitrode Corp Subassembly package
US3766440A (en) * 1972-08-11 1973-10-16 Gen Motors Corp Ceramic integrated circuit convector assembly
US3939559A (en) * 1972-10-03 1976-02-24 Western Electric Company, Inc. Methods of solid-phase bonding mating members through an interposed pre-shaped compliant medium
US3996603A (en) * 1974-10-18 1976-12-07 Motorola, Inc. RF power semiconductor package and method of manufacture
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
US4110904A (en) * 1977-05-19 1978-09-05 Allen-Bradley Company Substrate with terminal connections and method of making the same
US4394530A (en) * 1977-09-19 1983-07-19 Kaufman Lance R Power switching device having improved heat dissipation means
US4172547A (en) * 1978-11-02 1979-10-30 Delgrande Donald J Method for soldering conventionally unsolderable surfaces
US4323293A (en) * 1980-06-30 1982-04-06 Bourns, Inc. Terminal lead with labyrinthine clip
JPS5933894A (ja) * 1982-08-19 1984-02-23 電気化学工業株式会社 混成集積用回路基板の製造法
JPS59208763A (ja) * 1983-05-12 1984-11-27 Toshiba Corp 樹脂封止型電子装置
JPS60140897A (ja) * 1983-12-28 1985-07-25 日本電気株式会社 樹脂絶縁多層基板

Also Published As

Publication number Publication date
EP0196747A3 (en) 1987-06-10
EP0196747A2 (en) 1986-10-08
EP0196747B1 (en) 1990-11-14
US4704320A (en) 1987-11-03
DE3675565D1 (de) 1990-12-20
JPS61176142A (ja) 1986-08-07
KR860006132A (ko) 1986-08-18
JPH0455339B2 (enExample) 1992-09-03

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