KR900000826Y1 - 반도체 장치의 팩키지 - Google Patents

반도체 장치의 팩키지 Download PDF

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Publication number
KR900000826Y1
KR900000826Y1 KR2019850013150U KR850013150U KR900000826Y1 KR 900000826 Y1 KR900000826 Y1 KR 900000826Y1 KR 2019850013150 U KR2019850013150 U KR 2019850013150U KR 850013150 U KR850013150 U KR 850013150U KR 900000826 Y1 KR900000826 Y1 KR 900000826Y1
Authority
KR
South Korea
Prior art keywords
package
main body
semiconductor device
mentioned
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR2019850013150U
Other languages
English (en)
Korean (ko)
Other versions
KR860006725U (ko
Inventor
세이이 찌로오 미아이
Original Assignee
세이이 찌로오 미아이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세이이 찌로오 미아이 filed Critical 세이이 찌로오 미아이
Publication of KR860006725U publication Critical patent/KR860006725U/ko
Application granted granted Critical
Publication of KR900000826Y1 publication Critical patent/KR900000826Y1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
KR2019850013150U 1984-11-21 1985-10-10 반도체 장치의 팩키지 Expired KR900000826Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59-177259 1984-11-21
JP1984177259U JPH0119400Y2 (https=) 1984-11-21 1984-11-21

Publications (2)

Publication Number Publication Date
KR860006725U KR860006725U (ko) 1986-06-25
KR900000826Y1 true KR900000826Y1 (ko) 1990-01-30

Family

ID=30734830

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019850013150U Expired KR900000826Y1 (ko) 1984-11-21 1985-10-10 반도체 장치의 팩키지

Country Status (2)

Country Link
JP (1) JPH0119400Y2 (https=)
KR (1) KR900000826Y1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100378278B1 (ko) * 1999-04-26 2003-03-29 산요 덴키 가부시키가이샤 전자 부품

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4824528U (https=) * 1971-07-27 1973-03-22
JPS5433421Y2 (https=) * 1974-10-30 1979-10-15
JPS5355469U (https=) * 1976-10-13 1978-05-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100378278B1 (ko) * 1999-04-26 2003-03-29 산요 덴키 가부시키가이샤 전자 부품

Also Published As

Publication number Publication date
JPS6192063U (https=) 1986-06-14
KR860006725U (ko) 1986-06-25
JPH0119400Y2 (https=) 1989-06-05

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St.27 status event code: A-1-2-D10-D11-exm-UA0201

UG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-UG1501

UG1604 Publication of application

St.27 status event code: A-2-2-Q10-Q13-nap-UG1604

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Not in force date: 19930131

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P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000