KR900000313B1 - Process for producing multilayer ceramic circuit board with copper - Google Patents

Process for producing multilayer ceramic circuit board with copper

Info

Publication number
KR900000313B1
KR900000313B1 KR8508896A KR850008896A KR900000313B1 KR 900000313 B1 KR900000313 B1 KR 900000313B1 KR 8508896 A KR8508896 A KR 8508896A KR 850008896 A KR850008896 A KR 850008896A KR 900000313 B1 KR900000313 B1 KR 900000313B1
Authority
KR
South Korea
Prior art keywords
circuit board
multilayer ceramic
ceramic circuit
copper
sheets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR8508896A
Other languages
English (en)
Korean (ko)
Inventor
Yoshihiko Imanaka
Hiromi Ogawa
Mineharu Tsukada
Etsuro Udakawa
Kazuaki Kurihara
Hiromitsu Yokoyama
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of KR900000313B1 publication Critical patent/KR900000313B1/ko
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
KR8508896A 1984-12-28 1985-11-28 Process for producing multilayer ceramic circuit board with copper Expired KR900000313B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59274534A JPS61155243A (ja) 1984-12-28 1984-12-28 グリ−ンシ−ト組成物

Publications (1)

Publication Number Publication Date
KR900000313B1 true KR900000313B1 (en) 1990-01-25

Family

ID=17543041

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8508896A Expired KR900000313B1 (en) 1984-12-28 1985-11-28 Process for producing multilayer ceramic circuit board with copper

Country Status (8)

Country Link
US (1) US4679320A (https=)
EP (1) EP0186550B1 (https=)
JP (1) JPS61155243A (https=)
KR (1) KR900000313B1 (https=)
AU (1) AU565068B2 (https=)
CA (1) CA1237535A (https=)
DE (1) DE3585729D1 (https=)
ES (1) ES8800867A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4795512A (en) * 1986-02-26 1989-01-03 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a multilayer ceramic body
JPS63107095A (ja) * 1986-10-23 1988-05-12 富士通株式会社 多層セラミツク回路基板
CA1273853A (en) * 1986-12-17 1990-09-11 Hitoshi Suzuki Method for production of ceramic circuit board
JPS63277548A (ja) * 1987-05-08 1988-11-15 Fujitsu Ltd 超伝導セラミックスグリ−ンシ−ト組成物
WO1989001461A1 (en) * 1987-08-13 1989-02-23 Ceramics Process Systems Corporation Co-sinterable metal-ceramic packages and materials therefor
EP0308851A3 (en) * 1987-09-24 1990-03-21 Air Products And Chemicals, Inc. A process for the manufacture of copper thick-film conductors using an infrared furnace
GB2212333A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Method of fabricating multi-layer circuits
JPH0772092B2 (ja) * 1988-02-10 1995-08-02 日本特殊陶業株式会社 低温焼成基板
JPH0728128B2 (ja) * 1988-03-11 1995-03-29 松下電器産業株式会社 セラミック多層配線基板とその製造方法
JPH01318292A (ja) * 1988-06-20 1989-12-22 Fujitsu General Ltd 電気機器用構造物の製造方法
US5024975A (en) * 1989-10-19 1991-06-18 E. I. Du Pont De Nemours And Co., Inc. Crystallizable, low dielectric constant, low dielectric loss composition
US5070046A (en) * 1989-10-19 1991-12-03 E. I. Du Pont De Nemours And Company Dielectric compositions
US5283104A (en) * 1991-03-20 1994-02-01 International Business Machines Corporation Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
GB2255451B (en) * 1991-05-03 1995-01-25 Marconi Gec Ltd Ceramic three dimensional electronic structures
US5682018A (en) * 1991-10-18 1997-10-28 International Business Machines Corporation Interface regions between metal and ceramic in a metal/ceramic substrate
US5456778A (en) * 1992-08-21 1995-10-10 Sumitomo Metal Ceramics Inc. Method of fabricating ceramic circuit substrate
JP2003031948A (ja) * 2001-07-12 2003-01-31 Matsushita Electric Ind Co Ltd セラミック多層基板の製造方法
WO2017165127A1 (en) * 2016-03-24 2017-09-28 Ferro Corporation Fast conductivity polymer silver
CN115894019B (zh) * 2022-12-13 2023-09-22 西安交通大学 一种反铁电陶瓷材料及其低温烧结制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3988405A (en) * 1971-04-07 1976-10-26 Smith Robert D Process for forming thin walled articles or thin sheets
DE2305341C2 (de) * 1973-02-03 1982-03-04 Sprague Electric Co., North Adams, Mass. Keramisches Schlickerkonzentrat für die Herstellung keramischer Kondensatoren
JPS51127112A (en) * 1975-04-30 1976-11-05 Fujitsu Ltd Method of producing multiilayered glass substrate
JPS525523A (en) * 1975-07-02 1977-01-17 Sankyo Kogaku Kogyo Kk Fade-in fade-out device for the movie camera
DE2727364A1 (de) * 1977-06-16 1979-01-04 Siemens Ag Verfahren zur herstellung von keramiksubstraten
US4413061A (en) * 1978-02-06 1983-11-01 International Business Machines Corporation Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
JPS608990B2 (ja) * 1979-07-06 1985-03-07 松下電器産業株式会社 圧電性焼結体シ−トの製造方法
US4340436A (en) * 1980-07-14 1982-07-20 International Business Machines Corporation Process for flattening glass-ceramic substrates
JPS5756375A (en) * 1980-09-24 1982-04-03 Citizen Watch Co Ltd Ceramic green sheet formation
US4345955A (en) * 1980-10-28 1982-08-24 E. I. Du Pont De Nemours And Company Process for manufacturing multilayer ceramic chip carrier modules
JPS57184296A (en) * 1981-05-09 1982-11-12 Hitachi Ltd Ceramic circuit board
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
US4510000A (en) * 1983-11-30 1985-04-09 International Business Machines Corporation Method for palladium activating molybdenum metallized features on a ceramic substrate
JPS60254697A (ja) * 1984-05-31 1985-12-16 富士通株式会社 多層セラミック回路基板および製法

Also Published As

Publication number Publication date
JPH0240013B2 (https=) 1990-09-10
AU5051885A (en) 1986-07-03
CA1237535A (en) 1988-05-31
ES8800867A1 (es) 1987-12-01
DE3585729D1 (de) 1992-04-30
ES549413A0 (es) 1987-12-01
US4679320A (en) 1987-07-14
EP0186550B1 (en) 1992-03-25
JPS61155243A (ja) 1986-07-14
AU565068B2 (en) 1987-09-03
EP0186550A3 (en) 1988-03-02
EP0186550A2 (en) 1986-07-02

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