KR890700924A - 집적회로의 지지 어셈블리 - Google Patents

집적회로의 지지 어셈블리

Info

Publication number
KR890700924A
KR890700924A KR1019880701164A KR880701164A KR890700924A KR 890700924 A KR890700924 A KR 890700924A KR 1019880701164 A KR1019880701164 A KR 1019880701164A KR 880701164 A KR880701164 A KR 880701164A KR 890700924 A KR890700924 A KR 890700924A
Authority
KR
South Korea
Prior art keywords
integrated circuit
support assembly
circuit support
assembly
integrated
Prior art date
Application number
KR1019880701164A
Other languages
English (en)
Other versions
KR920008253B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR890700924A publication Critical patent/KR890700924A/ko
Application granted granted Critical
Publication of KR920008253B1 publication Critical patent/KR920008253B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019880701164A 1987-01-28 1987-12-30 접적회로의 지지 어셈블리 KR920008253B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US008208 1987-01-28
US07/008,208 US4800419A (en) 1987-01-28 1987-01-28 Support assembly for integrated circuits
PCT/US1987/003463 WO1988005962A1 (en) 1987-01-28 1987-12-30 Support assembly for integrated circuits

Publications (2)

Publication Number Publication Date
KR890700924A true KR890700924A (ko) 1989-04-28
KR920008253B1 KR920008253B1 (ko) 1992-09-25

Family

ID=21730351

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880701164A KR920008253B1 (ko) 1987-01-28 1987-12-30 접적회로의 지지 어셈블리

Country Status (6)

Country Link
US (1) US4800419A (ko)
EP (1) EP0349549A4 (ko)
JP (1) JPH02502323A (ko)
KR (1) KR920008253B1 (ko)
CA (1) CA1272306A (ko)
WO (1) WO1988005962A1 (ko)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019891A (en) * 1988-01-20 1991-05-28 Hitachi, Ltd. Semiconductor device and method of fabricating the same
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
JP2734463B2 (ja) * 1989-04-27 1998-03-30 株式会社日立製作所 半導体装置
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
JPH0350758A (ja) * 1989-07-18 1991-03-05 Toshiba Corp 樹脂封止型半導体装置
US5196992A (en) * 1989-08-25 1993-03-23 Kabushiki Kaisha Toshiba Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin
JPH0777256B2 (ja) * 1989-08-25 1995-08-16 株式会社東芝 樹脂封止型半導体装置
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5153707A (en) * 1989-11-06 1992-10-06 Matsushita Electric Industrial Co., Ltd. Film material for manufacturing film carriers having outer lead portions with inner and outer metallic layers
US5196725A (en) * 1990-06-11 1993-03-23 Hitachi Cable Limited High pin count and multi-layer wiring lead frame
US5086335A (en) * 1990-07-31 1992-02-04 Hewlett-Packard Company Tape automated bonding system which facilitate repair
US5168345A (en) * 1990-08-15 1992-12-01 Lsi Logic Corporation Semiconductor device having a universal die size inner lead layout
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
FR2673041A1 (fr) * 1991-02-19 1992-08-21 Gemplus Card Int Procede de fabrication de micromodules de circuit integre et micromodule correspondant.
US5138430A (en) * 1991-06-06 1992-08-11 International Business Machines Corporation High performance versatile thermally enhanced IC chip mounting
MY107849A (en) * 1991-09-09 1996-06-29 Hitachi Cable Composite lead frame and method for manufacturing the same.
US5831836A (en) * 1992-01-30 1998-11-03 Lsi Logic Power plane for semiconductor device
US5386342A (en) * 1992-01-30 1995-01-31 Lsi Logic Corporation Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5854085A (en) * 1992-06-04 1998-12-29 Lsi Logic Corporation Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
US5801432A (en) * 1992-06-04 1998-09-01 Lsi Logic Corporation Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes
JPH0653277A (ja) * 1992-06-04 1994-02-25 Lsi Logic Corp 半導体装置アセンブリおよびその組立方法
JP3138539B2 (ja) * 1992-06-30 2001-02-26 三菱電機株式会社 半導体装置及びｃｏｂ基板
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US6298013B1 (en) * 1993-11-15 2001-10-02 Siemens Aktiengesellschaft Device for monitoring the travel time of mail shipments
US5455387A (en) * 1994-07-18 1995-10-03 Olin Corporation Semiconductor package with chip redistribution interposer
US6043100A (en) * 1996-04-19 2000-03-28 Weaver; Kevin Chip on tape die reframe process
JP4232301B2 (ja) * 1999-12-14 2009-03-04 ソニー株式会社 リードフレームの製造方法、及び、半導体装置の製造方法
KR100426330B1 (ko) * 2001-07-16 2004-04-08 삼성전자주식회사 지지 테이프를 이용한 초박형 반도체 패키지 소자
DE10146306A1 (de) * 2001-09-19 2003-01-02 Infineon Technologies Ag Elektronisches Bauteil mit wenigstens einem Halbleiterchip und Verfahren zu seiner Herstellung
US8017451B2 (en) 2008-04-04 2011-09-13 The Charles Stark Draper Laboratory, Inc. Electronic modules and methods for forming the same
US8273603B2 (en) * 2008-04-04 2012-09-25 The Charles Stark Draper Laboratory, Inc. Interposers, electronic modules, and methods for forming the same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3793714A (en) * 1971-05-27 1974-02-26 Texas Instruments Inc Integrated circuit assembly using etched metal patterns of flexible insulating film
DE2315711B2 (de) * 1973-03-29 1980-07-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer integrierten Schaltungsanordnung
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4234666A (en) * 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5691455A (en) * 1979-12-26 1981-07-24 Fujitsu Ltd Lead frame for manufacturing of semiconductor device
US4308339A (en) * 1980-02-07 1981-12-29 Westinghouse Electric Corp. Method for manufacturing tape including lead frames
US4390042A (en) * 1980-07-30 1983-06-28 Westinghouse Electric Corp. Tube plug
JPS57107064A (en) * 1980-12-25 1982-07-03 Nec Corp Lead frame for glass sealed package
US4477827A (en) * 1981-02-02 1984-10-16 Northern Telecom Limited Lead frame for leaded semiconductor chip carriers
US4380042A (en) * 1981-02-23 1983-04-12 Angelucci Sr Thomas L Printed circuit lead carrier tape
US4390598A (en) * 1982-04-05 1983-06-28 Fairchild Camera & Instrument Corp. Lead format for tape automated bonding
DE3213884A1 (de) * 1982-04-15 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Anschlussvorrichtung fuer ein plattenfoermiges elektrisches geraet
JPS58207657A (ja) * 1982-05-28 1983-12-03 Fujitsu Ltd 半導体装置及びその製造方法
JPS60170242A (ja) * 1984-02-15 1985-09-03 Nec Corp 半導体装置連結体
WO1986002200A1 (en) * 1984-09-27 1986-04-10 Motorola, Inc. Lead frame having improved arrangement of supporting leads and semiconductor device employing the same

Also Published As

Publication number Publication date
WO1988005962A1 (en) 1988-08-11
EP0349549A1 (en) 1990-01-10
KR920008253B1 (ko) 1992-09-25
US4800419A (en) 1989-01-24
EP0349549A4 (en) 1990-09-05
JPH02502323A (ja) 1990-07-26
CA1272306A (en) 1990-07-31

Similar Documents

Publication Publication Date Title
KR890700924A (ko) 집적회로의 지지 어셈블리
DK590187A (da) Trykt-kredsloebsantenne
KR880700419A (ko) 집적회로
DK638687A (da) Baereboelgereproducerende kredsloeb
DE3855797D1 (de) Integrierte Halbleiterschaltung
KR880700420A (ko) 집적회로
MX164321B (es) Sosten
DK600085D0 (da) Integreret kredsloeb
ES2023238B3 (es) Montaje de fijacion
KR880700902A (ko) 설치대
DE69029468D1 (de) Integrierte Schaltungsanordnung
ATA207388A (de) Konfektioniervorrichtung
DK309788D0 (da) Baerelag
DE59010443D1 (de) Integrierte Schaltungsanordnung
KR900010775A (ko) 반도체 집적회로
DK306688D0 (da) Baerelag
ATA154388A (de) Integrierte schaltungsanordnung
KR880015538U (ko) 고추목 지지대
KR890012247U (ko) 회로 기판 고정구
BR8801274A (pt) Suporte de lemniscata
KR880021585U (ko) 설치대
KR880021584U (ko) 설치대
ES1001964Y (es) Mesa-estanteria armable
FR2622863B1 (fr) Support multi-combines
BR8706649A (pt) Suporte fixa-facil

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19970827

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee