KR890700854A - 레지스트를 패턴화 하는 방법 - Google Patents

레지스트를 패턴화 하는 방법

Info

Publication number
KR890700854A
KR890700854A KR1019880701144A KR880701144A KR890700854A KR 890700854 A KR890700854 A KR 890700854A KR 1019880701144 A KR1019880701144 A KR 1019880701144A KR 880701144 A KR880701144 A KR 880701144A KR 890700854 A KR890700854 A KR 890700854A
Authority
KR
South Korea
Prior art keywords
pattern resist
resist
pattern
Prior art date
Application number
KR1019880701144A
Other languages
English (en)
Other versions
KR960007619B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR890700854A publication Critical patent/KR890700854A/ko
Application granted granted Critical
Publication of KR960007619B1 publication Critical patent/KR960007619B1/ko

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0952—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer comprising silver halide or silver salt based image forming systems, e.g. for camera speed exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0551—Exposure mask directly printed on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1019880701144A 1987-01-22 1988-01-19 레지스트의 패턴을 형성하는 방법 KR960007619B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US662487A 1987-01-22 1987-01-22
US006,624 1987-01-22
PCT/US1988/000112 WO1988005559A1 (en) 1987-01-22 1988-01-19 Method of patterning resist

Publications (2)

Publication Number Publication Date
KR890700854A true KR890700854A (ko) 1989-04-27
KR960007619B1 KR960007619B1 (ko) 1996-06-07

Family

ID=21721799

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880701144A KR960007619B1 (ko) 1987-01-22 1988-01-19 레지스트의 패턴을 형성하는 방법

Country Status (7)

Country Link
EP (1) EP0346355B1 (ko)
JP (1) JPH02502675A (ko)
KR (1) KR960007619B1 (ko)
AU (1) AU615430B2 (ko)
DE (1) DE3889448T2 (ko)
DK (1) DK523988A (ko)
WO (1) WO1988005559A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05257227A (ja) * 1991-03-22 1993-10-08 Canon Inc 熱現像性感光体

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB462286A (en) * 1934-11-23 1937-03-04 Paper Patents Co Improvement in methods of stripping and transferring photographic films
DE1298415B (de) * 1962-10-29 1969-06-26 Eastman Kodak Co Verfahren zur UEbertragung von Bildern
GB1187980A (en) * 1966-10-28 1970-04-15 Ilford Ltd Presensitised Lithographic Plates.
US3578451A (en) * 1967-03-29 1971-05-11 Scott Paper Co Integral negative type positive photolithographic plate
US3511657A (en) * 1967-05-10 1970-05-12 Eastman Kodak Co Method of stripping gelatin emulsions from polyester supports
US3607346A (en) * 1969-04-21 1971-09-21 Eastman Kodak Co Layers method of wet transferring unexposed photographic emulsion
AT326703B (de) * 1971-10-07 1975-12-29 Zimmer Peter Verfahren zur herstellung von druckformen
BE794090A (fr) * 1972-01-17 1973-07-16 Minnesota Mining & Mfg Feuille de reproduction a sec a l'argent activee par la chaleur
AT333795B (de) * 1972-10-04 1976-12-10 Zimmer Peter Verfahren zur herstellung von druckformen
US3867150A (en) * 1973-06-08 1975-02-18 Grace W R & Co Printing plate process and apparatus using a laser scanned silver negative
US4168980A (en) * 1977-08-19 1979-09-25 Eastman Kodak Company Heat developable photographic material and process
US4226927A (en) * 1978-05-10 1980-10-07 Minnesota Mining And Manufacturing Company Photographic speed transfer element with oxidized polyethylene stripping layer
JPS5550241A (en) * 1978-10-05 1980-04-11 Fuji Photo Film Co Ltd Photosensitive lithographic printing plate material
JPS5550246A (en) * 1978-10-05 1980-04-11 Fuji Photo Film Co Ltd Photosensitive lithographic printing plate material
JPS5625739A (en) * 1979-08-07 1981-03-12 Fuji Photo Film Co Ltd Preparation of printing plate
JPS5650330A (en) * 1979-10-02 1981-05-07 Fuji Photo Film Co Ltd Photosensitive lithographic plate and its plate making method
JPS5660442A (en) * 1979-10-23 1981-05-25 Fuji Photo Film Co Ltd Photosensitive lithographic plate and method for making lithographic plate
US4409316A (en) * 1982-02-26 1983-10-11 Minnesota Mining And Manufacturing Company Resistively heatable photothermographic element with strippable layer
JPS5965838A (ja) * 1982-10-07 1984-04-14 Dainippon Screen Mfg Co Ltd 多層構造を有する感材およびその製版方法
US4515877A (en) * 1982-11-27 1985-05-07 Basf Aktiengesellschaft Image-recording materials and image-recording carried out using these to produce an optical mask
DE3509747A1 (de) * 1985-03-18 1986-09-18 Heilig & Schwab GmbH, 6553 Sobernheim Verfahren und einrichtung zum exakten punkt- oder linienfoermigen veraendern der chemisch/physikalischen eigenschaften einer strahlungsempfindlichen schicht
US4666818A (en) * 1985-06-10 1987-05-19 The Foxboro Company Method of patterning resist for printed wiring board
AU612563B2 (en) * 1986-12-17 1991-07-18 Foxboro Company, The Method of patterning resist for printed wiring board

Also Published As

Publication number Publication date
EP0346355A1 (en) 1989-12-20
DE3889448T2 (de) 1994-09-29
WO1988005559A1 (en) 1988-07-28
JPH02502675A (ja) 1990-08-23
AU615430B2 (en) 1991-10-03
EP0346355A4 (en) 1991-04-24
KR960007619B1 (ko) 1996-06-07
EP0346355B1 (en) 1994-05-04
DK523988D0 (da) 1988-09-21
DE3889448D1 (de) 1994-06-09
AU1246188A (en) 1988-08-10
DK523988A (da) 1988-11-21

Similar Documents

Publication Publication Date Title
KR910000383A (ko) 미세패턴의 인쇄방법
DK436086D0 (da) Oevelsespatron
CY2008001I2 (el) Antiviral compounds
DK384889D0 (da) Forbedringer relateret til enzymer
DE3752280T2 (de) Mustergenerator
DK55389A (da) Fabrikationsbane
KR900006817A (ko) 레지스트 조성물
DK86788A (da) Spaendekloeer til drejebaenkspatron
KR900702562A (ko) 패턴의 수정방법
DK260888D0 (da) Stillads
KR890700854A (ko) 레지스트를 패턴화 하는 방법
DK163414C (da) Mund-til-mund-genoplivelses-maske
KR890015374A (ko) 레지스트 패턴 형성 공정
DE3856089D1 (de) Fotomasken
DK205286A (da) Oevelsespatron
IT9022326A1 (it) Tabellone
KR890013314U (ko) 입체무늬 망지
MX163854B (es) Mejoras a composicion dentifrica
IT89067917A1 (it) Orinale a perdere
KR870013159U (ko) 마스크
ATA282287A (de) Antivirale 8-phenylxanthine
ES1001565Y (es) Mascarilla
KR880017515U (ko) 마스크
KR900000344U (ko) 바둑판겸용 장기판
MX161174A (es) Tablero estructural subtensado

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee