DE3889448T2 - Photomusterbare Mehrschichtstruktur. - Google Patents
Photomusterbare Mehrschichtstruktur.Info
- Publication number
- DE3889448T2 DE3889448T2 DE3889448T DE3889448T DE3889448T2 DE 3889448 T2 DE3889448 T2 DE 3889448T2 DE 3889448 T DE3889448 T DE 3889448T DE 3889448 T DE3889448 T DE 3889448T DE 3889448 T2 DE3889448 T2 DE 3889448T2
- Authority
- DE
- Germany
- Prior art keywords
- multilayer structure
- photo patternable
- patternable
- photo
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
- G03F7/0952—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer comprising silver halide or silver salt based image forming systems, e.g. for camera speed exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0505—Double exposure of the same photosensitive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0551—Exposure mask directly printed on the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US662487A | 1987-01-22 | 1987-01-22 | |
PCT/US1988/000112 WO1988005559A1 (en) | 1987-01-22 | 1988-01-19 | Method of patterning resist |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3889448D1 DE3889448D1 (de) | 1994-06-09 |
DE3889448T2 true DE3889448T2 (de) | 1994-09-29 |
Family
ID=21721799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3889448T Expired - Fee Related DE3889448T2 (de) | 1987-01-22 | 1988-01-19 | Photomusterbare Mehrschichtstruktur. |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0346355B1 (de) |
JP (1) | JPH02502675A (de) |
KR (1) | KR960007619B1 (de) |
AU (1) | AU615430B2 (de) |
DE (1) | DE3889448T2 (de) |
DK (1) | DK523988A (de) |
WO (1) | WO1988005559A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05257227A (ja) * | 1991-03-22 | 1993-10-08 | Canon Inc | 熱現像性感光体 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB462286A (en) * | 1934-11-23 | 1937-03-04 | Paper Patents Co | Improvement in methods of stripping and transferring photographic films |
DE1298415B (de) * | 1962-10-29 | 1969-06-26 | Eastman Kodak Co | Verfahren zur UEbertragung von Bildern |
GB1187980A (en) * | 1966-10-28 | 1970-04-15 | Ilford Ltd | Presensitised Lithographic Plates. |
US3578451A (en) * | 1967-03-29 | 1971-05-11 | Scott Paper Co | Integral negative type positive photolithographic plate |
US3511657A (en) * | 1967-05-10 | 1970-05-12 | Eastman Kodak Co | Method of stripping gelatin emulsions from polyester supports |
US3607346A (en) * | 1969-04-21 | 1971-09-21 | Eastman Kodak Co | Layers method of wet transferring unexposed photographic emulsion |
AT326703B (de) * | 1971-10-07 | 1975-12-29 | Zimmer Peter | Verfahren zur herstellung von druckformen |
BE794090A (fr) * | 1972-01-17 | 1973-07-16 | Minnesota Mining & Mfg | Feuille de reproduction a sec a l'argent activee par la chaleur |
AT333795B (de) * | 1972-10-04 | 1976-12-10 | Zimmer Peter | Verfahren zur herstellung von druckformen |
US3867150A (en) * | 1973-06-08 | 1975-02-18 | Grace W R & Co | Printing plate process and apparatus using a laser scanned silver negative |
US4168980A (en) * | 1977-08-19 | 1979-09-25 | Eastman Kodak Company | Heat developable photographic material and process |
US4226927A (en) * | 1978-05-10 | 1980-10-07 | Minnesota Mining And Manufacturing Company | Photographic speed transfer element with oxidized polyethylene stripping layer |
JPS5550246A (en) * | 1978-10-05 | 1980-04-11 | Fuji Photo Film Co Ltd | Photosensitive lithographic printing plate material |
JPS5550241A (en) * | 1978-10-05 | 1980-04-11 | Fuji Photo Film Co Ltd | Photosensitive lithographic printing plate material |
JPS5625739A (en) * | 1979-08-07 | 1981-03-12 | Fuji Photo Film Co Ltd | Preparation of printing plate |
JPS5650330A (en) * | 1979-10-02 | 1981-05-07 | Fuji Photo Film Co Ltd | Photosensitive lithographic plate and its plate making method |
JPS5660442A (en) * | 1979-10-23 | 1981-05-25 | Fuji Photo Film Co Ltd | Photosensitive lithographic plate and method for making lithographic plate |
US4409316A (en) * | 1982-02-26 | 1983-10-11 | Minnesota Mining And Manufacturing Company | Resistively heatable photothermographic element with strippable layer |
JPS5965838A (ja) * | 1982-10-07 | 1984-04-14 | Dainippon Screen Mfg Co Ltd | 多層構造を有する感材およびその製版方法 |
US4515877A (en) * | 1982-11-27 | 1985-05-07 | Basf Aktiengesellschaft | Image-recording materials and image-recording carried out using these to produce an optical mask |
DE3509747A1 (de) * | 1985-03-18 | 1986-09-18 | Heilig & Schwab GmbH, 6553 Sobernheim | Verfahren und einrichtung zum exakten punkt- oder linienfoermigen veraendern der chemisch/physikalischen eigenschaften einer strahlungsempfindlichen schicht |
US4666818A (en) * | 1985-06-10 | 1987-05-19 | The Foxboro Company | Method of patterning resist for printed wiring board |
AU612563B2 (en) * | 1986-12-17 | 1991-07-18 | Foxboro Company, The | Method of patterning resist for printed wiring board |
-
1988
- 1988-01-19 WO PCT/US1988/000112 patent/WO1988005559A1/en active IP Right Grant
- 1988-01-19 EP EP88901487A patent/EP0346355B1/de not_active Expired - Lifetime
- 1988-01-19 AU AU12461/88A patent/AU615430B2/en not_active Ceased
- 1988-01-19 DE DE3889448T patent/DE3889448T2/de not_active Expired - Fee Related
- 1988-01-19 JP JP63501556A patent/JPH02502675A/ja active Pending
- 1988-01-19 KR KR1019880701144A patent/KR960007619B1/ko not_active IP Right Cessation
- 1988-09-21 DK DK523988A patent/DK523988A/da not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR960007619B1 (ko) | 1996-06-07 |
AU1246188A (en) | 1988-08-10 |
EP0346355B1 (de) | 1994-05-04 |
DE3889448D1 (de) | 1994-06-09 |
DK523988A (da) | 1988-11-21 |
WO1988005559A1 (en) | 1988-07-28 |
EP0346355A4 (en) | 1991-04-24 |
DK523988D0 (da) | 1988-09-21 |
AU615430B2 (en) | 1991-10-03 |
KR890700854A (ko) | 1989-04-27 |
EP0346355A1 (de) | 1989-12-20 |
JPH02502675A (ja) | 1990-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |