KR890011966A - 금속강화 바아용 분말 피복 조성물 및 이에 의해 피복된 금속강화 바아 - Google Patents

금속강화 바아용 분말 피복 조성물 및 이에 의해 피복된 금속강화 바아 Download PDF

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KR890011966A
KR890011966A KR1019890000417A KR890000417A KR890011966A KR 890011966 A KR890011966 A KR 890011966A KR 1019890000417 A KR1019890000417 A KR 1019890000417A KR 890000417 A KR890000417 A KR 890000417A KR 890011966 A KR890011966 A KR 890011966A
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쥬니어 로버트 디.램프톤
쥬니어 매뉴엘 씨.타일러
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리차드 지.워터맨
더 다우 케미칼 캄파니
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03—Powdery paints

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  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Medicines Containing Antibodies Or Antigens For Use As Internal Diagnostic Agents (AREA)

Abstract

내용 없음

Description

금속강화 바아용 분말 피복 조성물 및 이에 의해 피복된 금속강화 바아
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (6)

  1. (A) (1)(a) 방향족환이 실질적으로 치환된 경우라도 비치환된 것으로 계산하여 170 내지 210의 EEW(에폭사이드 당량)를 갖는 하나 이상의 방향족 디에폭사이드, 및 (b) 하나 이상의 지방족 디에폭사이드[여기에서, 성분(a) 및 (b)는 70 내지 95%의 에폭사이드 그룹이 성분(a)에 의하여 제공되고, 30 내지 5%의 에폭사이드 그룹이 성분(b)에 의하여 제공되는 양으로 사용된다]를 필수적으로 함유하는 혼합물을 (2) 성분 A-1중에 함유된 에폭시 그룹 당성분 A-2중의 방향족 히드록실 그룹의 비가 0.41 : 1 내지 0.51 : 1인 양으로 분자당 두개의 방향족 히드록실 그룹을 갖는 화합물과 반응시켜 제조한 고체 에폭시 수지,
    (B) 성분(A)에 대한 경화제로서, 분자당 평균 하나이상의 페놀성 히드록실 그룹을 갖는 경화량의 화합물,
    (C) 성분(B)에 대한 경화촉진제로서, 분자당 두개의 페놀성 히드록실 그룹을 갖는 화합물의 디글리시딜 에테르를 함유하는 촉진량의 2급 아민의 부가물 또는 3급 아민,
    (D) 하나 이상의 충진제, 안료 또는 염료, 및
    (E) 하나 이상의 유동 조절제를 필수적으로 함유하는, 바아(bar) 강화용 분말 피복 조성물.
  2. 제1항에 있어서,
    (i) 성분(A-1-a) 및 (A-1-b)가, 75 내지 95%의 에폭사이드 그룹이 성분(a)에 의하여 제공되며, 25 내지 5%의 에폭사이드 그룹이 성분(B)에 의하여 제공되는 양으로 사용되고,
    (ⅱ) 성분(A-2)가, 성분 A-1중에 함유된 에폭시 그룹당 성분(A-2)중의 방향족 히드록실 그룹의 비가 0.44:1 내지 0.51:1의 양으로 사용되며,
    (ⅲ) 성분(B)가 성분(A)의 중량을 기준하여 5 내지 25중량%의 양으로 사용되는 분말 피복 조성물.
  3. 제2항에 있어서,
    (ⅰ) 성분(A-1-a) 및 (A-1-b)가, 80 내지 95%의 에폭사이드 그룹이 성분(a)에 의하여 제공되고, 20 내지 5%의 에폭사이드 그룹이 성분(b)에 의하여 제공되는 양으로 사용되며,
    (ⅱ) 성분(A-2)가 , 성분(A-1)중에 함유된 에폭시 그룹당 성분(A-2)중의 방향족 히드록실 그룹의 비가 0.47:1 내지 0.49:1의 양으로 사용되고,
    (ⅲ) 성분(B)가 성분(A)의 중량을 기준하여 5 내지 20중량%의 양으로 사용되며,
    (ⅳ) 성분(C)가 성분(A)의 중량을 기준하여 1 내지 10중량%의 양으로 사용되는 분말 피복 조성물.
  4. 제3항에 있어서,
    (ⅰ) 성분(B)가 성분(A)의 중량을 기준하여 7 내지 14중량%의 양으로 사용되고,
    (ⅱ) 성분(C)가 성분(A)의 중량을 기준하여 1 내지 8중량%의 양으로 사용되는 분말 피복 조성물.
  5. 제1항에 있어서,
    (ⅰ) 성분(A-1-a)가 비스페놀 A의 디글리시딜 에테르이고,
    (ⅱ) 성분(A-1-b)가 디프로필렌 글리콜, 트리프로필렌 글리콜의 디글리시딜 에테르이거나 400이하의 히드록실 당량을 갖는 폴리옥시프로필렌 디올이며,
    (ⅲ) 성분(B)가 비스페놀 A이고,
    (ⅳ) 성분(C)가 과량의 비스페놀 A 및 170 내지 210의 EEW를 갖는 비스페놀 A의 디글리시딜 에테르의 부가물이며, 및
    (ⅴ) 성분(D)가 분자당 두개의 방향족 히드록실 그룹을 갖는 화합물의 디글리시딜 에테르 및 2급 아민의 부가물인 분말 피복 조성물.
  6. 제1항의 조성물로 피복된 금속강화 바아.
    ※ 참고사항: 최초출원 내용에 의하여 공개하는 것임.
KR1019890000417A 1988-01-19 1989-01-17 고체 에폭시 수지, 이의 용도, 이를 함유하는 분말 피복 조성물 및 이의 적용 방법 KR0127902B1 (ko)

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US14535088A 1988-01-19 1988-01-19
US145,350 1988-01-19

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KR0127902B1 KR0127902B1 (ko) 1998-04-04

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EP (1) EP0325146B1 (ko)
JP (1) JPH028264A (ko)
KR (1) KR0127902B1 (ko)
AT (1) ATE120216T1 (ko)
AU (1) AU612439B2 (ko)
BR (1) BR8900076A (ko)
DE (1) DE68921772T2 (ko)
DK (1) DK23589A (ko)
ES (1) ES2069549T3 (ko)
FI (1) FI890261A (ko)
NO (1) NO890218L (ko)
NZ (1) NZ227578A (ko)
PT (1) PT89410B (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346933A (en) * 1992-12-30 1994-09-13 Cerdec Corporation Thermoplastic/thermosettable coatings or inks for glass, ceramic and other hard surfaces
US5407978A (en) * 1993-05-07 1995-04-18 Minnesota Mining And Manufacturing Company Rapid curing powder epoxy coating compositions having increased flexibility, incorporating minor amounts of aliphatic triepoxides
US5733954A (en) * 1995-12-14 1998-03-31 Minnesota Mining And Manufacturing Company Epoxy resin curing agent made via aqueous dispersion of an epoxide and an imidazole
US5717011A (en) * 1995-12-14 1998-02-10 Minnesota Mining And Manufacturing Company Curing agent compositions and a method of making
US6703070B1 (en) 1997-11-04 2004-03-09 Morton International, Inc. One-component, low temperature curable coating powder
EP1391490A1 (en) * 2002-08-23 2004-02-25 Vantico Gmbh Modified epoxy resins for triboelectric coating processes

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1027884B (it) * 1974-12-20 1978-12-20 Sir Soc Italiana Resine Spa Procedimento per la preparazione di poliespossidi
US4176142A (en) * 1978-05-22 1979-11-27 Western Electric Company, Inc. Powder coating composition
AU567882B2 (en) * 1982-06-10 1987-12-10 Dow Chemical Company, The Advanced epoxy resins and coating compositions containing the advanced epoxy resins.
US4647525A (en) * 1984-10-01 1987-03-03 Minnesota Mining And Manufacturing Company Stabilized leuco phenazine dyes and their use in an imaging system
ES2002379A6 (es) * 1985-09-27 1988-08-01 Dow Chemical Co Procedimiento para preparar una composicion de revestimiento en polvo y metodo de revestir un sustrato.

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DK23589A (da) 1989-07-20
ATE120216T1 (de) 1995-04-15
NO890218D0 (no) 1989-01-18
DE68921772D1 (de) 1995-04-27
DK23589D0 (da) 1989-01-19
FI890261A0 (fi) 1989-01-18
NZ227578A (en) 1991-08-27
BR8900076A (pt) 1989-09-05
PT89410B (pt) 1993-09-30
JPH028264A (ja) 1990-01-11
DE68921772T2 (de) 1995-07-13
EP0325146A2 (en) 1989-07-26
ES2069549T3 (es) 1995-05-16
FI890261A (fi) 1989-07-20
NO890218L (no) 1989-07-20
KR0127902B1 (ko) 1998-04-04
EP0325146A3 (en) 1990-09-26
EP0325146B1 (en) 1995-03-22
AU2685988A (en) 1989-07-20
AU612439B2 (en) 1991-07-11
PT89410A (pt) 1990-02-08

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