KR890011505A - 인쇄회로기판과 그의 제조방법 - Google Patents

인쇄회로기판과 그의 제조방법 Download PDF

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Publication number
KR890011505A
KR890011505A KR1019870015679A KR870015679A KR890011505A KR 890011505 A KR890011505 A KR 890011505A KR 1019870015679 A KR1019870015679 A KR 1019870015679A KR 870015679 A KR870015679 A KR 870015679A KR 890011505 A KR890011505 A KR 890011505A
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KR
South Korea
Prior art keywords
resin
substrate
metal layer
circuit
conductive resin
Prior art date
Application number
KR1019870015679A
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English (en)
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KR900005308B1 (ko
Inventor
문덕만
Original Assignee
문덕만
정풍물산 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 문덕만, 정풍물산 주식회사 filed Critical 문덕만
Priority to KR1019870015679A priority Critical patent/KR900005308B1/ko
Priority to JP63130050A priority patent/JPH02146793A/ja
Priority to EP88306408A priority patent/EP0322997A3/en
Publication of KR890011505A publication Critical patent/KR890011505A/ko
Application granted granted Critical
Publication of KR900005308B1 publication Critical patent/KR900005308B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

내용 없음

Description

인쇄회로기판과 그의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 다라 제조되는 인쇄회로기판의 단면도.

Claims (7)

  1. 인쇄회로기판에 있어서, 열경화성수지 열가소성수지 또는 세라믹으로된 기판(10)상에 실크스크린방식에 의해 회로형태로 전도성수지층(11)이 형성되어 있고, 상기 전도성수지층(11)상에는 무전해도금방법에 의해 금속층(12)이 피막되어 있으며, 상기 전도성수지층(11)과 금속층(12)이 이루는 회로에는 절연성수지피막 (13)이 도포된 형태로 되어 있는 것을 특징으로 하는 인쇄회로기판.
  2. 수지를 기재로하여 인쇄회로기판을 제조하는데 있어서, 기판의 일면 또는 양면에 전도성수지를 회로형태로 실크스크린하고, 이를 120℃ 내지 300℃에서 약 4분 내지 10분동안 건조 및 완전경화시켜서 기판상에 전도성수지로된 회로를 인쇄해 놓는 제1공정과, 상기 전도성수지가 인쇄된 기판을 20 내지 40분동안 무전해 금속도금용액중에 침지시켜서 무전해도금을 실시하여 상기 회로상에만 금속층을 형성시키는 제2공정과, 그 위에다 절연성수지를 재차도포시키고 회로부품삽입부위를 프레스에 의해 펀칭가공하게 되는 제3공정으로 이루어져서 되어짐을 특징으로 하는 인쇄회로기판의 제조방법.
  3. 제1항에 있어서, 원자재기판은 열경화성수지, 열가소성수지 또는 세라믹중에서 선택된 어느 하나인 것을 특징으로 하는 방법.
  4. 제2항에 있어서, 열경화성수지는 페놀수지, 에폭시수지, 멜라민수지 또는 크리스탈수지이고, 열가소성수지로는 테프론, 폴리이미드 또는 엔지니어링플라스틱을 사용하여서 되어지는 방법.
  5. 제1항에 있어서, 전도성수지로는 실버 40 내지 60부, 바니쉬 20 내지 40부, 신나 5 내지 20부 및 소부용오일 5 내지 20부를 혼합시켜서 된 것을 사용하여서 됨을 특징으로 하는 방법.
  6. 제1항에 있어서, 금속층은 구리, 니켈 또는 금으로 형성됨을 특징으로 하는 방법.
  7. 제1항에 있어서, 금속층은 그 두께가 약 10 내지 20㎛정도로 형성됨을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870015679A 1987-12-31 1987-12-31 인쇄회로기판과 그의 제조방법 KR900005308B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019870015679A KR900005308B1 (ko) 1987-12-31 1987-12-31 인쇄회로기판과 그의 제조방법
JP63130050A JPH02146793A (ja) 1987-12-31 1988-05-27 印刷回路基板の製造方法
EP88306408A EP0322997A3 (en) 1987-12-31 1988-07-13 Process for making printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019870015679A KR900005308B1 (ko) 1987-12-31 1987-12-31 인쇄회로기판과 그의 제조방법

Publications (2)

Publication Number Publication Date
KR890011505A true KR890011505A (ko) 1989-08-14
KR900005308B1 KR900005308B1 (ko) 1990-07-27

Family

ID=19267924

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870015679A KR900005308B1 (ko) 1987-12-31 1987-12-31 인쇄회로기판과 그의 제조방법

Country Status (3)

Country Link
EP (1) EP0322997A3 (ko)
JP (1) JPH02146793A (ko)
KR (1) KR900005308B1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4227085A1 (de) * 1992-08-17 1994-02-24 Bosch Gmbh Robert Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger Schichten
JP2009545868A (ja) * 2006-08-03 2009-12-24 ビーエーエスエフ ソシエタス・ヨーロピア 構造化導電性表面を製造するための方法
ATE474080T1 (de) 2007-02-20 2010-07-15 Basf Se Verfahren zur herstellung von metallisierten textilen oberflächen mit strom erzeugenden oder strom verbrauchenden artikeln
CN107072037A (zh) * 2017-03-15 2017-08-18 西华大学 一种电路板以及一种网基板
CN112672531B (zh) * 2020-11-30 2023-10-24 江门荣信电路板有限公司 Pcb单面基板的双面加工方法
CN116940002B (zh) * 2023-06-13 2024-03-29 湖北龙腾电子科技股份有限公司 一种电路板的制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629185A (en) * 1969-10-17 1971-12-21 Kollmorgen Corp Metallization of insulating substrates
JPS5210568A (en) * 1974-12-28 1977-01-26 Hideo Machida Method of manufacturing multilayered printed wiring substrate
JPS5212463A (en) * 1975-07-17 1977-01-31 Matsushita Electric Ind Co Ltd Printed circuit board
JPS5422580A (en) * 1977-07-21 1979-02-20 Fuji Electric Co Ltd Interrupting capacity testing circuit for circuit breaker
GB2038101B (en) * 1978-12-19 1983-02-09 Standard Telephones Cables Ltd Printed circuits
DE2938465C2 (de) * 1979-09-22 1982-01-21 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Leitermasse
GB2078448B (en) * 1980-06-19 1984-03-14 Standard Telephones Cables Ltd Electrical printed circuits
JPS57147295A (en) * 1981-03-06 1982-09-11 Hitachi Ltd Hybrid integrated circuit
JPS6276600A (ja) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
JPS62247586A (ja) * 1986-04-19 1987-10-28 原町精器株式会社 プリント基板の製造方法

Also Published As

Publication number Publication date
KR900005308B1 (ko) 1990-07-27
EP0322997A2 (en) 1989-07-05
EP0322997A3 (en) 1990-04-25
JPH02146793A (ja) 1990-06-05

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