KR880010861A - 땜납 조성물 - Google Patents

땜납 조성물 Download PDF

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Publication number
KR880010861A
KR880010861A KR1019870015384A KR870015384A KR880010861A KR 880010861 A KR880010861 A KR 880010861A KR 1019870015384 A KR1019870015384 A KR 1019870015384A KR 870015384 A KR870015384 A KR 870015384A KR 880010861 A KR880010861 A KR 880010861A
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KR
South Korea
Prior art keywords
metal
solder composition
alloy powder
constituting
solder
Prior art date
Application number
KR1019870015384A
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English (en)
Inventor
히로시 야기
아쯔조오 다마시마
Original Assignee
사또오 히로시
데이 데이 게이 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사또오 히로시, 데이 데이 게이 가부시기가이샤 filed Critical 사또오 히로시
Publication of KR880010861A publication Critical patent/KR880010861A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/266—Cd as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)

Abstract

내용 없음

Description

땜납 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. 용융접저하를 위한 금속첨가제를 포함하는 낮은 용융땜납가루와 합금가루를 구성하며, 전기한 금속첨가제는 납땜온도에서 전기한 합금가루와 반응하며 그것에 의해서 높은 재용융점을 가지고 있는 반응 생성물을 형성하는 것을 특징으로 하는 땜납조성물.
  2. 제1항에 있어서, 전기한 땜납조성물이 130℃혹은 더 낮은 용융점과 150℃ 혹은 더 높은 재용융점을 가지고 있는 것을 특징으로 하는 땜납 조성물.
  3. 제1항에 있어서, 전기한 금속첨가제가 Bi, In, Cd를 구성하는 기로부터 선택된 하나 혹은 그 이상의 금속인 것을 특징으로 하는 땜납 조성물.
  4. 제4항에 있어서, 전기한 금속첨가제가 Bi, In, Cd의 혼합물인 것을 특징으로 하는 땜납조성물.
  5. 제1항에 있어서, 전기한 합금가루가 Se, Te, Ti을 구성하는 기초부터 선택된 금속과 Sn그리고 Pb를 구성하는 기로부터 선택된 금속을 구성하는 것을 특징으로 하는 땜납조성물.
  6. 제1항에 있어서, 전기한 금속첨가제 Bi, In, Cd를 구성하는 기로부터 선택된 하나 혹은 그 이상의 금속이며, 전기한 합금가루는 Se, Te, Ti을 구성하는 기로부터 선택된 금속과 Sn 그리고 Pb를 구성하는 기로부터 선택된 금속을 구성하며, 전기한 금속첨가제는 납땜온도에서 전기한 합금가루와 반응하며 그것에 의해서 높은 재용융점을 가지고 있는 반응생성물을 형성하는 것을 특징으로 하는 땜납 조성물.
  7. 제1항에 있어서, 전기한 금속첨가제 Bi, In, Cd의 혼합물이며 전기한 합금가루는 Se, Te, T1을 구성하는 기로부터 선택된 금속과 Sn 그리고 Pb를 구성하는 기로부터 선택된 금속을 구성하며, 전기한 금속첨가제는 납땜 온도에서 전기한 합금가루의 전기한 Se, Te, T1과 반응하며 그것에 의해서 높은 재용융점을 가지고 있는 반응생성물을 형성하는 것을 특징으로 하는 땜납조성물.
  8. 제1항에 있어서, 전기한 낮은 용융땜납가루와 합금가루가 40에서 90가지 대60에서 10까지의 중량퍼센트의 비율로 혼합되는 것을 특징으로 하는 땜납조성물.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019870015384A 1987-03-25 1987-12-30 땜납 조성물 KR880010861A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62071232A JPS63238994A (ja) 1987-03-25 1987-03-25 半田組成物
JP?62-71232 1987-03-25

Publications (1)

Publication Number Publication Date
KR880010861A true KR880010861A (ko) 1988-10-25

Family

ID=13454737

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870015384A KR880010861A (ko) 1987-03-25 1987-12-30 땜납 조성물

Country Status (7)

Country Link
US (1) US4834794A (ko)
JP (1) JPS63238994A (ko)
KR (1) KR880010861A (ko)
CA (1) CA1330168C (ko)
DE (1) DE3807424A1 (ko)
FR (1) FR2612822B1 (ko)
GB (1) GB2202860B (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR927003861A (ko) * 1990-03-06 1992-12-18 유나이티드 스테이츠 브론즈 파우더즈 인코포레이티드 분말 야금조성물 및 이에 관한 개선방법
ES2128989B1 (es) * 1992-01-29 2000-02-16 Mecanismos Aux Ind Mejoras introducidas en la patente de invencion n-9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes.
US5242658A (en) * 1992-07-07 1993-09-07 The Indium Corporation Of America Lead-free alloy containing tin, zinc and indium
WO1996019314A1 (de) * 1994-12-22 1996-06-27 Siemens Aktiengesellschaft Lotmetall und dessen verwendung zur bildung einer lötverbindung zwischen zwei objekten
DE19606101A1 (de) * 1996-02-19 1997-08-21 Siemens Ag Halbleiterkörper mit Lotmaterialschicht
US5871690A (en) * 1997-09-29 1999-02-16 Ford Motor Company Low-temperature solder compositions
CA2410636A1 (en) 2000-05-24 2001-11-29 Stephen F. Corbin Variable melting point solders and brazes
ATE365378T1 (de) * 2000-07-28 2007-07-15 Infineon Technologies Ag Verfahren zur kontaktierung eines halbleiterbauelementes
US7168608B2 (en) * 2002-12-24 2007-01-30 Avago Technologies General Ip (Singapore) Pte. Ltd. System and method for hermetic seal formation
US7017795B2 (en) * 2003-11-03 2006-03-28 Indium Corporation Of America Solder pastes for providing high elasticity, low rigidity solder joints
JP2005183903A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子デバイスおよび電子デバイスを形成する方法
JP2005183904A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品
TW201210733A (en) 2010-08-26 2012-03-16 Dynajoin Corp Variable melting point solders
FR3078497B1 (fr) * 2018-03-05 2020-03-13 Irt Saint Exupery Creme a braser, procede de preparation d’une telle creme a braser et procede de brasage la mettant en œuvre
US11581239B2 (en) 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE836589C (de) * 1950-11-03 1952-04-15 Rau Fa G Loetverfahren
US2725287A (en) * 1952-11-26 1955-11-29 Raytheon Mfg Co Molybdenum solder powder
US3155491A (en) * 1961-12-26 1964-11-03 Gen Electric Brazing alloy
CH408608A (de) * 1963-01-31 1966-02-28 Bbc Brown Boveri & Cie Verfahren zum Herstellen einer Lötverbindung
JPS4636446Y1 (ko) * 1967-10-12 1971-12-15
US3617396A (en) * 1969-04-22 1971-11-02 Ltv Aerospace Corp Brazing mixture for joining parts
US4381944A (en) * 1982-05-28 1983-05-03 General Electric Company Superalloy article repair method and alloy powder mixture
JPS59218744A (ja) * 1983-05-27 1984-12-10 Hitachi Ltd ボンデイング方法
GB2171720A (en) * 1985-02-21 1986-09-03 London Scandinavian Metall Grain refining a solder alloy
JPS61273296A (ja) * 1985-05-29 1986-12-03 Taruchin Kk 耐食性はんだ合金
US4734256A (en) * 1986-04-21 1988-03-29 Allied-Signal Inc. Wetting of low melting temperature solders by surface active additions

Also Published As

Publication number Publication date
GB2202860A (en) 1988-10-05
GB8728681D0 (en) 1988-01-13
DE3807424A1 (de) 1988-10-06
FR2612822A1 (fr) 1988-09-30
GB2202860B (en) 1991-01-23
FR2612822B1 (fr) 1994-07-29
CA1330168C (en) 1994-06-14
US4834794A (en) 1989-05-30
JPS63238994A (ja) 1988-10-05

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SUBM Submission of document of abandonment before or after decision of registration