KR880005844A - 전자 방해파의 발생을 저감한 전자장치 - Google Patents

전자 방해파의 발생을 저감한 전자장치 Download PDF

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Publication number
KR880005844A
KR880005844A KR870011780A KR870011780A KR880005844A KR 880005844 A KR880005844 A KR 880005844A KR 870011780 A KR870011780 A KR 870011780A KR 870011780 A KR870011780 A KR 870011780A KR 880005844 A KR880005844 A KR 880005844A
Authority
KR
South Korea
Prior art keywords
electronic device
conductor pattern
connector
electromagnetic interference
reduced generation
Prior art date
Application number
KR870011780A
Other languages
English (en)
Other versions
KR900005306B1 (ko
Inventor
유끼오 쯔네끼
Original Assignee
아오이 죠이찌
가부시기가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이찌, 가부시기가이샤 도시바 filed Critical 아오이 죠이찌
Publication of KR880005844A publication Critical patent/KR880005844A/ko
Application granted granted Critical
Publication of KR900005306B1 publication Critical patent/KR900005306B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

내용 없음

Description

전자 방해파의 발생을 저감한 전자장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예의 구성을 표시하는 사시도.
제2도는 동 실시예에 사용되는 콘덴서 모듈의 구성을 표시하는 사시도.
* 도면의 주요부분에 대한 부호의 설명
1 : 인자장치 2, 3, 6 : 커넥터
4 : 케이블 5 : 플레이드
7 : 프린트 기판 8 : 인터페이스 IC
9, 12 : 도체 패턴 10, 14, 15 : 리드핀
11 : 콘덴서 모듈 13 : 콘덴서

Claims (4)

  1. 커넥터를 장치하고, 이 커넥터를 개재하여 외부기기와의 사이에서 신호를 입출력하는 회로를 설치한 프린트회로 기판을 가지는 전자장치에 있어서, 상기 프린트회로 기판이 상기 커넥터와 상기 회로와의 사이를 전기적으로 접속하고, 상기 커넥터와 접속되는 단부가 다른 부분보다 폭이 넓게 구성된 적어도 1개의 도체 패턴과, 일단이 접지전위에 접속된 적어도 1개의 제2의 도체 패턴과, 일단이 상기 제1의 도체 패턴의 폭이 넓은 부분의 상기 회로 측단부에 접속되고, 타단이 상기 제2의 도체 패턴의 타단에 접속된 적어도 1개의 콘덴서를 구비하는 것을 특징으로 하는 전자장치.
  2. 제1항에 있어서, 상기 회로는 IC 소자를 포함하는 것을 특징으로 하는 전자장치.
  3. 제1항에 있어서, 상기 제2의 도체 패턴의 폭이 상기 제1의 도체 패턴의 상기 다른 부분보다 폭이 넓게 구성되는 것을 특징으로 하는 전자장치.
  4. 제1항에 있어서, 상기 전자장치가 프린터인 것을 특징으로 하는 전자장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870011780A 1986-10-24 1987-10-23 전자 방해파의 발생을 저감한 전자장치 KR900005306B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61252876A JPH0716116B2 (ja) 1986-10-24 1986-10-24 電子装置
JP252876 1986-10-24
JP86-252876 1986-10-24

Publications (2)

Publication Number Publication Date
KR880005844A true KR880005844A (ko) 1988-06-30
KR900005306B1 KR900005306B1 (ko) 1990-07-27

Family

ID=17243391

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870011780A KR900005306B1 (ko) 1986-10-24 1987-10-23 전자 방해파의 발생을 저감한 전자장치

Country Status (3)

Country Link
US (1) US4908735A (ko)
JP (1) JPH0716116B2 (ko)
KR (1) KR900005306B1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009614A (en) * 1990-05-31 1991-04-23 Amp Incorporated Shielded cable assembly with floating ground
US5410107A (en) 1993-03-01 1995-04-25 The Board Of Trustees Of The University Of Arkansas Multichip module
JP3581971B2 (ja) * 1996-05-22 2004-10-27 株式会社ボッシュオートモーティブシステム 車載用コントロールユニットのｅｍｉ用接地構造
JP3471607B2 (ja) 1998-04-24 2003-12-02 日本電気株式会社 疑似大地化方法及び装置
JP5423691B2 (ja) * 2011-01-12 2014-02-19 株式会社デンソー 電子装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3486077A (en) * 1967-10-30 1969-12-23 Motorola Inc Assembly having a chassis and removably mounted panels
US3591834A (en) * 1969-12-22 1971-07-06 Ibm Circuit board connecting means
US3714709A (en) * 1970-07-06 1973-02-06 Rca Corp Method of manufacturing thick-film hybrid integrated circuits
US3818117A (en) * 1973-04-23 1974-06-18 E Reyner Low attenuation flat flexible cable
US3703604A (en) * 1971-11-30 1972-11-21 Amp Inc Flat conductor transmission cable
GB1481700A (en) * 1974-06-06 1977-08-03 Quantel Ltd Interconnection of circuit boards
US4330684A (en) * 1977-12-27 1982-05-18 Hayward C Michael Matrix board
DE2915240A1 (de) * 1978-06-28 1980-01-03 Mitsumi Electric Co Gedruckte schaltung
GB2060266B (en) * 1979-10-05 1984-05-31 Borrill P L Multilayer printed circuit board
US4583150A (en) * 1983-01-21 1986-04-15 Methode Electronics, Inc. Printed circuit boards
US4617471A (en) * 1983-12-27 1986-10-14 Kabushiki Kaisha Toshiba Image sensing device
US4605915A (en) * 1984-07-09 1986-08-12 Cubic Corporation Stripline circuits isolated by adjacent decoupling strip portions

Also Published As

Publication number Publication date
JPH0716116B2 (ja) 1995-02-22
KR900005306B1 (ko) 1990-07-27
US4908735A (en) 1990-03-13
JPS63107195A (ja) 1988-05-12

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