KR870700274A - 개선된 리이드 프레임 및 이를 사용한 프라스틱 캡슐 반도체 소자 제조방법 - Google Patents
개선된 리이드 프레임 및 이를 사용한 프라스틱 캡슐 반도체 소자 제조방법Info
- Publication number
- KR870700274A KR870700274A KR1019860700308A KR860700308A KR870700274A KR 870700274 A KR870700274 A KR 870700274A KR 1019860700308 A KR1019860700308 A KR 1019860700308A KR 860700308 A KR860700308 A KR 860700308A KR 870700274 A KR870700274 A KR 870700274A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- same
- lead frame
- manufacturing plastic
- plastic capsule
- Prior art date
Links
- 239000002775 capsule Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US1984/001545 WO1986002200A1 (en) | 1984-09-27 | 1984-09-27 | Lead frame having improved arrangement of supporting leads and semiconductor device employing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR870700274A true KR870700274A (ko) | 1987-08-20 |
Family
ID=22182273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019860700308A KR870700274A (ko) | 1984-09-27 | 1986-05-27 | 개선된 리이드 프레임 및 이를 사용한 프라스틱 캡슐 반도체 소자 제조방법 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS62500338A (ko) |
| KR (1) | KR870700274A (ko) |
| WO (1) | WO1986002200A1 (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4800419A (en) * | 1987-01-28 | 1989-01-24 | Lsi Logic Corporation | Support assembly for integrated circuits |
| JP2637247B2 (ja) * | 1989-09-12 | 1997-08-06 | 株式会社東芝 | 樹脂封止型半導体装置 |
| US5173766A (en) * | 1990-06-25 | 1992-12-22 | Lsi Logic Corporation | Semiconductor device package and method of making such a package |
| US5213748A (en) * | 1991-06-27 | 1993-05-25 | At&T Bell Laboratories | Method of molding a thermoplastic ring onto a leadframe |
| KR0148203B1 (ko) * | 1995-06-05 | 1998-08-01 | 이대원 | 리드 프레임의 내부 리드 설계 방법 |
| CN105990297A (zh) * | 2015-01-28 | 2016-10-05 | 苏州普福斯信息科技有限公司 | 不对等模腔配合无下沉导线框的结构 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3716764A (en) * | 1963-12-16 | 1973-02-13 | Texas Instruments Inc | Process for encapsulating electronic components in plastic |
| US3950140A (en) * | 1973-06-11 | 1976-04-13 | Motorola, Inc. | Combination strip frame for semiconductive device and gate for molding |
| NL189379C (nl) * | 1977-05-05 | 1993-03-16 | Richardus Henricus Johannes Fi | Werkwijze voor inkapselen van micro-elektronische elementen. |
| JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
| US4477827A (en) * | 1981-02-02 | 1984-10-16 | Northern Telecom Limited | Lead frame for leaded semiconductor chip carriers |
-
1984
- 1984-09-27 WO PCT/US1984/001545 patent/WO1986002200A1/en unknown
- 1984-09-27 JP JP59503623A patent/JPS62500338A/ja active Pending
-
1986
- 1986-05-27 KR KR1019860700308A patent/KR870700274A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62500338A (ja) | 1987-02-05 |
| WO1986002200A1 (en) | 1986-04-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |