KR870001283A - 열경화성 접착필름 - Google Patents
열경화성 접착필름 Download PDFInfo
- Publication number
- KR870001283A KR870001283A KR1019860005955A KR860005955A KR870001283A KR 870001283 A KR870001283 A KR 870001283A KR 1019860005955 A KR1019860005955 A KR 1019860005955A KR 860005955 A KR860005955 A KR 860005955A KR 870001283 A KR870001283 A KR 870001283A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive film
- thermosetting adhesive
- film according
- thermosetting
- polymerizable compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims 14
- 239000002313 adhesive film Substances 0.000 title claims 13
- 150000001875 compounds Chemical class 0.000 claims 9
- 150000001336 alkenes Chemical class 0.000 claims 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 3
- 229920002554 vinyl polymer Polymers 0.000 claims 3
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 239000011148 porous material Substances 0.000 claims 2
- 229930185605 Bisphenol Natural products 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000004849 latent hardener Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 150000002978 peroxides Chemical class 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 239000002516 radical scavenger Substances 0.000 claims 1
- 229920006163 vinyl copolymer Polymers 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Epoxy Resins (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3526270.2 | 1985-07-23 | ||
| DE19853526270 DE3526270A1 (de) | 1985-07-23 | 1985-07-23 | Waermehaertbare klebfolie |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR870001283A true KR870001283A (ko) | 1987-03-12 |
Family
ID=6276492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019860005955A Withdrawn KR870001283A (ko) | 1985-07-23 | 1986-07-22 | 열경화성 접착필름 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0209859A3 (enExample) |
| JP (1) | JPS6222879A (enExample) |
| KR (1) | KR870001283A (enExample) |
| CN (1) | CN86105150A (enExample) |
| DE (1) | DE3526270A1 (enExample) |
| ES (1) | ES2000126A6 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6057382A (en) * | 1998-05-01 | 2000-05-02 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
| US6228133B1 (en) | 1998-05-01 | 2001-05-08 | 3M Innovative Properties Company | Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component |
| US6274643B1 (en) | 1998-05-01 | 2001-08-14 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
| US6136398A (en) * | 1998-05-01 | 2000-10-24 | 3M Innovative Properties Company | Energy cured sealant composition |
| US6077601A (en) * | 1998-05-01 | 2000-06-20 | 3M Innovative Properties Company | Coated abrasive article |
| DE10328047B3 (de) * | 2003-06-23 | 2005-04-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Aus Metallschaumbausteinen aufgebautes Bauteil und Verfahren zu seiner Herstellung |
| US6843815B1 (en) * | 2003-09-04 | 2005-01-18 | 3M Innovative Properties Company | Coated abrasive articles and method of abrading |
| CN101649169B (zh) * | 2009-08-31 | 2012-12-12 | 广东达美新材料有限公司 | 一种保护纸用水敏性压敏胶 |
| DE102011105209A1 (de) | 2011-06-17 | 2012-12-20 | Lohmann Gmbh & Co Kg | Reaktives Klebebandpolymerisat |
| DE202011104393U1 (de) | 2011-06-29 | 2012-02-13 | Lohmann Gmbh & Co. Kg | Reaktives Klebebandpolymerisat |
| CN106046780B (zh) * | 2016-06-03 | 2018-09-25 | 中蓝晨光化工研究设计院有限公司 | 引入有热固性环氧树脂的防弹材料及其制备方法 |
| EP3521396B1 (en) | 2016-09-30 | 2021-09-15 | Sekisui Chemical Co., Ltd. | Epoxy adhesive composition |
| CN116925685A (zh) * | 2022-03-30 | 2023-10-24 | 3M创新有限公司 | 可固化组合物、可固化胶膜以及胶带 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1077246A (fr) * | 1952-04-14 | 1954-11-05 | Bataafsche Petroleum | Composition contenant du glycidyléther et une résine de polyvinyl acétal |
| US3058951A (en) * | 1959-06-23 | 1962-10-16 | Gen Electric | Composition comprising an epoxy resin, a polyvinyl acetal resin, and a polyacrylate resin, and an article coated therewith |
| NZ201589A (en) * | 1981-11-02 | 1985-08-16 | Grace W R & Co | Heat activatable adhesive or sealant compositions |
| DE3243383A1 (de) * | 1982-11-24 | 1984-05-24 | Beiersdorf Ag, 2000 Hamburg | Klebfolie |
| US4612209A (en) * | 1983-12-27 | 1986-09-16 | Ciba-Geigy Corporation | Process for the preparation of heat-curable adhesive films |
-
1985
- 1985-07-23 DE DE19853526270 patent/DE3526270A1/de active Granted
-
1986
- 1986-07-18 EP EP86109865A patent/EP0209859A3/de not_active Withdrawn
- 1986-07-22 ES ES868600452A patent/ES2000126A6/es not_active Expired
- 1986-07-22 KR KR1019860005955A patent/KR870001283A/ko not_active Withdrawn
- 1986-07-23 CN CN198686105150A patent/CN86105150A/zh active Pending
- 1986-07-23 JP JP61171944A patent/JPS6222879A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0209859A3 (de) | 1987-11-19 |
| EP0209859A2 (de) | 1987-01-28 |
| JPS6222879A (ja) | 1987-01-31 |
| DE3526270A1 (de) | 1987-02-05 |
| ES2000126A6 (es) | 1987-12-16 |
| DE3526270C2 (enExample) | 1987-04-30 |
| CN86105150A (zh) | 1987-02-04 |
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| JPS5466999A (en) | Transparent thermosetting resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19860722 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |