KR870000700B1 - 마이크로캡슈울을 함유하는 접착제 - Google Patents
마이크로캡슈울을 함유하는 접착제 Download PDFInfo
- Publication number
- KR870000700B1 KR870000700B1 KR1019840000129A KR840000129A KR870000700B1 KR 870000700 B1 KR870000700 B1 KR 870000700B1 KR 1019840000129 A KR1019840000129 A KR 1019840000129A KR 840000129 A KR840000129 A KR 840000129A KR 870000700 B1 KR870000700 B1 KR 870000700B1
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive
- microcapsule
- solvent
- resin
- prepolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/06—Making microcapsules or microballoons by phase separation
- B01J13/14—Polymerisation; cross-linking
- B01J13/18—In situ polymerisation with all reactants being present in the same phase
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/247—Moulding polymers or prepolymers containing ingredients in a frangible packaging, e.g. microcapsules
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58004654A JPS59129281A (ja) | 1983-01-14 | 1983-01-14 | マイクロカプセル型接着剤 |
JP4654 | 1983-01-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR840007247A KR840007247A (ko) | 1984-12-06 |
KR870000700B1 true KR870000700B1 (ko) | 1987-04-07 |
Family
ID=11589930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019840000129A Expired KR870000700B1 (ko) | 1983-01-14 | 1984-01-13 | 마이크로캡슈울을 함유하는 접착제 |
Country Status (10)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100381370B1 (ko) * | 2000-04-26 | 2003-04-23 | 박수민 | 마이크로 캡슐의 제조방법 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0721082B2 (ja) * | 1985-06-07 | 1995-03-08 | 三井東圧化学株式会社 | 合板の製造方法 |
IE852919L (en) * | 1985-11-21 | 1987-05-21 | Loctite Ireland Ltd | Activation of adhesive compositions |
IT1247482B (it) * | 1991-03-20 | 1994-12-17 | O Augustin Aldo Agostini | Procedimento per microincapsulare un adesivo insolubile in acqua in involucri di materiale polimerico |
EP0785243A3 (en) * | 1996-01-18 | 1998-06-03 | Loctite (Ireland) Limited | A method of sealing two abutting surfaces in face-to-face contact |
AT411374B (de) * | 2000-06-06 | 2003-12-29 | Kaindl M | Belag, verkleidung od.dgl., paneele für dessen bildung sowie verfahren und gerät zur herstellung der paneele |
EP1229181B1 (de) * | 2001-02-02 | 2005-10-26 | Fritz Egger GmbH & Co | Bauteil sowie Verfahren zur Herstellung eines solchen Bauteils |
DE50100214D1 (de) * | 2001-02-02 | 2003-06-05 | Fritz Egger Gmbh & Co Unterrad | Verbindung zwischen Fügeflächen von zwei Paneelen eines Fussbodenbelages |
GB0515329D0 (en) * | 2005-07-27 | 2005-08-31 | Novel Polymer Solutions Ltd | Methods of forming a barrier |
DE102006025877B4 (de) * | 2006-06-02 | 2013-01-03 | Carl Meiser Gmbh & Co. Kg | Verfahren zum Beschichten eines flächigen, flexiblen Substrats |
CN101605526B (zh) * | 2007-02-13 | 2015-03-25 | 奇华顿股份有限公司 | 微胶囊 |
US7976670B2 (en) | 2007-05-07 | 2011-07-12 | Appleton Papers Inc. | Surface insensitive anaerobic adhesive and sealant compositions |
WO2016000912A1 (en) * | 2014-06-30 | 2016-01-07 | Unilever N.V. | Benefit agent delivery particle and composition comprising the particle |
JP7415359B2 (ja) * | 2019-07-31 | 2024-01-17 | 株式会社デンソー | 硬化性組成物、接着構造体及び封止構造体 |
CN112322253B (zh) * | 2020-11-11 | 2022-09-16 | 南京清尚新材料科技有限公司 | 低表面粘性的压敏胶黏剂及其和功能胶带的制备方法 |
CN114921154B (zh) * | 2022-07-21 | 2022-10-28 | 吉林华顾时代新型材料科技有限公司 | 一种用于制动盘的隔热防腐涂料及制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE366378B (enrdf_load_stackoverflow) * | 1967-05-15 | 1974-04-22 | Minnesota Mining & Mfg | |
US3826756A (en) * | 1972-02-22 | 1974-07-30 | Loctite Corp | Process for preparing discrete particles of microencapsulated liquid anaerobic compositions |
IE37450B1 (en) * | 1972-03-29 | 1977-07-20 | Farthingham Dev Ltd | Self-adhesive stamp |
DE2536319C3 (de) * | 1975-08-14 | 1981-11-19 | Rudolf 8019 Moosach Hinterwaldner | Härtbare Masse und Verfahren zu deren Härtung |
JPS6023859B2 (ja) * | 1978-11-14 | 1985-06-10 | 神崎製紙株式会社 | マイクロカプセルの製造方法 |
JPS56121628A (en) * | 1980-02-28 | 1981-09-24 | Mitsubishi Paper Mills Ltd | Advanced microcapsule |
JPS5756293A (en) * | 1980-08-20 | 1982-04-03 | Kureha Chem Ind Co Ltd | Manufacture of miniature capsule for pressure sensitive recording sheet |
CA1217294A (en) * | 1981-04-21 | 1987-01-27 | Ronald L. Hart | Microencapsulated epoxy adhesive system |
-
1983
- 1983-01-14 JP JP58004654A patent/JPS59129281A/ja active Granted
-
1984
- 1984-01-04 AU AU23074/84A patent/AU550246B2/en not_active Ceased
- 1984-01-12 DE DE3401056A patent/DE3401056C2/de not_active Expired
- 1984-01-12 CA CA000445200A patent/CA1236618A/en not_active Expired
- 1984-01-13 IT IT8419154A patent/IT1206123B/it active
- 1984-01-13 ES ES528860A patent/ES528860A0/es active Granted
- 1984-01-13 GB GB08400939A patent/GB2133374B/en not_active Expired
- 1984-01-13 BE BE0/212209A patent/BE898677A/fr unknown
- 1984-01-13 FR FR8400496A patent/FR2539326B1/fr not_active Expired
- 1984-01-13 KR KR1019840000129A patent/KR870000700B1/ko not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100381370B1 (ko) * | 2000-04-26 | 2003-04-23 | 박수민 | 마이크로 캡슐의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JPH0222775B2 (enrdf_load_stackoverflow) | 1990-05-21 |
FR2539326B1 (fr) | 1988-03-11 |
DE3401056A1 (de) | 1984-07-19 |
AU550246B2 (en) | 1986-03-13 |
FR2539326A1 (fr) | 1984-07-20 |
KR840007247A (ko) | 1984-12-06 |
ES8505397A1 (es) | 1985-05-16 |
DE3401056C2 (de) | 1986-06-26 |
GB2133374A (en) | 1984-07-25 |
JPS59129281A (ja) | 1984-07-25 |
ES528860A0 (es) | 1985-05-16 |
CA1236618A (en) | 1988-05-10 |
IT1206123B (it) | 1989-04-14 |
GB8400939D0 (en) | 1984-02-15 |
IT8419154A0 (it) | 1984-01-13 |
BE898677A (fr) | 1984-07-13 |
AU2307484A (en) | 1984-07-19 |
GB2133374B (en) | 1987-04-08 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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G160 | Decision to publish patent application | ||
PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
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E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
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Payment date: 19900326 Year of fee payment: 4 |
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LAPS | Lapse due to unpaid annual fee | ||
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St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 19910408 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 19910408 |
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P22-X000 | Classification modified |
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R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |