KR860002889A - 유연성 테이프 - Google Patents

유연성 테이프 Download PDF

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Publication number
KR860002889A
KR860002889A KR1019850006419A KR850006419A KR860002889A KR 860002889 A KR860002889 A KR 860002889A KR 1019850006419 A KR1019850006419 A KR 1019850006419A KR 850006419 A KR850006419 A KR 850006419A KR 860002889 A KR860002889 A KR 860002889A
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KR
South Korea
Prior art keywords
particles
flexible tape
stripe
coating
flexible
Prior art date
Application number
KR1019850006419A
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English (en)
Inventor
왈도 킹 티모시
Original Assignee
도날드 밀러 셀
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 도날드 밀러 셀, 미네소타 마이닝 앤드 매뉴팩츄어링 컴패니 filed Critical 도날드 밀러 셀
Publication of KR860002889A publication Critical patent/KR860002889A/ko

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00Cable fittings
    • H02G15/08Cable junctions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827Materials
    • H01L23/4828Conductive organic material or pastes, e.g. conductive adhesives, inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/052Magnetographic patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/90Magnetic feature
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/906Roll or coil
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256Heavy metal or aluminum or compound thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256Heavy metal or aluminum or compound thereof
    • Y10T428/257Iron oxide or aluminum oxide
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852Adhesive compositions
    • Y10T428/2857Adhesive compositions including metal or compound thereof or natural rubber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

내용 없음

Description

유연성 테이프
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명 테이프의 표면을 나타내는 도면.
제2도는 제1도의 라인 2-2를 잘라서 본 확대 단면도이다.

Claims (10)

  1. 교차하지 않는 일정한 순서의 패턴을 갖는 스트라이프내의 중합성 유전 매트릭스에 놓여 있는 전기 도입자기 함유된 층을 지닌 다중전기 연결물을 만들기 위한 유연성 테이프에 있어서, 개개의 입제는 철자기 심과 전기전도 표면을 지니며, 모든 입자의 최대 크기는 상기 층의 두께보다 작으며, 각 스트라이프의 입자는 스트라이프가 이것의 길이 및 두께위에서 전기적으로 전도 될 수 있도록 연속 배열식으로 서로다른 입자와 접촉하는 것을 특징으로 하는 유연성 테이프.
  2. 제1항에 있어서, 상기의 각 입자는 입자의 철자기심위에 전기 전도 코팅을 지니는 것을 특징으로 하는 유연성 테이프.
  3. 제2항에 있어서, 상기의 철자기심은 철인 것을 특징으로 하는 유연성 테이프.
  4. 제3항에 있어서, 상기의 코팅은 은을 포함하는 것을 특징으로 하는 유연성 테이프.
  5. 제1항에 있어서, 상기의 중합성 유전 매트릭스는 압감접착제인 것을 특징으로 하는 유연성 테이프.
  6. 제5항에 있어서, 상기의 층은 압감 접착 매트릭스와 접촉하는 낮은 접착 표면을 가진 캐리어 직물에 의해 보조되는 것을 특징으로 하는 유연성 테이프.
  7. 제1항에 있어서, 상기의 입자는 층의 2-5부피 %인 것을 특징으로 하는 유연성 테이프.
  8. (1)광중합성 모노머 및 입자의 혼합물로 유연성 캐리어 직물을 코팅시키는 데 이때 입자는 철자기심 과전기전도 표면을 각각 지니며, 모든 입자의 최대 크기는 코팅물의 최종두께 이하이어야 하며, (2)동시에 (a)서로 간격을 지닌 여러개의 자기장에 코팅물을 적용시키는데 이때 자기장은 스트라이프를 형성하기 위하여 입자들을 끌어당길 수 있을 만한 힘을 지니며, 각각의 스트라이프가 이것의 길이과 두께에서 전기적으로 전도성이 될 수 있도록 입자들은 연속배열 방식으로 서로 접촉하며, (b)중합성 유전 매트릭스내에 배열입자들을 고정시키기 위해 모노머를 광중합화시키고, (3) 테이프를 자기장으로 부터 떼어내는 단계들을 포함하는 것을 특징으로 하는 유연성 다중 연결테이프의 제조방법.
  9. 제8항에 있어서, 상기의 모노머는 상기 단계(2)에서 압감 접착 상태로 광중합화되는 것을 특징으로 하는 방법.
  10. 제8항에 있어서, 상기의 광중합성 모노머는 단계(1)전에 코팅할 수 있는 점도를 지니도록 부분적으로 중합화되는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850006419A 1984-09-04 1985-09-03 유연성 테이프 KR860002889A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/646,824 US4546037A (en) 1984-09-04 1984-09-04 Flexible tape having stripes of electrically conductive particles for making multiple connections
US646,824 1984-09-04

Publications (1)

Publication Number Publication Date
KR860002889A true KR860002889A (ko) 1986-04-30

Family

ID=24594624

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850006419A KR860002889A (ko) 1984-09-04 1985-09-03 유연성 테이프

Country Status (6)

Country Link
US (1) US4546037A (ko)
EP (1) EP0174776A3 (ko)
JP (1) JPS6166309A (ko)
KR (1) KR860002889A (ko)
AU (1) AU4508585A (ko)
BR (1) BR8504036A (ko)

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JP4947687B2 (ja) * 2006-01-19 2012-06-06 三井金属鉱業株式会社 異方導電性ゴム用導電性粉末
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Also Published As

Publication number Publication date
EP0174776A3 (en) 1986-08-13
EP0174776A2 (en) 1986-03-19
US4546037A (en) 1985-10-08
BR8504036A (pt) 1986-06-10
AU4508585A (en) 1986-03-13
JPS6166309A (ja) 1986-04-05

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