KR860002889A - 유연성 테이프 - Google Patents
유연성 테이프 Download PDFInfo
- Publication number
- KR860002889A KR860002889A KR1019850006419A KR850006419A KR860002889A KR 860002889 A KR860002889 A KR 860002889A KR 1019850006419 A KR1019850006419 A KR 1019850006419A KR 850006419 A KR850006419 A KR 850006419A KR 860002889 A KR860002889 A KR 860002889A
- Authority
- KR
- South Korea
- Prior art keywords
- particles
- flexible tape
- stripe
- coating
- flexible
- Prior art date
Links
- 239000002245 particle Substances 0.000 claims 11
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 239000011159 matrix material Substances 0.000 claims 4
- 239000000178 monomer Substances 0.000 claims 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 239000004744 fabric Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000012799 electrically-conductive coating Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G15/00—Cable fittings
- H02G15/08—Cable junctions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/90—Magnetic feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/906—Roll or coil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명 테이프의 표면을 나타내는 도면.
제2도는 제1도의 라인 2-2를 잘라서 본 확대 단면도이다.
Claims (10)
- 교차하지 않는 일정한 순서의 패턴을 갖는 스트라이프내의 중합성 유전 매트릭스에 놓여 있는 전기 도입자기 함유된 층을 지닌 다중전기 연결물을 만들기 위한 유연성 테이프에 있어서, 개개의 입제는 철자기 심과 전기전도 표면을 지니며, 모든 입자의 최대 크기는 상기 층의 두께보다 작으며, 각 스트라이프의 입자는 스트라이프가 이것의 길이 및 두께위에서 전기적으로 전도 될 수 있도록 연속 배열식으로 서로다른 입자와 접촉하는 것을 특징으로 하는 유연성 테이프.
- 제1항에 있어서, 상기의 각 입자는 입자의 철자기심위에 전기 전도 코팅을 지니는 것을 특징으로 하는 유연성 테이프.
- 제2항에 있어서, 상기의 철자기심은 철인 것을 특징으로 하는 유연성 테이프.
- 제3항에 있어서, 상기의 코팅은 은을 포함하는 것을 특징으로 하는 유연성 테이프.
- 제1항에 있어서, 상기의 중합성 유전 매트릭스는 압감접착제인 것을 특징으로 하는 유연성 테이프.
- 제5항에 있어서, 상기의 층은 압감 접착 매트릭스와 접촉하는 낮은 접착 표면을 가진 캐리어 직물에 의해 보조되는 것을 특징으로 하는 유연성 테이프.
- 제1항에 있어서, 상기의 입자는 층의 2-5부피 %인 것을 특징으로 하는 유연성 테이프.
- (1)광중합성 모노머 및 입자의 혼합물로 유연성 캐리어 직물을 코팅시키는 데 이때 입자는 철자기심 과전기전도 표면을 각각 지니며, 모든 입자의 최대 크기는 코팅물의 최종두께 이하이어야 하며, (2)동시에 (a)서로 간격을 지닌 여러개의 자기장에 코팅물을 적용시키는데 이때 자기장은 스트라이프를 형성하기 위하여 입자들을 끌어당길 수 있을 만한 힘을 지니며, 각각의 스트라이프가 이것의 길이과 두께에서 전기적으로 전도성이 될 수 있도록 입자들은 연속배열 방식으로 서로 접촉하며, (b)중합성 유전 매트릭스내에 배열입자들을 고정시키기 위해 모노머를 광중합화시키고, (3) 테이프를 자기장으로 부터 떼어내는 단계들을 포함하는 것을 특징으로 하는 유연성 다중 연결테이프의 제조방법.
- 제8항에 있어서, 상기의 모노머는 상기 단계(2)에서 압감 접착 상태로 광중합화되는 것을 특징으로 하는 방법.
- 제8항에 있어서, 상기의 광중합성 모노머는 단계(1)전에 코팅할 수 있는 점도를 지니도록 부분적으로 중합화되는 것을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/646,824 US4546037A (en) | 1984-09-04 | 1984-09-04 | Flexible tape having stripes of electrically conductive particles for making multiple connections |
US646,824 | 1984-09-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR860002889A true KR860002889A (ko) | 1986-04-30 |
Family
ID=24594624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019850006419A KR860002889A (ko) | 1984-09-04 | 1985-09-03 | 유연성 테이프 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4546037A (ko) |
EP (1) | EP0174776A3 (ko) |
JP (1) | JPS6166309A (ko) |
KR (1) | KR860002889A (ko) |
AU (1) | AU4508585A (ko) |
BR (1) | BR8504036A (ko) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
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AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
US4642421A (en) * | 1984-10-04 | 1987-02-10 | Amp Incorporated | Adhesive electrical interconnecting means |
US4640981A (en) * | 1984-10-04 | 1987-02-03 | Amp Incorporated | Electrical interconnection means |
US5045249A (en) * | 1986-12-04 | 1991-09-03 | At&T Bell Laboratories | Electrical interconnection by a composite medium |
US4838347A (en) * | 1987-07-02 | 1989-06-13 | American Telephone And Telegraph Company At&T Bell Laboratories | Thermal conductor assembly |
US4960612A (en) * | 1987-07-02 | 1990-10-02 | At&T Bell Laboratories | Thermal conductor assembly method |
US4923739A (en) * | 1987-07-30 | 1990-05-08 | American Telephone And Telegraph Company | Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method |
JPH01206575A (ja) * | 1988-02-15 | 1989-08-18 | Shin Etsu Polymer Co Ltd | 接着性熱融着形コネクタ |
AU612771B2 (en) * | 1988-02-26 | 1991-07-18 | Minnesota Mining And Manufacturing Company | Electrically conductive pressure-sensitive adhesive tape |
US4880599A (en) * | 1988-03-25 | 1989-11-14 | General Electric Company | Method of making a ferrite composite containing silver metallization |
US5246771A (en) * | 1988-04-18 | 1993-09-21 | Teraoka Seisakusho Co., Ltd. | Adhesive tape for preventing implosion and removing electrostatic charge |
TW226406B (ko) * | 1991-04-12 | 1994-07-11 | Minnesota Mining & Mfg | |
US5087494A (en) * | 1991-04-12 | 1992-02-11 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
US5275856A (en) * | 1991-11-12 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
US5221417A (en) * | 1992-02-20 | 1993-06-22 | At&T Bell Laboratories | Conductive adhesive film techniques |
US5429701A (en) * | 1992-04-14 | 1995-07-04 | Industrial Technology Research Institute | Method of electrically interconnecting conductors |
US5453148A (en) * | 1992-04-14 | 1995-09-26 | Industrial Technology Research Institute | Adhesive for connecting a circuit member to a substrate |
EP0566764A1 (en) * | 1992-04-23 | 1993-10-27 | LEDA Logarithmic Electrical Devices for Automation S.r.l. | Electrical connector |
GB9211500D0 (en) * | 1992-05-30 | 1992-07-15 | First Class Securities | Pastes |
US5981053A (en) * | 1993-10-05 | 1999-11-09 | Sandia Corporation | Tamper resistant magnetic stripes |
US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
WO1997003143A1 (en) | 1995-07-10 | 1997-01-30 | Minnesota Mining And Manufacturing Company | Screen printable adhesive compositions |
JP3283226B2 (ja) * | 1997-12-26 | 2002-05-20 | ポリマテック株式会社 | ホルダーの製造法 |
JP3696429B2 (ja) * | 1999-02-22 | 2005-09-21 | 日本化学工業株式会社 | 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料 |
US6524675B1 (en) | 1999-05-13 | 2003-02-25 | 3M Innovative Properties Company | Adhesive-back articles |
US6387485B1 (en) * | 1999-08-12 | 2002-05-14 | Flexcon Company, Inc. | Composite substrate with adhesive and ferromagnetic properties |
US6450483B1 (en) | 2000-06-01 | 2002-09-17 | James T. Baum | Rodent guard system |
EP1315241A4 (en) * | 2000-08-09 | 2008-03-19 | Jsr Corp | ANISOTROPIC CONDUCTIVE FILM |
US20030059366A1 (en) * | 2001-09-21 | 2003-03-27 | Cabot Corporation | Dispersible barium titanate-based particles and methods of forming the same |
US20030215606A1 (en) * | 2002-05-17 | 2003-11-20 | Clancy Donald J. | Dispersible dielectric particles and methods of forming the same |
DE10323842B3 (de) * | 2003-05-23 | 2005-01-20 | Micronas Holding Gmbh | Verfahren zum Herstellen einer Chipanordnung und Lack mit ferromagnetischen Partikeln |
JP4532234B2 (ja) * | 2004-10-22 | 2010-08-25 | Smk株式会社 | コネクタ |
KR100608533B1 (ko) * | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
JP4947687B2 (ja) * | 2006-01-19 | 2012-06-06 | 三井金属鉱業株式会社 | 異方導電性ゴム用導電性粉末 |
US8623265B2 (en) * | 2007-02-06 | 2014-01-07 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
US7875345B1 (en) * | 2007-02-06 | 2011-01-25 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and uses thereof |
US20090226696A1 (en) * | 2008-02-06 | 2009-09-10 | World Properties, Inc. | Conductive Polymer Foams, Method of Manufacture, And Uses Thereof |
KR20120125614A (ko) * | 2009-12-29 | 2012-11-16 | 로저스코포레이션 | 전도성 중합체 발포체, 그의 제조 방법 및 용도 |
US8816807B2 (en) * | 2010-05-21 | 2014-08-26 | Purdue Research Foundation | Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles |
WO2018092798A1 (ja) * | 2016-11-18 | 2018-05-24 | 矢崎総業株式会社 | 回路体形成方法及び回路体 |
US20200367358A1 (en) | 2019-05-13 | 2020-11-19 | Honeywell Federal Manufacturing & Technologies, Llc | Conductive trace interconnection tape |
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JPS5785873A (en) * | 1980-11-14 | 1982-05-28 | Matsushita Electric Ind Co Ltd | Production of anisotropic electrically conductive adhesive |
JPS58152033A (ja) * | 1982-03-04 | 1983-09-09 | Japan Synthetic Rubber Co Ltd | 異方導電性ゴムシ−ト |
US4448837A (en) * | 1982-07-19 | 1984-05-15 | Oki Densen Kabushiki Kaisha | Pressure-sensitive conductive elastic sheet |
-
1984
- 1984-09-04 US US06/646,824 patent/US4546037A/en not_active Expired - Fee Related
-
1985
- 1985-07-17 AU AU45085/85A patent/AU4508585A/en not_active Abandoned
- 1985-07-30 JP JP60168486A patent/JPS6166309A/ja active Pending
- 1985-08-23 BR BR8504036A patent/BR8504036A/pt unknown
- 1985-08-29 EP EP85306122A patent/EP0174776A3/en not_active Withdrawn
- 1985-09-03 KR KR1019850006419A patent/KR860002889A/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0174776A3 (en) | 1986-08-13 |
EP0174776A2 (en) | 1986-03-19 |
US4546037A (en) | 1985-10-08 |
BR8504036A (pt) | 1986-06-10 |
AU4508585A (en) | 1986-03-13 |
JPS6166309A (ja) | 1986-04-05 |
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Legal Events
Date | Code | Title | Description |
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SUBM | Surrender of laid-open application requested |