KR860000342A - 고분자 감온체 - Google Patents
고분자 감온체 Download PDFInfo
- Publication number
- KR860000342A KR860000342A KR1019850004232A KR850004232A KR860000342A KR 860000342 A KR860000342 A KR 860000342A KR 1019850004232 A KR1019850004232 A KR 1019850004232A KR 850004232 A KR850004232 A KR 850004232A KR 860000342 A KR860000342 A KR 860000342A
- Authority
- KR
- South Korea
- Prior art keywords
- polymer
- component
- thermal element
- aldehyde
- acid ester
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/049—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of organic or organo-metal substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/926—Polyamide containing a plurality of oxyalkylene groups
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 폴리아미드와 N-치환아미드성분을 함유한 폴리아미드의 비율을 변경했을때의 페놀계축중합체의 비율을 변경했을때의 조성물의 30℃에서의 체적고유 임피이던스를 나타내는 그래프.
제3도는 폴리아미드와 N-치환아미드 성분을 함유한 폴리아미드로 이루어진 고분자 매트릭스에, 페놀계수지를 첨가하고 또 페놀계올리고머를 첨가했을때의 체전고유 임피이던스의 온도특성의 변화를 나타내는 그래프.
Claims (13)
- N-알킬치환아미드 성분 또는 에텔아미드성분을 포함한 폴리아미드를 함유한 고분자 메트릭스속에 페놀계 화합물의 알데히드축 중합체를 첨가하여 이루어지는 고분자 감온체.
- 제1항에 있어서, 폴리아미드가, 운데칸아미드 또는 도데칸아미드 성분을 함유하고 있는 고분자 감온체.
- 제1항 또는 제2항에 있어서, 에텔아미드 성분의 알킬렌옥시가 종합체인 고분자 감온체.
- 제3항에 있어서, 알킬렌옥시 종합체가 폴리(에틸렌옥시), 폴리(프로필렌옥시), 폴리(부틸렌옥시)로부터 선택된 적어도 1가지인 고분자 감온체.
- 제1항에서부터 제4항의 어느 것인가에 있어서, 고분자 메트릭스가, N-알킬치환아미드 성분 또는 에텔아미드성분을 함유한 폴리아미드와 폴리운데칸아비드 또는 폴리도데칸 아미드와의 혼련물로 이루어지는 고분자 감온체.
- 제1항에 있어서, 페놀계 화합물이, 옥시안식향산에스텔, 알킬페놀, 할로겐화페놀으로부터 선택된 적어도 1가지인 고분자 감온체.
- 제6항에 있어서, 옥시안식향산에스텔이, p-옥시안식향산에스텔이고, 알데히드가 포리알데히드인 고분자 감온체.
- 제1항에서부터 제7항의 어느것인가에 있어서, 페놀계 화합물의 알데히드축 중합체가 고분자 메트릭스 100중량부에 대하여 5~30중량부 첨가된 고분자 감온체.
- 제5항에서부터 제8항의 어느 것인가에 있어서, 고분자 메트릭스가, 폴리운데칸아미드 혹은 폴리도데칸아미드 0~8%와 N-알킬치환아미드 성분 또는 에텔아미드 성분을 함유한 폴리아미드 100~20%로 이루어지고, 페놀계 화합물의 알데히드축 중합체가 중합도 @10 의 축중합체 A와 중합도 @ 10 의 축중합체 B로 이루어지고, B/A = 0~5 의 범위에서 첨가된 고분자 감온체.
- 제9항에 있어서, 축 중합체 A가, 알킬페놀 알데히드축 중합체인 고분자 감온체.
- 제10항에 있어서, 알킬페놀의 알킬기가, 탄소수 4~12의 알킬기인 고분자 감온체.
- 제9항에서부터 제11항의 어느것인가에 있어서, 축중합체가 B가 옥시안식향산에스텔 알데히드축 중합체인 고분자 감온체.
- 제12항에 있어서, 옥시안식향산에스텔의 알킬기가, 탄소수 6~18의 알킬기인 고분자 감온체.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12304784A JPH0247086B2 (ja) | 1984-06-15 | 1984-06-15 | Kobunshikanontai |
JP12304684A JPH0247085B2 (ja) | 1984-06-15 | 1984-06-15 | Kobunshikanontai |
JP59-123046 | 1984-06-15 | ||
JP123047 | 1984-06-15 | ||
JP21950384A JPH0247087B2 (ja) | 1984-10-19 | 1984-10-19 | Kobunshikanontai |
JP219503 | 1984-10-19 | ||
JP123046 | 1988-09-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860000342A true KR860000342A (ko) | 1986-01-28 |
KR890003442B1 KR890003442B1 (ko) | 1989-09-21 |
Family
ID=27314618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019850004232A KR890003442B1 (ko) | 1984-06-15 | 1985-06-15 | 고분자 감온체 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4617356A (ko) |
KR (1) | KR890003442B1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5492980A (en) * | 1992-10-12 | 1996-02-20 | Kishimoto Sangyo Co., Ltd. | Thermoplastic molding resin composition |
JP3037525B2 (ja) * | 1993-04-12 | 2000-04-24 | 松下電器産業株式会社 | 発熱シート |
US5443867A (en) * | 1993-10-25 | 1995-08-22 | E. I. Du Pont De Nemours And Company | Articles incorporating barrier resins |
MY120047A (en) * | 1997-06-30 | 2005-08-30 | Kisco Ltd | Polyamide resin composition |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3901952A (en) * | 1971-12-14 | 1975-08-26 | Matsushita Electric Ind Co Ltd | Polymeric thermo-detective material |
US3899462A (en) * | 1974-03-29 | 1975-08-12 | Gen Motors Corp | Reinforced polyamide molding composition |
JPS5522013B2 (ko) * | 1974-09-11 | 1980-06-13 | ||
JPS5141237A (en) * | 1974-10-05 | 1976-04-07 | Yasuro Ito | Satsushumataha wakutaishusokunitaisuru suikoseibutsushitsukonrenbutsuno chunyusochi |
JPS53117A (en) * | 1976-06-24 | 1978-01-05 | Mitsubishi Paper Mills Ltd | Photographic paper support |
JPS6019516B2 (ja) * | 1977-08-31 | 1985-05-16 | カシオ計算機株式会社 | 画面編集方式 |
JPS55128203A (en) * | 1979-03-28 | 1980-10-03 | Daicel Ltd | High molecular heat sensitive material |
JPS55145757A (en) * | 1979-05-02 | 1980-11-13 | Daicel Chem Ind Ltd | High-molecular heat-sensitive material |
JPS55145756A (en) * | 1979-05-02 | 1980-11-13 | Daicel Chem Ind Ltd | High-molecular heat-sensitive material |
DE3029744A1 (de) * | 1980-08-06 | 1982-03-11 | Basf Ag, 6700 Ludwigshafen | Desublimator fuer die gewinnung von sublimationsprodukten aus reaktionsgasen |
JPS57206001A (en) * | 1981-06-15 | 1982-12-17 | Toray Industries | Heat sensitive element |
JPS58136624A (ja) * | 1982-02-08 | 1983-08-13 | Toray Ind Inc | 感熱性素子 |
-
1985
- 1985-06-13 US US06/744,196 patent/US4617356A/en not_active Expired - Lifetime
- 1985-06-15 KR KR1019850004232A patent/KR890003442B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR890003442B1 (ko) | 1989-09-21 |
US4617356A (en) | 1986-10-14 |
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