KR840007448A - 음극 스퍼터링용 타아게트 및 그 제조방법 - Google Patents
음극 스퍼터링용 타아게트 및 그 제조방법 Download PDFInfo
- Publication number
- KR840007448A KR840007448A KR1019830006335A KR830006335A KR840007448A KR 840007448 A KR840007448 A KR 840007448A KR 1019830006335 A KR1019830006335 A KR 1019830006335A KR 830006335 A KR830006335 A KR 830006335A KR 840007448 A KR840007448 A KR 840007448A
- Authority
- KR
- South Korea
- Prior art keywords
- oxide
- compression molding
- target
- cathode sputtering
- temperature
- Prior art date
Links
- 238000004544 sputter deposition Methods 0.000 title claims 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims 6
- 238000000748 compression moulding Methods 0.000 claims 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 229910003437 indium oxide Inorganic materials 0.000 claims 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- 239000011224 oxide ceramic Substances 0.000 claims 2
- 229910052574 oxide ceramic Inorganic materials 0.000 claims 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 2
- 229910001887 tin oxide Inorganic materials 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000003575 carbonaceous material Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Physical Vapour Deposition (AREA)
- Medicines Containing Plant Substances (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Conductive Materials (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (8)
- 자성적으로 증강된 음극 스퍼터링에 사용되고, 핫프레스된 인듐 산화물/주석 산화물의 혼합물을 주성분으로하고, 밀도가 이론 밀도의 적어도 75%이고 이들이 비저항 0.6~0.1Ωcm에 상응하는 전기전도도를 갖는 양론적 금속 조성물에 필적할 만한 산소함량으로 감소됨을 특징으로 하는 산화물-세라믹 타아게트.
- 자성적으로 증강된 음극 스퍼터링에 사용되고, 핫프레스된인듐 산화물/주석 산화물의 혼합물을 주성분으로 하고, 밀도가 이론밀도의 적어도 75%가 될 정도로 금속 산화혼합물을 850~1000℃로 50~600kg/㎠ 압력하의 감압대기에서 압축 성형시킴을 특징으로 하는 산화물-세라믹 타아게트를 제조하는 방법.
- 제2항에 있어서, 온도를 900~920℃, 압력을 100kg/㎠로 유지시킴을 특징으로 하는 방법.
- 제2항 또는 제3항에 있어서, 압축 성형이 흑연 성형부에서 일어남을 특징으로 하는 방법.
- 제2항내지 제4항중 어느 한 항에 있어서, 압축 성형온도에서 탄소를 발생하는 탄소나 유기물질이 성형 프레스에 존재하고 있음을 특징으로 하는 방법.
- 제2항 내지 제5항중 어느 한 항에 있어서, 압축 성형전에 주석 및/또는 인듐 분말이 2중량%까지 금속 산화물분말에 가해짐을 특징으로 하는 방법.
- 제2항 내지 제6항중 어느 한 항에 있어서, 상기 타아게트가 비저항 0.6~1Ωcm에 상응하는 전기전도도를 갖는 것과 같은 방법으로 온도 및 압축 성형 지속 시간이 선택됨을 특징으로 하는 방법.
- ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19833300525 DE3300525A1 (de) | 1983-01-10 | 1983-01-10 | Targets fuer die kathodenzerstaeubung |
DEP3300525.7 | 1983-01-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR840007448A true KR840007448A (ko) | 1984-12-07 |
Family
ID=6187948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019830006335A KR840007448A (ko) | 1983-01-10 | 1983-12-30 | 음극 스퍼터링용 타아게트 및 그 제조방법 |
Country Status (8)
Country | Link |
---|---|
US (2) | US4647548A (ko) |
EP (1) | EP0115629B1 (ko) |
JP (1) | JPS59136480A (ko) |
KR (1) | KR840007448A (ko) |
AT (1) | ATE35002T1 (ko) |
CA (1) | CA1222217A (ko) |
DE (2) | DE3300525A1 (ko) |
FI (1) | FI76122C (ko) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3627775A1 (de) * | 1986-08-16 | 1988-02-18 | Demetron | Verfahren zur herstellung von targets |
JP2578815B2 (ja) * | 1987-07-08 | 1997-02-05 | 松下電器産業株式会社 | 直流スパッタリング法 |
US4895592A (en) * | 1987-12-14 | 1990-01-23 | Eastman Kodak Company | High purity sputtering target material and method for preparing high purity sputtering target materials |
US4824481A (en) * | 1988-01-11 | 1989-04-25 | Eaastman Kodak Company | Sputtering targets for magneto-optic films and a method for making |
JPH01290764A (ja) * | 1988-05-16 | 1989-11-22 | Tosoh Corp | 透明導電膜用スパッタリングターゲット |
EP0342537B1 (en) * | 1988-05-16 | 1995-09-06 | Tosoh Corporation | Process for the manufacture of a sputtering target for producing electroconductive transparent films |
JPH0668935B2 (ja) * | 1989-02-28 | 1994-08-31 | 東ソー株式会社 | 酸化物焼結体及びその製造方法並びにそれを用いたターゲット |
US5071800A (en) * | 1989-02-28 | 1991-12-10 | Tosoh Corporation | Oxide powder, sintered body, process for preparation thereof and targe composed thereof |
JPH0772346B2 (ja) * | 1989-03-03 | 1995-08-02 | 日本真空技術株式会社 | 低抵抗透明導電膜の製造方法 |
JPH0765167B2 (ja) * | 1989-07-13 | 1995-07-12 | 株式会社ジャパンエナジー | Ito透明導電膜用スパッタリングターゲット |
EP0421015B1 (en) * | 1989-10-06 | 1995-01-18 | Nihon Shinku Gijutsu Kabushiki Kaisha | Process for producing transparent conductive film |
JP2936276B2 (ja) * | 1990-02-27 | 1999-08-23 | 日本真空技術株式会社 | 透明導電膜の製造方法およびその製造装置 |
US5147688A (en) * | 1990-04-24 | 1992-09-15 | Cvd, Inc. | MOCVD of indium oxide and indium/tin oxide films on substrates |
DE4124471C1 (en) * | 1991-07-24 | 1992-06-11 | Degussa Ag, 6000 Frankfurt, De | Target for cathodic sputtering - produced from partially reduced mixtures of indium oxide and tin oxide by hot pressing in inert protective gas |
US5480531A (en) * | 1991-07-24 | 1996-01-02 | Degussa Aktiengesellschaft | Target for cathode sputtering and method of its production |
BE1007067A3 (nl) * | 1992-07-15 | 1995-03-07 | Emiel Vanderstraeten Besloten | Sputterkathode en werkwijze voor het vervaardigen van deze kathode. |
EP0584672B1 (en) * | 1992-08-19 | 1996-06-12 | Tosoh Corporation | Method of manufacturing an indium oxide powder useful as material of a high-density ITO sintered body |
US5433901A (en) * | 1993-02-11 | 1995-07-18 | Vesuvius Crucible Company | Method of manufacturing an ITO sintered body |
DE4407774C1 (de) * | 1994-03-09 | 1995-04-20 | Leybold Materials Gmbh | Target für die Kathodenzerstäubung zur Herstellung transparenter, leitfähiger Schichten und Verfahren zu seiner Herstellung |
DE4413344A1 (de) * | 1994-04-18 | 1995-10-19 | Leybold Materials Gmbh | Verfahren zur Herstellung teilreduzierter Indiumoxid-Zinnoxid Targets |
DE4413378A1 (de) * | 1994-04-19 | 1995-10-26 | Leybold Ag | Einrichtung zum Beschichten eines Substrats |
US5792327A (en) * | 1994-07-19 | 1998-08-11 | Corning Incorporated | Adhering metal to glass |
DE4427060C1 (de) * | 1994-07-29 | 1995-11-30 | Heraeus Gmbh W C | Bauteil aus Indium-Zinn-Oxid und Verfahren für seine Herstellung |
US6582641B1 (en) * | 1994-08-25 | 2003-06-24 | Praxair S.T. Technology, Inc. | Apparatus and method for making metal oxide sputtering targets |
US5656216A (en) * | 1994-08-25 | 1997-08-12 | Sony Corporation | Method for making metal oxide sputtering targets (barrier powder envelope) |
DE4438323C1 (de) * | 1994-10-27 | 1995-07-27 | Leybold Materials Gmbh | Verfahren zum Recyceln von abgesputterten Indiumoxid-Zinnoxid-Targets |
US5593082A (en) * | 1994-11-15 | 1997-01-14 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby |
WO1996015283A1 (en) * | 1994-11-15 | 1996-05-23 | Tosoh Smd, Inc. | Method of bonding targets to backing plate member |
US5522535A (en) * | 1994-11-15 | 1996-06-04 | Tosoh Smd, Inc. | Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies |
DE19508898A1 (de) | 1995-03-11 | 1996-09-12 | Leybold Materials Gmbh | Indiumoxid/Zinnoxid Sputtertarget für die Kathodenzerstäubung |
EP0761838B1 (de) * | 1995-08-18 | 2001-08-08 | W.C. Heraeus GmbH & Co. KG | Target für die Kathodenzerstäubung und Verfahren zur Herstellung eines solchen Targets |
DE19540379C1 (de) * | 1995-08-18 | 1996-09-26 | Heraeus Gmbh W C | Target für die Kathodenzerstäubung und Verfahren zur Herstellung eines solchen Targets |
JP3781878B2 (ja) * | 1996-10-04 | 2006-05-31 | 同和鉱業株式会社 | Ito焼結体およびitoスパッタリングターゲット |
GB2361245A (en) * | 2000-04-14 | 2001-10-17 | Jk Microtechnology Ltd | High conductivity indium-tin-oxide films |
US8278034B2 (en) | 2000-06-22 | 2012-10-02 | Nuclea Biotechnologies, Inc. | Methods of making frozen tissue microarrays |
US6924919B2 (en) | 2000-10-17 | 2005-08-02 | Ppg Industries Ohio, Inc. | Polymeric electrochromic devices |
KR101002504B1 (ko) * | 2001-08-02 | 2010-12-17 | 이데미쓰 고산 가부시키가이샤 | 스퍼터링 타겟, 투명 전도막 및 이들의 제조방법 |
JP4534417B2 (ja) * | 2002-12-13 | 2010-09-01 | ソニー株式会社 | スパッタターゲットの製造方法 |
CA2547091A1 (fr) * | 2006-05-18 | 2007-11-18 | Hydro Quebec | Procede de preparation de ceramiques, ceramiques ainsi obtenues et leurs utilisations notamment comme cible pour pulverisation cathodique |
ES2663895T3 (es) | 2006-05-18 | 2018-04-17 | Hydro-Quebec | Procedimiento de preparación de cerámicas, cerámicas obtenidas de este modo y sus utilizaciones concretamente como diana para pulverización catódica |
JP5580972B2 (ja) * | 2008-06-06 | 2014-08-27 | デクセリアルズ株式会社 | スパッタリング複合ターゲット |
CN109972099B (zh) * | 2019-05-10 | 2020-11-27 | 福建农林大学 | 一种制备片状氧化铁的方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3438885A (en) * | 1967-08-02 | 1969-04-15 | Northern Electric Co | Method of making ferrimagnetic films by cathodic sputtering |
US3749658A (en) * | 1970-01-02 | 1973-07-31 | Rca Corp | Method of fabricating transparent conductors |
GB1336559A (en) * | 1970-05-20 | 1973-11-07 | Triplex Safety Glass Co | Metal oxide coatings |
US3907660A (en) * | 1970-07-31 | 1975-09-23 | Ppg Industries Inc | Apparatus for coating glass |
US4025339A (en) * | 1974-01-18 | 1977-05-24 | Coulter Information Systems, Inc. | Electrophotographic film, method of making the same and photoconductive coating used therewith |
US4060426A (en) * | 1974-07-02 | 1977-11-29 | Polaroid Corporation | Tin indium oxide and polyvinylcarbazole layered polarized photovoltaic cell |
FR2371009A1 (fr) * | 1976-11-15 | 1978-06-09 | Commissariat Energie Atomique | Procede de controle du depot de couches par pulverisation reactive et dispositif de mise en oeuvre |
US4166784A (en) * | 1978-04-28 | 1979-09-04 | Applied Films Lab, Inc. | Feedback control for vacuum deposition apparatus |
CA1110421A (en) * | 1978-11-09 | 1981-10-13 | Horst E. Hirsch | Cadmium mercury telluride sputtering targets |
US4201649A (en) * | 1978-11-29 | 1980-05-06 | Ppg Industries, Inc. | Low resistance indium oxide coatings |
DE2930373A1 (de) * | 1979-07-26 | 1981-02-19 | Siemens Ag | Verfahren zum herstellen transparenter, elektrisch leitender indiumoxid (in tief 2 o tief 3 )-schichten |
DE3112104A1 (de) * | 1981-03-27 | 1982-10-07 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren und vorrichtung zum herstellen von elektrisch leitfaehigen transparenten oxidschichten |
-
1983
- 1983-01-10 DE DE19833300525 patent/DE3300525A1/de not_active Withdrawn
- 1983-12-24 DE DE8383113089T patent/DE3376986D1/de not_active Expired
- 1983-12-24 EP EP83113089A patent/EP0115629B1/de not_active Expired
- 1983-12-24 AT AT83113089T patent/ATE35002T1/de not_active IP Right Cessation
- 1983-12-30 KR KR1019830006335A patent/KR840007448A/ko not_active Application Discontinuation
-
1984
- 1984-01-09 CA CA000444931A patent/CA1222217A/en not_active Expired
- 1984-01-09 FI FI840072A patent/FI76122C/fi not_active IP Right Cessation
- 1984-01-10 US US06/569,696 patent/US4647548A/en not_active Expired - Fee Related
- 1984-01-10 JP JP59001418A patent/JPS59136480A/ja active Pending
-
1986
- 1986-11-25 US US06/934,978 patent/US4690745A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FI76122B (fi) | 1988-05-31 |
EP0115629A3 (en) | 1985-12-04 |
FI840072A (fi) | 1984-07-11 |
US4647548A (en) | 1987-03-03 |
ATE35002T1 (de) | 1988-06-15 |
DE3300525A1 (de) | 1984-07-12 |
EP0115629B1 (de) | 1988-06-08 |
DE3376986D1 (en) | 1988-07-14 |
CA1222217A (en) | 1987-05-26 |
FI840072A0 (fi) | 1984-01-09 |
EP0115629A2 (de) | 1984-08-15 |
FI76122C (fi) | 1988-09-09 |
JPS59136480A (ja) | 1984-08-06 |
US4690745A (en) | 1987-09-01 |
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