KR820002115B1 - Soft copper alloy conductors - Google Patents

Abstract

Soft copper alloy conductors(1) contain 5-200ppm Ca, and its surface (2), the remainder, is formed copper in nature, is melt-coated, to Sn Pb, and their alloy. If doing so, because the conductor is changed comparatively at low temp. & in a short time, by heating in a short time with melted coating and by temp. reduction of melted coating vessel, without need to soften coating and simultaneously softening of conductor is possible.

Description

Hot-dip Galvanized Conductor

The figure is sectional drawing which shows the Example of the plating conductor which concerns on this invention.

TECHNICAL FIELD This invention relates to the flue conductor which hot-plated tin, lead, or their alloy (solder, etc.).

In recent years, with the development of electronic devices, conductors, lead wires, etc., used for wiring inside and outside of these devices have been pre-plated with tin, lead, solder, etc. on the conductor surface in order to improve solder adhesion during wiring or assembly processing. Conductors are used a lot.

In these conductor materials, non-oxidizing linkages have been commonly used. In addition, these plating processes were performed by hot-dip plating or electroplating.

The hot dip plating method is a plating method suitable for the plating of the low melting point metal as described above. The reason for this is that plating can be performed at a high speed even with a relatively simple facility and a soft material is often required as a product, but in the case of a conductor having a relatively thin wire, it is a hard material. When the conductor passes through the hot-dip metal bath, the plating metal is coated on the surface and softened by the heat generated in the conductor at that time, so that a special softening step is often not required.

As a hot dip plating method, uniform and thick plating is difficult normally. For this reason, in the case of the hot-dip plating method, it is different from the case of the electroplating method. In general, plating is performed by immersing a conductor of a desired size in a hot-dip plating tank. Therefore, in industrial scale production, it must be passed at high speed to increase production efficiency, and at low speed, the conductor melts in the hot-dip metal bath to impair the properties of the plated metal, and an intermetallic compound is formed between the plated metal and the conductor. The inventors have empirically found that problems such as fragility occur.

In recent years, solder plating has increased, but since solder has a lower melting point than tin or lead, the energy is reduced, and molten solder is injected into the molten bath to prevent deterioration of metal properties. The temperature should be lower than the melting temperature of tin or lead. However, the softening of the center conductor does not reduce the temperature of the molten metal very much.

The present invention takes advantage of the fusion-plating method and reduces the conductivity of the conductor, and reduces the conductivity of the intermetallic compound between the plated metal and the conductor, compared to a conductor in which tin, lead, or solder is plated on a conventional copper oxide-free conductor. It is made in pursuit of the plating conductor which can be manufactured more easily without impairing the characteristic by growing a layer, etc., and softens a conductor in immersion of a plating tank by the short time heating or temperature drop of a molten metal bath as mentioned above. To provide a plating conductor that can be made. Therefore, in the conventional copper oxide-free conductor, the conductor diameter can be softened while the plating tank is immersed industrially, and the conductor diameter, which does not need to be softened in advance, is limited to a very thin wire that is sufficiently heated to the center in a short time. The present invention also makes it possible to increase the above limitation.

The present invention is a hot-dip plated conductor containing 5 to 200 ppm of calcium, the balance being hot-plated with tin, lead or their alloys on the surface of a copper alloy conductor consisting essentially of copper. In particular, the present invention is suitable for the manufacture of a hot-dip plating interlock having a 0.2% yield strength of 12 kg / mm 2 or less.

The figure is a sectional view showing an embodiment of a plated conductor according to the present invention, where (1) is a copper alloy conductor having the above-mentioned composition, and (2) is a tin, lead or alloy plating layer thereof hot-plated thereon. The plated conductor may have a cross section shown in the drawing in addition to a circular shape, and may be a line of another type such as a flat, ellipse, tape, or the like.

Since the copper alloy used in the present invention can alleviate the heating conditions required for softening, compared to conventional copper oxide or oxygen free copper, the conductor is softened in advance by hot-plating tin, lead or alloys thereof on the surface thereof. It is easy to soften by simply immersing it in a hot dip plating bath, and it is easy to obtain a flexible plated conductor by hot dip, even in the plating conditions which speed up as mentioned above, and the temperature conditions of the hot dip metal bath in which low temperature is desired, and a thicker The conductor of a wire diameter also has the effect of being able to eliminate the softening process before hot dip plating.

Moreover, compared with the case of using a conventional copper oxide, the electroconductivity can also obtain the plating conductor which is inferior.

In the present invention, the calcium content of the copper alloy is defined to be 5 to 200 ppm. When the calcium content is less than 5 ppm, it is almost impossible to alleviate the heating conditions for softening, compared to the usual copper oxide, and the short time to the hot dip plating bath. It is because it is not possible to expect the softening effect that is larger than copper oxide during immersion, and even if it is added more than 200ppm, the improvement of softening condition is less than that, and the conductivity is lowered or the equivalent is added by mistake. In this case, it is due to condensed milk, such as the case that it becomes difficult to soften upside down.

In addition, even if oxygen is contained in the range which does not exceed 400 ppm, it does not matter at all in the practice of this invention.

In addition, impurities which are generally easy to be mixed, such as Ag, Ni, Co, Fe, As, Pb, Sn, Bi, and Zn, are preferably as small as possible or not contained. However, when the total amount thereof is 300 ppm or less, it is acceptable.

In addition, since the alloy conductor in the present invention exhibits a remarkable effect of softening conditions as the cold workability increases in manufacturing, it is desirable to manufacture the alloy conductor so that the cold workability is 95% or more in the reduction ratio.

In addition, in the present invention, an alloy of tin and lead, which is a plated metal, refers to an alloy composed essentially of tin or lead, and even though alloying elements or impurity elements such as indium, antimony, bismuth, and cadmium are contained in the present invention, It doesn't matter.

In the present invention, when used as a tin or lead alloy plated metal, even if the temperature of the molten alloy is 250 ° or less including the melting point or more in the above composition, even if the immersion time is 0.5 seconds or less, It is possible to soften the conductor and is preferable in preventing deterioration of the plated metal.

Hereinafter, the present invention will be described in more detail with reference to Examples.

EXAMPLE

A typical electrical copper metal is melted at about 1150 ° C. under a charcoal coating as a reverberatory furnace, and then calcium is added and stirred in the form of a Cu-2% Ca alloy to quickly ingot 100 × 100 × 2000 mm. It casted semi-continuously in (iii).

The ingot was heated at about 850 ° C. for 1 hour, and then hot-rolled at the above temperature, and the drawn line was processed to 8 mm square.

Table 1 shows the composition of the comparative example prepared for comparison separately from the copper alloy used in the present invention thus prepared.

TABLE 1

In the copper alloy used in the present invention shown in Table 1, the balance other than Ca is essentially Cu, but contains a small amount of other impurity elements.

The thus prepared 0.8 mm diameter tough conductor was subjected to hot dip tin plating under the conditions shown in Table 2.

TABLE 2

All of these plating conductors were tested by plating test by the ammonium persulfation method according to 8. (2) of JISC 3002.

Table 3 shows the results of measuring the apparent conductivity and mechanical properties of these plated conductors.

TABLE 3

In Table 3, the plated conductors according to the present invention do not conform to JISC 3152 standards as tin-plated interlocking wires, even though the wire diameter is not so thin and conventional methods do not soften them even if the plated conductors of the diameter are not softened. Can be.

Next, molten solder plating was performed on the 0.4 mm diameter hard conductor thus prepared under the conditions shown in Table 4.

TABLE 4

About these plating conductors, the plating test by the 8. (2) ammonium persulfide method of JISC 3002 was performed, and all were favorable. Table 5 shows the results of measuring the apparent conductivity and mechanical properties of these plated conductors.

TABLE 5

In Table 5, the plating conductor according to the present invention is not very high in the plating bath temperature, and in the plating conductor according to the conventional method, even if the elongation value specified in JISC 3152 can be obtained, the plating conductor according to JISC 3152 is not subjected to softening in advance. It can be seen that the prescribed characteristics are obtained.

As described above, the conductor of the present invention contains 5-200 ppm of calcium, and since the remainder is hot-plated with tin, lead or their alloys on the surface of the copper alloy conductor, which is essentially copper, Since it is easy to change in a short time, it does not need to soften in advance by heating for a short time by hot-dip plating or the fall of the temperature of a hot-dip plating tank, and it is possible to soften a conductor simultaneously with plating, and it is economical advantage.

The present invention can lower the temperature of the hot-dip plating bath, so that the dissolution rate of the conductor in the plating metal is slow, and the industrial metal can be used for a long time without deteriorating or changing the properties of the plating metal.

Claims (1)

A hot-dip galvanizing conductor comprising 5 to 200 ppm of calcium, and the balance of the copper alloy conductor consisting of copper, tin, lead or alloys thereof on the surface of the copper alloy conductor.

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