KR20260016521A - 기판 처리 방법 및 기판 처리 시스템 - Google Patents

기판 처리 방법 및 기판 처리 시스템

Info

Publication number
KR20260016521A
KR20260016521A KR1020257042685A KR20257042685A KR20260016521A KR 20260016521 A KR20260016521 A KR 20260016521A KR 1020257042685 A KR1020257042685 A KR 1020257042685A KR 20257042685 A KR20257042685 A KR 20257042685A KR 20260016521 A KR20260016521 A KR 20260016521A
Authority
KR
South Korea
Prior art keywords
region
substrate
main
peripheral
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257042685A
Other languages
English (en)
Korean (ko)
Inventor
요헤이 야마시타
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20260016521A publication Critical patent/KR20260016521A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H10P54/30—Cutting or separating of wafers, substrates or parts of devices by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020257042685A 2023-05-30 2024-05-16 기판 처리 방법 및 기판 처리 시스템 Pending KR20260016521A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023088500 2023-05-30
JPJP-P-2023-088500 2023-05-30
PCT/JP2024/018100 WO2024247740A1 (ja) 2023-05-30 2024-05-16 基板処理方法及び基板処理システム

Publications (1)

Publication Number Publication Date
KR20260016521A true KR20260016521A (ko) 2026-02-03

Family

ID=93657794

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257042685A Pending KR20260016521A (ko) 2023-05-30 2024-05-16 기판 처리 방법 및 기판 처리 시스템

Country Status (5)

Country Link
JP (1) JPWO2024247740A1 (https=)
KR (1) KR20260016521A (https=)
CN (1) CN121127950A (https=)
TW (1) TW202501600A (https=)
WO (1) WO2024247740A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022071480A (ja) 2020-10-28 2022-05-16 東京エレクトロン株式会社 処理方法及び処理システム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108231646A (zh) * 2016-12-13 2018-06-29 中芯国际集成电路制造(上海)有限公司 一种半导体器件的制造方法
CN118263105A (zh) * 2018-03-14 2024-06-28 东京毅力科创株式会社 基板处理系统、基板处理方法以及计算机存储介质
WO2020129732A1 (ja) * 2018-12-21 2020-06-25 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI855139B (zh) * 2019-10-28 2024-09-11 日商東京威力科創股份有限公司 基板處理方法及基板處理系統
KR102903522B1 (ko) * 2020-04-02 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
JP7608023B2 (ja) * 2021-04-19 2025-01-06 株式会社ディスコ 積層ウェーハの研削方法
JP7706273B2 (ja) * 2021-06-24 2025-07-11 東京エレクトロン株式会社 処理方法及び処理システム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022071480A (ja) 2020-10-28 2022-05-16 東京エレクトロン株式会社 処理方法及び処理システム

Also Published As

Publication number Publication date
WO2024247740A1 (ja) 2024-12-05
TW202501600A (zh) 2025-01-01
JPWO2024247740A1 (https=) 2024-12-05
CN121127950A (zh) 2025-12-12

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