TW202501600A - 基板處理方法及基板處理系統 - Google Patents

基板處理方法及基板處理系統 Download PDF

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Publication number
TW202501600A
TW202501600A TW113118833A TW113118833A TW202501600A TW 202501600 A TW202501600 A TW 202501600A TW 113118833 A TW113118833 A TW 113118833A TW 113118833 A TW113118833 A TW 113118833A TW 202501600 A TW202501600 A TW 202501600A
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TW
Taiwan
Prior art keywords
substrate
peripheral
area
peripheral modified
wafer
Prior art date
Application number
TW113118833A
Other languages
English (en)
Chinese (zh)
Inventor
山下陽平
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202501600A publication Critical patent/TW202501600A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H10P54/30—Cutting or separating of wafers, substrates or parts of devices by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW113118833A 2023-05-30 2024-05-22 基板處理方法及基板處理系統 TW202501600A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-088500 2023-05-30
JP2023088500 2023-05-30

Publications (1)

Publication Number Publication Date
TW202501600A true TW202501600A (zh) 2025-01-01

Family

ID=93657794

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113118833A TW202501600A (zh) 2023-05-30 2024-05-22 基板處理方法及基板處理系統

Country Status (5)

Country Link
JP (1) JPWO2024247740A1 (https=)
KR (1) KR20260016521A (https=)
CN (1) CN121127950A (https=)
TW (1) TW202501600A (https=)
WO (1) WO2024247740A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108231646A (zh) * 2016-12-13 2018-06-29 中芯国际集成电路制造(上海)有限公司 一种半导体器件的制造方法
CN118263105A (zh) * 2018-03-14 2024-06-28 东京毅力科创株式会社 基板处理系统、基板处理方法以及计算机存储介质
WO2020129732A1 (ja) * 2018-12-21 2020-06-25 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI855139B (zh) * 2019-10-28 2024-09-11 日商東京威力科創股份有限公司 基板處理方法及基板處理系統
KR102903522B1 (ko) * 2020-04-02 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
JP7550018B2 (ja) 2020-10-28 2024-09-12 東京エレクトロン株式会社 処理方法及び処理システム
JP7608023B2 (ja) * 2021-04-19 2025-01-06 株式会社ディスコ 積層ウェーハの研削方法
JP7706273B2 (ja) * 2021-06-24 2025-07-11 東京エレクトロン株式会社 処理方法及び処理システム

Also Published As

Publication number Publication date
WO2024247740A1 (ja) 2024-12-05
KR20260016521A (ko) 2026-02-03
JPWO2024247740A1 (https=) 2024-12-05
CN121127950A (zh) 2025-12-12

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