KR20250114308A - 적층 구조체, 그의 제조 방법, 경화물 및 전자 부품 - Google Patents

적층 구조체, 그의 제조 방법, 경화물 및 전자 부품

Info

Publication number
KR20250114308A
KR20250114308A KR1020257017205A KR20257017205A KR20250114308A KR 20250114308 A KR20250114308 A KR 20250114308A KR 1020257017205 A KR1020257017205 A KR 1020257017205A KR 20257017205 A KR20257017205 A KR 20257017205A KR 20250114308 A KR20250114308 A KR 20250114308A
Authority
KR
South Korea
Prior art keywords
resin layer
mass
laminated structure
resin
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257017205A
Other languages
English (en)
Korean (ko)
Inventor
요시토모 아오야마
유스케 나카
가즈타카 나카다
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20250114308A publication Critical patent/KR20250114308A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
KR1020257017205A 2022-10-24 2023-10-24 적층 구조체, 그의 제조 방법, 경화물 및 전자 부품 Pending KR20250114308A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022169932 2022-10-24
JPJP-P-2022-169932 2022-10-24
JP2023095020 2023-06-08
JPJP-P-2023-095020 2023-06-08
PCT/JP2023/038241 WO2024090394A1 (ja) 2022-10-24 2023-10-24 積層構造体、その製造方法、硬化物および電子部品

Publications (1)

Publication Number Publication Date
KR20250114308A true KR20250114308A (ko) 2025-07-29

Family

ID=90830944

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257017205A Pending KR20250114308A (ko) 2022-10-24 2023-10-24 적층 구조체, 그의 제조 방법, 경화물 및 전자 부품

Country Status (6)

Country Link
EP (1) EP4610048A1 (https=)
JP (1) JPWO2024090394A1 (https=)
KR (1) KR20250114308A (https=)
CN (1) CN120379837A (https=)
TW (1) TW202434008A (https=)
WO (1) WO2024090394A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014047318A (ja) 2012-09-03 2014-03-17 Ajinomoto Co Inc 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02261858A (ja) * 1989-03-31 1990-10-24 Unitika Ltd 耐衝撃性樹脂組成物
US20050159542A1 (en) * 2004-01-17 2005-07-21 General Electric Company Compositions useful as coatings, their preparation, and articles made therefrom
TWI620763B (zh) * 2017-04-27 2018-04-11 Taiwan Union Technology Corporation 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板
JP2020176239A (ja) * 2019-04-22 2020-10-29 帝人株式会社 エポキシ樹脂組成物、プリプレグ、プリプレグの製造方法、及び繊維強化複合材料の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014047318A (ja) 2012-09-03 2014-03-17 Ajinomoto Co Inc 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板

Also Published As

Publication number Publication date
CN120379837A (zh) 2025-07-25
EP4610048A1 (en) 2025-09-03
JPWO2024090394A1 (https=) 2024-05-02
WO2024090394A1 (ja) 2024-05-02
TW202434008A (zh) 2024-08-16

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)